What are the funding trends in semiconductors?
In our semiconductor industry deck, you will find everything you need to understand the market
SUMMARY
What are the funding trends in semiconductors? Semiconductor funding is surging in dollars in 2026, but the boom is concentrated in fewer companies and much larger rounds rather than a broad increase in startup financing.
We count 92 qualifying financings across 85 companies so far this year, down from 111 deals across 108 companies over the same stretch of 2025. Yet disclosed or conservatively measurable capital has climbed to at least $13.45 billion, almost four times last year's comparable total.
The median priced round has jumped from $22.25 million to $40 million, while the average has risen to $162.1 million. That gap tells the story: the market has developed a much thicker layer of very large financings.
Strip out rounds above $50 million and the boom disappears. Capital below that threshold is down about 35% year over year, while capital below $100 million is down roughly 17%.
This is not just one freak transaction. We count 33 current rounds above $100 million, versus eight last year, and the five largest deals actually represent a smaller share of total capital than they did in 2025 or 2024.
Logic has become the center of gravity. It represents 59 of 92 current deals and roughly $9.94 billion of capital, with a median round near $135 million as AI compute and interconnect companies absorb increasingly large checks.
Foundry funding is huge but much narrower. Rapidus alone accounts for roughly $2.64 billion of the $2.92 billion we classify under Foundry Services, so that category's apparent boom is mostly one strategically important manufacturing project rather than a broad startup wave.
Capital is also moving later. Series C, Growth Equity and other later-stage financings are taking a much larger share of activity, while first financings remain comparatively small: about $6.9 million at the median versus roughly $90 million for follow-on rounds.
The geography has shifted sharply. U.S. deal activity almost doubled in our dataset, Chinese deal activity fell heavily, Europe completed the same number of deals but with much larger checks, and Japan's capital total is dominated by Rapidus.
Strategic investors are more visible too. Corporate or other strategic investors appear in 42.4% of current deals, up from 29.7% last year, with much of that activity concentrated in AI logic, optics, connectivity and related infrastructure.
The cleanest description of the market today is a two-speed funding cycle: ordinary semiconductor financings remain competitive, while companies that look capable of removing real AI-infrastructure or manufacturing bottlenecks can raise extraordinary amounts of capital.
This market map, featured in our semiconductor industry deck, highlights top companies and startups in the semiconductor industry
All funding deals in the semiconductor industry over the last years
Below is the table listing all the deals. You can find our methodology at the end of this page.
If you want a deeper understanding of the market and its current dynamics, get our report covering the Semiconductor Industry.
| Company | Category | Date | Stage | Deal size | What they do | Region | Lead investors |
|---|---|---|---|---|---|---|---|
| Teram | Memory Semiconductors | September 2026 | Seed | $37M | Develops custom vertically integrated 3D SRAM memory chips for high-bandwidth AI inference. | North America | Primary Venture Partners; B Capital; Hyperion; SemiAnalysis Capital |
| Ayar Labs | Logic Semiconductors | September 2026 | Series D+ | $150M | Develops silicon-photonic optical engines that provide chip-to-chip optical connectivity for AI processors. | North America | Not disclosed |
| Positron AI | Logic Semiconductors | September 2026 | Series C | $875M | Designs memory-first AI inference processors and systems centered on its custom Asimov silicon. | North America | NEA; Atreides Management; Valor Equity Partners; Andra Capital; SemiAnalysis Capital; Jim Clark |
| SciSemi | Logic Semiconductors | September 2026 | Unknown | ≈$2,760,000 | Develops memory-safe processors implementing hardware-enforced CHERI security for critical computing systems. | Europe | Mercia Ventures; PXN Ventures |
| NanoCore | Logic Semiconductors | September 2026 | Series C | ≈$249,000,000 | Develops 3D compute-in-memory AI inference chips combining near-memory, SRAM-CIM and RISC-V processing. | Asia-Pacific | Not disclosed |
| Tenstorrent | Logic Semiconductors | September 2026 | Series D+ | $1.3B | Designs AI accelerator processors and RISC-V-based computing silicon for AI workloads. | North America | Not disclosed |
| Celero | Logic Semiconductors | September 2026 | Series C | $275M | Designs coherent DSP semiconductors for high-bandwidth optical connectivity in AI data centers. | North America | Atreides Management; Valor Equity Partners; CapitalG |
| S-Transistors | Logic Semiconductors | August 2026 | Seed | $3M | Develops superconducting-transistor integrated circuits for ultra-low-power cryogenic control and computing. | Europe | Lifeline Ventures |
| Celera Semiconductor | Analog Semiconductors | August 2026 | Series B | $30M | Supplies custom and standard analog integrated circuits, including power-management ICs, using AI-assisted design automation. | North America | Maverick Silicon |
| Quintessent | Analog Semiconductors | August 2026 | Series A | $40M | Develops quantum-dot semiconductor laser chips and integrated photonic components for AI data-center optical interconnects. | North America | Cycle Capital |
| iHW | Logic Semiconductors | August 2026 | Series A | $37.5M | Develops ultra-low-power AI processors using analog compute-in-memory architectures. | Asia-Pacific | Kolon Investment |
| Singular Photonics | Sensor Semiconductors | August 2026 | Seed | $2.2M | Designs fabless CMOS SPAD image-sensor chips for photon counting, timing and computational imaging. | Europe | ACF Investors |
| Etched | Logic Semiconductors | August 2026 | Unknown | $700M | Designs proprietary high-performance AI inference processors and the rack-scale systems built around them. | North America | Jane Street |
