Why is packaging the real bottleneck?
A finished wafer is not a shippable AI chip: packaging lines and stacked memory still run short. Which bottlenecks can be fixed.
Full answer in the deckIn semiconductors the shortage keeps moving. For AI parts the queue is no longer about etching wafers but about advanced packaging and memory, while the chips in cars run on a slower cycle of their own. It's a very difficult market, and the bottleneck is never where people expect. You want the real picture? Good. We have just updated this deck. Get it now.
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In semiconductors, the constraint moved from the fab to the packaging line, and a record quarter can sit alongside customers who cannot get parts. Hence the twelve sections that follow.
Six examples, out of 196 slides.
A finished wafer is not a shippable AI chip: packaging lines and stacked memory still run short. Which bottlenecks can be fixed.
Full answer in the deckFoundries serve their biggest customers first and memory makers sell HBM at record margins. Where everyone else ends up in line.
Full answer in the deckMonthly chip sales more than doubled in a year, much of it from memory prices. What the records say, and what they hide.
Full answer in the deckLogic chips took most of the startup money, and rounds of $100M or more nearly doubled. Where investors bet, and who pulled back.
Full answer in the deckMyth: subsidies brought chip factories home fast. US fabs take far longer to build than Asian ones. What reshoring changes.
Full answer in the deckA memory price crash, AI spending cuts, a Taiwan blockade: the scenarios that could end the boom, and how likely each one is.
Full answer in the deckIn semiconductors, the shortage keeps moving. For leading-edge AI parts, the queue is less about etching wafers and more about advanced packaging and memory, while the older chips used in cars and factories go through their own, slower cycle.
For a long time, the big strategic decision in the industry was where to build the next fab. Fabs still matter, and governments now pay to bring them home, but packaging, memory and export rules increasingly decide who gets parts and when.
If you’re building or investing in semiconductors, you need to know which new fabs will actually produce at volume, how export controls change where chips can be sold, and which equipment makers benefit from each shift. We built this deck to give you that picture quickly, without making you sit through every earnings call. And because this market can turn quickly, we’ll send you the updated version every quarter.
Weeks of reading, cross-checking and dead ends, already done. Here is what you can check for yourself on every page.
A 196+ slide PDF, downloadable right after checkout.
Founders, investors, operators and strategists who need a clear view of the market before they build, invest, partner or reposition.
The first one gives you 6 of the 12 sections. The complete deck gives you all 12, the next updates, and full access to our funding and startup databases.
Chips and the industry that makes them: logic, memory, analog, packaging and test, semiconductor equipment and design software. Finished electronics, cloud services and data center operators are out. The first section sets the scope out in full.
Yes, we have tracked every single deal, with all the available data: date, company, what it does, category, stage, deal size, HQ country and region, lead and strategic investors, founding year, etc. Email us and we'll send it to you.
Yes, we rank every company we follow, with revenue, valuation and multiple numbers, plus category and segment, so you can sort and compare instead of reading a list. Email us and we'll send it to you.
Yes. We update every deck each quarter. With the complete deck, just send us an email and we'll send you the next update, along with the latest version of both databases.
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A lot of people misread this market. The shortage moved from the fab to the packaging line, quietly. Here, you'll get the latest update, with the real numbers you need.
6 of the 12 sections
All 12 sections
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