| Velaura | Logic Semiconductors | August 2026 | Series A | $110M | Develops ultra-low-power AI silicon architectures and chips for data-center and physical-AI computing. | North America | Seligman Ventures |
| OLIX | Logic Semiconductors | August 2026 | Series B | $312M | Develops specialized AI-inference silicon connected through low-latency optical interconnects for large-scale inference systems. | Europe | Not disclosed |
| Xsight Labs | Logic Semiconductors | July 2026 | Series D+ | >$200,000,000 | Develops fabless Ethernet switch silicon and data-processing units for hyperscale, edge and AI data-center networks. | Middle East | Fidelity Management & Research Company |
| Eliyan | Logic Semiconductors | July 2026 | Series C | $145M | Develops high-bandwidth semiconductor interconnect and chiplet-connectivity technologies for AI compute, memory and networking systems. | North America | Seligman Ventures |
| Etched | Logic Semiconductors | July 2026 | Series C | $300M | Develops purpose-built semiconductor accelerators optimized for transformer-model AI inference. | North America | Sequoia |
| TYLsemi | Logic Semiconductors | July 2026 | Unknown | $43M | Develops production-ready chiplets for connectivity, power delivery and memory used to build custom AI silicon. | North America | Matter Venture Partners |
| Stathera | Analog Semiconductors | June 2026 | Series B | $55M | Develops fabless MEMS-based silicon timing oscillators and synchronization devices for mobile, IoT and data-center systems. | North America | Maverick Silicon |
| OpenChip | Logic Semiconductors | June 2026 | Growth Equity | $132M | Designs and commercializes energy-efficient RISC-V processors and SoCs for AI and high-performance computing. | Europe | Not disclosed |
| Reed Semiconductor | Power Semiconductors | June 2026 | Series D+ | $100M | Designs fabless power-management semiconductors including controllers, smart power stages, eFuses and power modules for AI/HPC and other electronics. | North America | Not disclosed |
| ALP Semiconductor | Power Semiconductors | June 2026 | Unknown | $19.5M | Develops wide- and ultra-wide-bandgap semiconductor power switches for solid-state circuit breakers and high-voltage power distribution. | Europe | Yotta Capital |
| Xiver | Foundry Services | June 2026 | Growth Equity | $28.9M | Operates an independent MEMS wafer foundry providing process development, industrialization and volume manufacturing services. | Europe | Cees Meeuwis |
| GreatASIC | Logic Semiconductors | June 2026 | Unknown | $6.9M | Designs custom ASICs and AI SoCs for data-center, edge-AI and automotive applications under a fabless model. | Asia-Pacific | Vertex Ventures Southeast Asia & India |
| InnoSeis | Sensor Semiconductors | June 2026 | Seed | $6.9M | Develops ultra-sensitive, low-power MEMS inertial sensors for precision motion and vibration measurement. | Europe | FORWARD.one |
| Rapidus | Foundry Services | June 2026 | Growth Equity | $943M | Develops and manufactures leading-edge logic semiconductors through a domestic advanced-node foundry, initially targeting 2nm production. | Asia-Pacific | Not disclosed |
| Xcena | Logic Semiconductors | May 2026 | Series B | $135M | Develops computational-memory semiconductor devices combining pooled DDR memory with near-data processors for AI infrastructure. | Asia-Pacific | Atinum Investment; IMM Investment |
| Moffett AI | Logic Semiconductors | May 2026 | Series C | ≈$240,000,000 | Designs sparse-computing AI inference accelerator chips for data-center workloads. | Asia-Pacific | Not disclosed |
| C2i Semiconductors | Power Semiconductors | May 2026 | Series A | $1.7M | Develops integrated voltage-regulator and power-delivery semiconductor devices for AI data-center processors. | Asia-Pacific | Not disclosed |
| PhotonicX AI | Analog Semiconductors | May 2026 | Unknown | Not Disclosed | Develops optical-I/O chiplets, silicon-photonic chips and associated high-speed driver and TIA ICs for AI interconnects. | Asia-Pacific | Not disclosed |
| Cyient Semiconductors | Power Semiconductors | May 2026 | Growth Equity | $10M | Designs custom semiconductor products and application-specific standard products, with a focus including power and mixed-signal ICs. | Asia-Pacific | Not disclosed |
| Vifan Intelligence | Logic Semiconductors | May 2026 | Seed | Not Disclosed | Develops AI fusion processor chips intended to serve as the central compute “brain” for embodied robots. | Asia-Pacific | Zhongguancun Capital (中关村资本); Qihang Investment (启航投资) |
| Sicoya | Analog Semiconductors | May 2026 | Series B | Not Disclosed | Develops silicon-photonic and analog electrical ICs for high-speed optical interconnects. | Asia-Pacific | Not disclosed |
| KD Technologies | Analog Semiconductors | May 2026 | Growth Equity | ≈$2,200,000 | Designs automotive optical-networking transceiver and PHY ASICs for high-speed plastic optical-fiber communications. | Europe | Not disclosed |
| Fractile | Logic Semiconductors | May 2026 | Series B | $220M | Designs inference accelerator chips using in-memory and near-memory compute architectures for AI workloads. | Europe | Accel; Factorial Funds; Founders Fund |
| PhotonCore | Logic Semiconductors | May 2026 | Seed | Not Disclosed | Develops heterogeneous photonic-electronic AI compute chips combining metasurface photonic computing with electronic chiplets. | Asia-Pacific | 苏州芯阳基金; 驰星创投; 盛景嘉成 |
| SemiDrive | Logic Semiconductors | May 2026 | Series C | ≈$200,000,000 | Designs automotive-grade SoCs and microcontrollers for vehicle compute, cockpit, gateway and control applications. | Asia-Pacific | Suzhou Industrial Investment (苏产投) |
| Casimir | Power Semiconductors | May 2026 | Seed | $12M | Develops semiconductor chips intended to harvest ambient quantum-vacuum energy for electronic power applications. | North America | Scout Ventures |
| HRDWYR | Logic Semiconductors | May 2026 | Series A | $13M | Designs domain-specific and AI-native system-on-chip processors for high-performance computing applications. | Asia-Pacific | Ideaspring Capital |
| eyeo | Sensor Semiconductors | May 2026 | Series A | ≈$27,100,000 | Develops nanophotonic color-splitting image sensors intended to capture substantially more incoming light than conventional filtered sensors. | Europe | Innovation Industries |
| Legend Semiconductor | Analog Semiconductors | May 2026 | Series B | ≈$24,000,000 | Designs high-precision analog and mixed-signal signal-chain ICs including AFE, ADC and DAC products. | Asia-Pacific | Not disclosed |
| EVAS Intelligence | Logic Semiconductors | May 2026 | Growth Equity | Not Disclosed | Designs RISC-V-based AI accelerator chips for cloud and data-center computing. | Asia-Pacific | Not disclosed |
| Picocom | Logic Semiconductors | May 2026 | Series C | Not Disclosed | Designs programmable baseband SoCs for 5G, 5.5G, non-terrestrial and future wireless-network infrastructure. | Asia-Pacific | Not disclosed |
| FlexiIC | Logic Semiconductors | May 2026 | Seed | ≈$2,400,000 | Develops flexible thin-film integrated circuits for sensing, logic and communications applications. | Europe | Bullnet Capital |
| BigEndian Semiconductors | Logic Semiconductors | May 2026 | Unknown | $6M | Designs application-specific SoCs for surveillance, imaging, security and related embedded-compute markets. | Asia-Pacific | IAN Alpha Fund |
| Oritek | Logic Semiconductors | May 2026 | Series C | Not Disclosed | Designs system-level AI SoCs for automotive, industrial, robotics and AIoT applications. | Asia-Pacific | Not disclosed |
| Tsavorite SI | Logic Semiconductors | May 2026 | Unknown | $5M | Develops an integrated AI-processing semiconductor architecture combining CPU, GPU, memory and connectivity functions. | North America | Not disclosed |
| Reexen | Logic Semiconductors | May 2026 | Series C | Not Disclosed | Designs SRAM-based compute-in-memory AI processor chips and related mixed-signal semiconductor technology. | Asia-Pacific | Not disclosed |
| Mosaic SoC | Logic Semiconductors | April 2026 | Seed | $3.8M | Designs ultra-low-power perception processor chips for real-time spatial intelligence in wearables and mobile devices. | Europe | Founderful |
| OpenLight | Logic Semiconductors | April 2026 | Series A | $50M | Designs and manufactures heterogeneous silicon-photonic application-specific integrated circuits with integrated lasers, modulators, amplifiers and detectors. | North America | Matter Venture Partners |
| Point2 Technology | Analog Semiconductors | April 2026 | Series B | $31.4M | Develops RF and mixed-signal interconnect SoCs for multi-terabit AI data-center cable connectivity. | North America | Maverick Silicon |
| Hyfix | Logic Semiconductors | April 2026 | Seed | $15M | Designs integrated SoCs combining flight control, positioning, communications and onboard compute for drones and autonomous robots. | North America | Craft Ventures |
| Neye | Logic Semiconductors | April 2026 | Series C | $80M | Develops single-chip optical circuit switches integrating silicon photonics, MEMS and CMOS for AI data-center interconnects. | North America | Sutter Hill Ventures |
| CIX Technology | Logic Semiconductors | March 2026 | Series B | ≈$245,000,000 | Designs Arm-based general-purpose and AI-capable CPU chips for PCs, edge systems and intelligent terminals. | Asia-Pacific | Shanghai IC Fund; Pudong Venture Capital |
| Rebellions | Logic Semiconductors | March 2026 | Growth Equity | $400M | Designs AI inference accelerator semiconductors and related chip platforms. | Asia-Pacific | Mirae Asset Financial Group; Korea National Growth Fund |
| Anabatic Semiconductor | Analog Semiconductors | March 2026 | Unknown | ≈$20,000,000 | Develops analog-front-end and related battery-management semiconductor ICs for EV and energy-storage batteries. | Asia-Pacific | Not disclosed |
| Anabatic Semiconductor | Analog Semiconductors | March 2026 | Series B | ≈$20,300,000 | Develops analog-front-end and related battery-management semiconductor ICs for EV and energy-storage batteries. | Asia-Pacific | Not disclosed |
| Epic Microelectronics | Power Semiconductors | March 2026 | Series A | $21M | Develops semiconductor-based vertical power-delivery technology for high-power AI processors. | North America | Seligman Ventures |
| Kandou | Logic Semiconductors | March 2026 | Series A | $225M | Designs and sells high-speed semiconductor retimers, switches and chip-to-chip interconnect products for AI and other computing systems. | Europe | Maverick Silicon |
| SPARK Microsystems | Analog Semiconductors | March 2026 | Series B | ≈$22,400,000 | Designs fabless ultra-low-power UWB wireless transceiver chips for real-time device connectivity. | North America | Idealist Capital; Real Ventures |
| RongSemi | Foundry Services | March 2026 | Series A | ≈$252,000,000 | Manufactures 12-inch semiconductor wafers using mature and specialty process technologies. | Asia-Pacific | Not disclosed |
| AlpsenTek | Sensor Semiconductors | March 2026 | Series B | Not Disclosed | Develops hybrid-vision image sensor chips combining conventional imaging with event-based sensing. | Asia-Pacific | Not disclosed |
| Agnit Semiconductors | Analog Semiconductors | March 2026 | Seed | $2.6M | Develops and manufactures GaN semiconductor devices, initially focused on RF chips and expanding into power devices. | Asia-Pacific | Shastra VC |
| GreatSky AI | Logic Semiconductors | March 2026 | Seed | $14M | Develops superconducting optoelectronic computing chips designed for highly energy-efficient AI processing. | North America | Bison Ventures |
| Lenzo | Logic Semiconductors | March 2026 | Seed | ≈$2,200,000 | Develops compute chips based on its Coarse-Grained Linear Array architecture for energy-efficient AI and blockchain workloads. | Asia-Pacific | Not disclosed |
| Xscape Photonics | Logic Semiconductors | March 2026 | Series A | $37M | Develops silicon-photonics chips and optical connectivity technology for AI data-center interconnects. | North America | Addition |
| Amber Semiconductor | Power Semiconductors | March 2026 | Series C | $30M | Develops fabless power-management semiconductors for vertical power delivery to high-performance AI processors. | North America | Not disclosed |
| Eridu AI | Logic Semiconductors | March 2026 | Series A | $200M | Develops high-radix AI data-center networking switch silicon and associated networking systems. | North America | Socratic Partners; John Doerr; Hudson River Trading; Capricorn Investment Group; Matter Venture Partners |
| Vertical Compute | Memory Semiconductors | March 2026 | Seed | ≈$22,900,000 | Develops vertically integrated high-density memory chips intended to reduce AI memory-bandwidth bottlenecks. | Europe | Quantonation |
| Ayar Labs | Logic Semiconductors | March 2026 | Series D+ | $500M | Develops silicon-photonics optical I/O chiplets for high-bandwidth, low-power AI accelerator interconnects. | North America | Neuberger Berman |
| Fangqing Technology | Logic Semiconductors | March 2026 | Unknown | ≈$245,100,000 | Develops AI computing chips for decoupled and distributed AI-compute architectures. | Asia-Pacific | Not disclosed |
| Leapers Semiconductor | Power Semiconductors | March 2026 | Unknown | ≈$24,500,000 | Develops and sells automotive and industrial SiC and IGBT power semiconductor modules. | Asia-Pacific | Not disclosed |
| Rapidus | Foundry Services | February 2026 | Growth Equity | $1.7B | Develops and plans to manufacture leading-edge logic semiconductors as a 2nm wafer-foundry provider. | Asia-Pacific | Not disclosed |
| Axelera AI | Logic Semiconductors | February 2026 | Series C | >$250,000,000 | Designs energy-efficient AI inference accelerator chips using digital in-memory computing for edge and data-center applications. | Europe | Innovation Industries |
| MatX | Logic Semiconductors | February 2026 | Series B | $500M | Designs custom AI accelerator processors optimized for large-language-model training and inference. | North America | Jane Street; Situational Awareness |
| OptoML | Logic Semiconductors | February 2026 | Seed | $1.8M | Designs fabless AI accelerator SoCs combining analog in-memory computing with high-bandwidth optical interconnects. | Asia-Pacific | Bluehill.VC; a99 |
| BOS Semiconductors | Logic Semiconductors | February 2026 | Series A | $60.2M | Designs fabless automotive SoCs and AI accelerator chiplets for ADAS, in-vehicle computing and gateway applications. | Asia-Pacific | Not disclosed |
| Taalas | Logic Semiconductors | February 2026 | Unknown | $169M | Develops model-specific AI inference chips that hard-wire neural-network parameters into silicon. | North America | Not disclosed |
| Efficient Computer | Logic Semiconductors | February 2026 | Series A | $60M | Develops ultra-low-power general-purpose processors based on a reconfigurable spatial-dataflow architecture. | North America | Triatomic Capital |
| Verve Semiconductor | Analog Semiconductors | February 2026 | Series A | $10M | Designs fabless analog and mixed-signal ICs including data converters, analog front ends and sensing/control chips. | Asia-Pacific | Ashish Kacholia; Unicorn India Ventures |
| C2i Semiconductors | Power Semiconductors | February 2026 | Series A | $15M | Develops power-management ICs, multiphase controllers and smart power stages for AI and high-performance computing systems. | Asia-Pacific | Peak XV Partners |
| OLIX | Logic Semiconductors | February 2026 | Series A | $220M | Develops optical-digital AI accelerator processors for high-performance inference. | Europe | Hummingbird Ventures |
| Positron AI | Logic Semiconductors | February 2026 | Series B | $230M | Develops memory-optimized AI inference accelerators and custom ASICs for large-transformer workloads. | North America | ARENA Private Wealth; Jump Trading; Unless |
| PrimeMas | Logic Semiconductors | January 2026 | Series B | $72M | Develops hub chiplets and SoCs that connect compute, memory and I/O for AI and data-center systems. | North America | Not disclosed |
| Neurophos | Logic Semiconductors | January 2026 | Series A | $110M | Develops integrated photonic optical processing chips for energy-efficient AI inference acceleration. | North America | Gates Frontier |
| Optalysys | Logic Semiconductors | January 2026 | Series A | ≈$21,100,000 | Develops silicon-photonic computing chips that combine data movement and processing for AI and secure-computing workloads. | Europe | Northern Gritstone |
| Sense Semiconductor | Analog Semiconductors | January 2026 | Seed | ≈$2,750,000 | Develops ultra-low-power mixed-signal and edge-AI SoCs combining analog processing, embedded AI and wireless connectivity. | Asia-Pacific | Piper Serica |
| Ethernovia | Logic Semiconductors | January 2026 | Series B | >$20,000,000 | Develops Ethernet packet-processor semiconductor chips for high-bandwidth networking in vehicles, robots and autonomous machines. | North America | Maverick Silicon |
| SpacemiT | Logic Semiconductors | January 2026 | Series B | >$26,000,000 | Develops and sells RISC-V-based CPU and AI processor chips for edge, robotics and computing systems. | Asia-Pacific | Not disclosed |
| Etched | Logic Semiconductors | January 2026 | Series B | ≈$200,000,000 | Develops Sohu, a transformer-specific ASIC designed for high-throughput AI inference. | North America | Stripes |
| Qualinx | Analog Semiconductors | January 2026 | Unknown | ≈$23,300,000 | Develops ultra-low-power digitally implemented GNSS and radio receiver chips for positioning and connectivity devices. | Europe | Invest-NL Deep Tech Fund; FORWARD.ONE; InnovationQuarter; Waterman Ventures |
| Netforward Technology | Logic Semiconductors | December 2025 | Series C | >$242,900,000 | Designs network-interconnect chips including Ethernet switch, PHY, NIC-controller and PCIe-switch devices. | Asia-Pacific | Not disclosed |
| TinyChip | Analog Semiconductors | December 2025 | Growth Equity | ≈$24,300,000 | Designs automotive mixed-signal MCU and SoC chips integrating signal-chain, sensing, power-management and control functions. | Asia-Pacific | Not disclosed |
| 芯微泰克 | Foundry Services | December 2025 | Unknown | >$2,400,000 | Provides specialty wafer-foundry and ultra-thin backside-processing services for advanced power semiconductor devices. | Asia-Pacific | Not disclosed |
| Mythic | Logic Semiconductors | December 2025 | Series D+ | $125M | Designs analog compute-in-memory AI accelerator chips and chiplets for edge and data-center inference. | North America | DCVC |
| NanoXplore | Logic Semiconductors | December 2025 | Growth Equity | ≈$23,500,000 | Designs radiation-hardened FPGA and SoC FPGA semiconductor devices for space, defense and avionics. | Europe | Not disclosed |
| 原集微 | Foundry Services | December 2025 | Seed | ≈$24,200,000 | Develops 2D-semiconductor IC processes and is building an engineering-validation wafer line for external chip fabrication and its own 2D ICs. | Asia-Pacific | 中赢创投; 浦东创投 |
| Innochips | Logic Semiconductors | December 2025 | Series D+ | >≈$14,100,000 | Designs baseband, RF and communications SoCs for mobile, satellite, IoT and base-station applications. | Asia-Pacific | Sichuan Development Xinyun Fund |
| Winner Micro | Logic Semiconductors | December 2025 | Growth Equity | >$1,400,000 | Develops Wi-Fi, Bluetooth, MCU and secure wireless communication semiconductor chips for IoT applications. | Asia-Pacific | Loongson Capital |
| LM Semiconductor | Logic Semiconductors | December 2025 | Seed | >$1,170,000 | Develops fabless connectivity SoCs using its NR+ non-cellular 5G technology for IoT and edge devices. | Europe | Not disclosed |
| Random Power | Logic Semiconductors | December 2025 | Seed | >≈$3,000,000 | Develops quantum random-number-generator ASICs based on semiconductor quantum effects for hardware security. | Europe | Emerald Development Managers; Deep Blue Ventures |
| VisIC Technologies | Power Semiconductors | December 2025 | Series B | $26M | Develops fabless GaN power semiconductor devices for EV traction and other high-power conversion applications. | Middle East | Not disclosed |
| Newsonic | Analog Semiconductors | December 2025 | Series C | ≈$38,000,000 | Designs RF acoustic filter chips and RF front-end semiconductor devices including BAW, SAW and TC-SAW products. | Asia-Pacific | Not disclosed |
| Unconventional AI | Logic Semiconductors | December 2025 | Seed | $475M | Develops physics-based analog AI computing silicon co-designed with its compute architecture and software stack. | North America | Lightspeed Venture Partners; Andreessen Horowitz |
| Starshine Semiconductor | Analog Semiconductors | December 2025 | Series C | >≈$14,100,000 | Develops and manufactures RF acoustic filter chips using SAW, TC-SAW, BAW and related technologies. | Asia-Pacific | Not disclosed |
| Niobium Microsystems | Logic Semiconductors | December 2025 | Seed | >$23,000,000 | Develops custom silicon accelerators for fully homomorphic encrypted computing. | North America | Not disclosed |
| Axiado | Logic Semiconductors | December 2025 | Series C | >$100,000,000 | Develops security and system-management processor silicon for AI servers and data centers. | North America | Maverick Silicon |
| TsingMicro | Logic Semiconductors | December 2025 | Series C | >≈$283,000,000 | Develops reconfigurable AI accelerator and computing chips based on proprietary processor architecture. | Asia-Pacific | Beijing Energy Investment Holding |
| ETL Chip | Logic Semiconductors | December 2025 | Series A | >$1,400,000 | Develops automotive and industrial Ethernet PHY and switch semiconductor chips. | Asia-Pacific | Bojiang Capital |
| Mastiska | Logic Semiconductors | November 2025 | Seed | $10M | Develops fabless GPU-class AI accelerator silicon for data-center training and inference workloads. | Middle East | Not disclosed |
| Sophrosyne Technologies | Sensor Semiconductors | November 2025 | Seed | $2M | Develops ultra-low-power biosensing system-on-chip devices for measuring physiological signals in wearables and digital-health equipment. | Asia-Pacific | Bluehill.VC |
| PowerLattice | Power Semiconductors | November 2025 | Series A | $25M | Develops an integrated power-delivery semiconductor chiplet for GPUs, CPUs and AI accelerators. | North America | Playground Global; Celesta Capital |
| Ferroelectric Memory Company | Memory Semiconductors | November 2025 | Series C | $89M | Designs ferroelectric DRAM+ and 3D CACHE+ memory semiconductor devices based on hafnium-oxide technology. | Europe | HV Capital; DeepTech & Climate Fonds (DTCF) |
| Skycore Semiconductor | Power Semiconductors | November 2025 | Seed | $5.8M | Designs fabless high-voltage power-conversion ICs based on switched-capacitor architectures. | Europe | Amadeus APEX Technology Fund |
| d-Matrix | Logic Semiconductors | November 2025 | Series C | $275M | Develops digital in-memory-compute semiconductor accelerators and chiplets purpose-built for generative-AI inference. | North America | Bullhound Capital; Triatomic Capital; Temasek |
| RAAM Technologies | Memory Semiconductors | November 2025 | Series A | $17.5M | Develops GCRAM embedded-memory semiconductor devices designed as denser, lower-power alternatives to conventional on-chip SRAM. | Middle East | NXP Semiconductors |
| NanoCore | Logic Semiconductors | October 2025 | Series B | >$14,000,000 | Develops 3D compute-in-memory AI processor chips combining CIM, 3D near-memory architecture and RISC-V compute. | Asia-Pacific | 蓝驰创投 |
| LeadingSpeed | Analog Semiconductors | October 2025 | Series B | ≈$14,000,000 | Designs high-speed optical-communications ICs including TIA, driver, CDR and PLL chips for telecom and data-center links. | Asia-Pacific | Not disclosed |
| Eagles Microelectronics | Sensor Semiconductors | October 2025 | Series B | >$98,000,000 | Designs and manufactures VCSEL semiconductor chips for optical interconnect, LiDAR and 3D sensing. | Asia-Pacific | 中信金石; 国新基金 |
| R-Semi | Analog Semiconductors | October 2025 | Series A | >$14,000,000 | Develops and sells automotive high-speed SerDes semiconductor chips for in-vehicle video and sensor data links. | Asia-Pacific | Not disclosed |
| Hefei Wanxin Integrated Circuit | Foundry Services | October 2025 | Growth Equity | ≈$421,000,000 | Builds and operates a 12-inch wafer fabrication line providing foundry manufacturing across logic, display-driver, CIS, power-management and MCU processes. | Asia-Pacific | Not disclosed |
| Vertical Semiconductor | Power Semiconductors | October 2025 | Seed | $11M | Develops vertical gallium-nitride power transistors for high-efficiency power conversion in AI infrastructure and other high-power applications. | North America | Playground Global |
| CVSens | Sensor Semiconductors | October 2025 | Series B | >≈$28,000,000 | Designs high-value CMOS image-sensor chips for automotive vision, security, machine vision, IoT and medical imaging. | Asia-Pacific | Not disclosed |
| Tachyum | Logic Semiconductors | October 2025 | Series C | $220M | Develops the Prodigy universal processor, a compute semiconductor combining CPU, HPC and AI-accelerator workloads. | North America | Not disclosed |
| CIMO Micro | Analog Semiconductors | October 2025 | Series B | >$14,000,000 | Designs high-performance analog signal-chain ICs including ADCs, DACs, amplifiers, voltage references and LDOs. | Asia-Pacific | 北京京国瑞投资管理有限公司 |
| CXMT | Memory Semiconductors | October 2025 | Growth Equity | ≈$63,200,000 | Designs and manufactures DRAM memory semiconductors as an integrated device manufacturer. | Asia-Pacific | Not disclosed |
| MAGICS Technologies | Analog Semiconductors | October 2025 | Unknown | ≈$4,650,000 | Designs and supplies radiation-tolerant CMOS integrated circuits including timing, clocking, imaging and control chips. | Europe | SC One; PMV |
| Falcomm | Analog Semiconductors | October 2025 | Seed | $5.8M | Develops fabless RF power-amplifier and front-end semiconductor devices for satellite, telecom and defense systems. | North America | Not disclosed |
| Cerebras | Logic Semiconductors | September 2025 | Series D+ | $1.1B | Designs wafer-scale AI processors and computing systems centered on its Wafer Scale Engine semiconductor. | North America | Fidelity Management & Research Company; Atreides Management |
| InGaGe MEMS | Sensor Semiconductors | September 2025 | Seed | $7M | Develops fabless multi-axis MEMS inertial sensor chips for high-accuracy navigation. | Europe | Supernova Invest; 360 Capital |
| Rebellions | Logic Semiconductors | September 2025 | Series C | $250M | Designs fabless AI inference accelerator chips for data-center deployments. | Asia-Pacific | Not disclosed |
| Morse Micro | Logic Semiconductors | September 2025 | Series C | ≈$29,000,000 | Designs fabless Wi-Fi HaLow system-on-chip semiconductors for long-range, low-power IoT connectivity. | Asia-Pacific | MegaChips |
| Empower Semiconductor | Power Semiconductors | September 2025 | Series D+ | >$240,000,000 | Develops integrated voltage-regulator and silicon-capacitor semiconductor products for AI and high-performance processors. | North America | Fidelity Management & Research Company |
| Sphere Semiconductor | Analog Semiconductors | September 2025 | Unknown | $12.5M | Develops and fabricates AI-designed custom analog, RF and mixed-signal semiconductor chips. | North America | ACME Capital; Future Ventures |
| Groq | Logic Semiconductors | September 2025 | Unknown | $750M | Designs proprietary LPU inference processors and deploys them in hardware and cloud infrastructure for AI inference. | North America | Disruptive |
| OptiCore | Logic Semiconductors | September 2025 | Seed | $7.5M | Develops photonic optical processing units for compute-intensive and memory-intensive AI workloads. | North America | Origin Ventures; Jetha Global |
| Agate Sensors | Sensor Semiconductors | September 2025 | Seed | ≈$2,700,000 | Develops chip-scale hyperspectral semiconductor sensors for material identification and imaging. | Europe | Voima Ventures; LIFTT |
| SCINTIL Photonics | Logic Semiconductors | September 2025 | Series B | $58M | Develops silicon-photonic integrated circuits with integrated lasers for high-bandwidth AI-data-center interconnects. | Europe | Yotta Capital Partners; NGP Capital |
| NanoPower Semiconductor | Power Semiconductors | September 2025 | Unknown | ≈$2,400,000 | Develops ultra-low-power power-management ICs that minimize standby energy consumption in battery-powered electronics. | Europe | Not disclosed |
| Lightelligence | Logic Semiconductors | September 2025 | Series C | >$210,000,000 | Develops photonic computing and optical-interconnect hardware centered on proprietary silicon-photonic chips for AI computing and data centers. | Asia-Pacific | Not disclosed |
| Lanxin Computing | Logic Semiconductors | August 2025 | Unknown | Not Disclosed | Develops RISC-V server CPU chips for data-center, cloud and AI computing. | Asia-Pacific | Not disclosed |
| TAKR MEMS | Sensor Semiconductors | August 2025 | Series A | Not Disclosed | Develops and manufactures MEMS gas-sensing and temperature-sensing semiconductor devices. | Asia-Pacific | Wuchuang Huagong Fund |
| Minghong Microelectronics | Sensor Semiconductors | August 2025 | Seed | Not Disclosed | Designs silicon-CMOS millimeter-wave radar and sensing chips for communications, security and low-altitude sensing. | Asia-Pacific | Falcon Capital |
| Aowei Lingxin | Logic Semiconductors | August 2025 | Seed | Not Disclosed | Designs high-performance RISC-V processors and programmable acceleration chips for industrial and edge computing. | Asia-Pacific | Chuangdongfang Investment |
| Chengke Microelectronics | Logic Semiconductors | August 2025 | Unknown | >$13,900,000 | Designs high-speed optical-module DSP and SerDes semiconductor chips for data-center and telecom links. | Asia-Pacific | Not disclosed |
| Paragraf | Sensor Semiconductors | August 2025 | Series C | $55M | Manufactures graphene-based semiconductor sensors including Hall-effect and molecular sensing devices. | Europe | Mubadala Capital |
| AzurEngine | Logic Semiconductors | August 2025 | Series B | ≈$14,000,000 | Develops reconfigurable parallel-processing chips for edge AI and embedded computing. | Asia-Pacific | Flyfot Ventures |
| JSCJ Electronics | Power Semiconductors | August 2025 | Growth Equity | Not Disclosed | Produces power discrete semiconductors and power-management ICs including MOSFETs, IGBTs and diodes. | Asia-Pacific | Not disclosed |
| ETL Chip | Logic Semiconductors | August 2025 | Series A | ≈$14,000,000 | Designs automotive and industrial Ethernet communication chips including switching and PHY devices. | Asia-Pacific | Not disclosed |
| PHOVIR | Sensor Semiconductors | August 2025 | Seed | ≈$5,400,000 | Develops chip-scale MEMS near-infrared sensors for compact spectroscopy. | Europe | Northern Gritstone; SCVC |
| SiEngine | Logic Semiconductors | August 2025 | Series B | >$139,000,000 | Designs high-performance automotive SoCs for digital cockpits, intelligent driving and vehicle computing. | Asia-Pacific | China State-owned Enterprise Structural Adjustment Fund II |
| NeoLogic | Logic Semiconductors | August 2025 | Series A | $10M | Develops server CPU chips using its proprietary logic architecture to reduce power and transistor count. | Middle East | KOMPAS VC |
| Newsonic | Analog Semiconductors | August 2025 | Series B | ≈$40,100,000 | Designs and sells BAW, SAW and related RF filter chips and front-end modules. | Asia-Pacific | Hongtai Fund |
| GaNext | Power Semiconductors | August 2025 | Series B | Not Disclosed | Designs and commercializes high-voltage GaN-on-silicon power semiconductor devices. | Asia-Pacific | Not disclosed |
| Celera Semiconductor | Analog Semiconductors | August 2025 | Series A | $20M | Develops custom analog integrated circuits using an automated analog-chip design platform. | North America | Not disclosed |
| YXME | Memory Semiconductors | August 2025 | Seed | ≈$14,000,000 | Develops ReRAM memory devices and compute-in-memory chips. | Asia-Pacific | Linghang Xinjie; Yanyuan Venture Capital |
| Flagchip | Logic Semiconductors | August 2025 | Series C | Not Disclosed | Designs automotive-grade MCU and high-performance controller chips for vehicle control systems. | Asia-Pacific | Not disclosed |
| SiMa.ai | Logic Semiconductors | August 2025 | Unknown | $85M | Develops machine-learning system-on-chip processors for edge and physical-AI inference. | North America | Maverick Capital |
| FuriosaAI | Logic Semiconductors | July 2025 | Series C | $125M | Designs AI inference accelerator chips based on its proprietary Tensor Contraction Processor architecture. | Asia-Pacific | Not disclosed |
| YXME | Memory Semiconductors | July 2025 | Seed | ≈$23,900,000 | Develops ReRAM memory devices, embedded non-volatile memory and compute-in-memory semiconductor chips. | Asia-Pacific | 领航新界; 燕缘创投 |
| Netrasemi | Logic Semiconductors | July 2025 | Series A | ≈$22,500,000 | Designs fabless edge-AI SoCs integrating proprietary compute, vision and image-processing capabilities. | Asia-Pacific | Zoho Corporation; Unicorn India Ventures |
| Lumotive | Sensor Semiconductors | July 2025 | Series B | $14M | Develops programmable optical semiconductor chips that electronically steer light for lidar, sensing and optical applications. | North America | Not disclosed |
| Sunrise | Logic Semiconductors | July 2025 | Unknown | ≈$239,500,000 | Develops and commercializes high-performance GPUs and AI inference accelerator chips. | Asia-Pacific | Not disclosed |
| Yanshan Technology | Analog Semiconductors | July 2025 | Series A | ≈$23,900,000 | Develops and manufactures vertically stacked full-color GaN MicroLED semiconductor chips for microdisplay and direct-display applications. | Asia-Pacific | Not disclosed |
| Kunlunxin | Logic Semiconductors | July 2025 | Unknown | >$23,900,000 | Designs and sells AI accelerator chips for data-center and large-scale inference and training workloads. | Asia-Pacific | Not disclosed |
| Arago | Logic Semiconductors | July 2025 | Seed | $26M | Develops photonic AI processors designed to perform high-efficiency inference and compute workloads. | Europe | Earlybird Venture Capital; Protagonist; Visionaries Tomorrow |
| SiPearl | Logic Semiconductors | July 2025 | Series A | ≈$27,600,000 | Designs Arm-based high-performance processors for European supercomputing and AI systems. | Europe | Not disclosed |
| Gejian Semiconductor | Logic Semiconductors | July 2025 | Series A | ≈$23,900,000 | Designs high-performance real-time DSP semiconductor chips for industrial control, power electronics, automotive and robotics applications. | Asia-Pacific | 微禾投资 |
| SiCRED | Power Semiconductors | July 2025 | Growth Equity | ≈$23,900,000 | Designs and sells SiC MOSFET chips and other silicon-carbide power semiconductor devices. | Asia-Pacific | Not disclosed |
| Hurricane Chip | Analog Semiconductors | July 2025 | Series B | ≈$21,800,000 | Develops and manufactures GaN semiconductor laser-diode chips spanning ultraviolet, blue and green wavelengths. | Asia-Pacific | 深创投制造业转型升级新材料基金; 国风投新智基金 |
| Sunrise | Logic Semiconductors | June 2025 | Unknown | ≈$239,000,000 | Develops high-performance AI GPUs for computer-vision and large-model inference workloads. | Asia-Pacific | Not disclosed |
| Seekwave Tech | Logic Semiconductors | June 2025 | Series B | Not Disclosed | Designs highly integrated Wi-Fi and Bluetooth connectivity SoCs for consumer and IoT equipment. | Asia-Pacific | Fuhan Microelectronics |
| BASiC Semiconductor | Power Semiconductors | June 2025 | Series D+ | ≈$20,900,000 | Develops and manufactures SiC MOSFETs, diodes, power modules and related power-semiconductor devices. | Asia-Pacific | Not disclosed |
| Vertilite | Sensor Semiconductors | June 2025 | Growth Equity | Not Disclosed | Designs and manufactures VCSEL laser chips and high-speed optical semiconductor devices for sensing and optical communications. | Asia-Pacific | Guangdong HEC Technology Holding Co., Ltd. |
| Swave Photonics | Analog Semiconductors | June 2025 | Series A | $6.9M | Develops CMOS-based holographic semiconductor chipsets that directly modulate light for spatial displays. | Europe | IAG Capital Partners |
| ONiO | Logic Semiconductors | June 2025 | Series A | ≈$2,800,000 | Develops ultra-low-power general-purpose microcontrollers capable of operating from harvested ambient energy. | Europe | node.vc; Maki.vc |
| Oritek | Logic Semiconductors | June 2025 | Series B | ≈$23,900,000 | Designs automotive SoCs for zonal controllers, edge intelligent components and centralized driving/parking compute platforms. | Asia-Pacific | Sunny Industrial Fund |
| Haawking | Logic Semiconductors | June 2025 | Unknown | Not Disclosed | Designs RISC-V DSP and processor chips for industrial control, power electronics, machine vision and related embedded applications. | Asia-Pacific | Not disclosed |
| SPARC Foundry | Foundry Services | June 2025 | Unknown | ≈$29,800,000 | Is building an open-access pure-play III-V semiconductor foundry for photonic integrated circuits and discrete GaAs, InP and GaN devices. | Europe | Not disclosed |
| Volantis Semiconductor | Logic Semiconductors | June 2025 | Seed | $9M | Develops wafer-scale photonic semiconductor architectures integrating optical interconnects and compute for AI systems. | North America | Not disclosed |
| MLink Tech | Logic Semiconductors | June 2025 | Series D+ | Not Disclosed | Designs cellular-IoT and satellite-communications baseband/SoC chips including NB-IoT, Cat.1 bis, RedCap and NTN devices. | Asia-Pacific | Beijing Commercial Aerospace and Low-Altitude Economy Industry Investment Fund |
| Phoenix Semiconductor | Logic Semiconductors | June 2025 | Seed | $5.5M | Recreates discontinued and obsolete semiconductor chips as drop-in replacements for long-life critical systems. | North America | J2 Ventures; RTX Ventures |
| LECArc | Logic Semiconductors | June 2025 | Unknown | Not Disclosed | Designs Arm-based server CPU chips for cloud, edge and AI-inference computing. | Asia-Pacific | Yida Capital; Nanjing Innovation Investment |
| JL Semiconductor | Analog Semiconductors | June 2025 | Series D+ | Not Disclosed | Designs Ethernet PHY, switch and other high-speed wired-networking semiconductor chips, particularly for automotive networks. | Asia-Pacific | Not disclosed |
| Semi Zabala | Power Semiconductors | June 2025 | Unknown | ≈$2,500,000 | Develops and manufactures GaN HEMT power-semiconductor devices for high-reliability and aerospace power electronics. | Europe | Not disclosed |
| VisiNextek | Logic Semiconductors | June 2025 | Series A | ≈$23,900,000 | Designs edge-AI SoCs integrating image processing and AI acceleration for vision, automotive and robotics applications. | Asia-Pacific | Junxin Capital |
| Speedata | Logic Semiconductors | June 2025 | Series B | $44M | Develops Analytics Processing Unit chips purpose-built to accelerate large-scale data analytics workloads. | Middle East | Walden Catalyst Ventures; 83North; Koch Disruptive Technologies; Pitango First; Viola Ventures |
| YHGX Technology | Analog Semiconductors | May 2025 | Series B | >≈$13,800,000 | Designs high-reliability power-management ICs including regulators, motor drivers and radiation-hardened power chips. | Asia-Pacific | Chizhou Industrial Investment; Plum Ventures |
| SciSemi | Logic Semiconductors | May 2025 | Seed | ≈$3,350,000 | Develops CHERI-secured microcontroller chips with hardware memory-safety features. | Europe | Mercia Ventures |
| ICY Tech | Logic Semiconductors | May 2025 | Seed | Not Disclosed | Develops spintronic magnetic-computing chips for AI inference and specialized high-performance computing. | Asia-Pacific | Not disclosed |
| Lanxin Computing | Logic Semiconductors | May 2025 | Unknown | ≈$1,390,000 | Designs high-performance RISC-V server CPU chips for data-center, enterprise and AI-compute workloads. | Asia-Pacific | Not disclosed |
| Light Chip | Analog Semiconductors | May 2025 | Series A | Not Disclosed | Designs silicon-based CMOS microdisplay driver chips for MicroLED and other digital-light-field displays. | Asia-Pacific | Guangdong Hengqin Guangdong-Macao In-Depth Cooperation Zone Industrial Investment |
| Pixelcore AI | Sensor Semiconductors | May 2025 | Unknown | Not Disclosed | Develops intelligent image-sensor chips integrating pixel-level sensing, storage and edge computation. | Asia-Pacific | Beijing Infotech Ventures |
| Finwave Semiconductor | Analog Semiconductors | May 2025 | Unknown | $8.2M | Develops GaN-on-silicon RF semiconductor devices including switches and power-amplifier products for wireless networks. | North America | Fine Structure Ventures; Engine Ventures; Safar Partners |
| Starshine Semiconductor | Analog Semiconductors | May 2025 | Series B | >≈$13,800,000 | Develops and manufactures SAW, TF-SAW and BAW RF filter chips and RF front-end semiconductor modules. | Asia-Pacific | Not disclosed |
| HYBRD Chip | Logic Semiconductors | May 2025 | Unknown | Not Disclosed | Designs and sells high-performance FPGA and programmable heterogeneous computing chips. | Asia-Pacific | 初芯基金 |
| eyeo | Sensor Semiconductors | May 2025 | Seed | ≈$17,000,000 | Develops image-sensor technology using nanophotonic color splitting to increase CMOS sensor light sensitivity and resolution. | Europe | imec.xpand; Invest-NL |
| VSORA | Logic Semiconductors | April 2025 | Unknown | $46M | Develops high-performance AI inference accelerator chips for datacenter and edge workloads. | Europe | Otium; French family office (name not disclosed) |
| HFKON Semiconductor | Memory Semiconductors | April 2025 | Series B | Not Disclosed | Designs flash-memory controller ICs and embedded eMMC storage products. | Asia-Pacific | Not disclosed |
| YMTC Holding | Memory Semiconductors | April 2025 | Growth Equity | Not Disclosed | Controls semiconductor manufacturing businesses led by YMTC's 3D NAND memory operations. | Asia-Pacific | Not disclosed |
| R-Semi | Analog Semiconductors | April 2025 | Series A | Not Disclosed | Designs automotive SerDes and high-speed mixed-signal connectivity chipsets for in-vehicle data transmission. | Asia-Pacific | Not disclosed |
| Lansus | Analog Semiconductors | April 2025 | Growth Equity | ≈$21,800,000 | Designs and sells RF front-end semiconductors including power amplifiers, RF switches and integrated RF modules. | Asia-Pacific | Not disclosed |
| Element Labs | Logic Semiconductors | April 2025 | Series A | $50M | Develops AI inference processors aimed primarily at local and smaller datacenter deployments. | Middle East | Fidelity |
| Tauren Technology | Analog Semiconductors | April 2025 | Series D+ | Not Disclosed | Designs high-speed analog and mixed-signal ICs including ADC/DAC, SerDes, optical DSP and RF transceiver chips. | Asia-Pacific | Not disclosed |
| Neye | Logic Semiconductors | April 2025 | Series B | $58M | Develops chip-scale silicon-photonic optical circuit switches for AI and high-performance datacenter networks. | North America | CapitalG |
| Axera | Logic Semiconductors | April 2025 | Series C | >≈$236,000,000 | Designs AI perception and edge-computing SoCs for vision, intelligent vehicles and other edge devices. | Asia-Pacific | Not disclosed |
| Neuranics | Sensor Semiconductors | April 2025 | Seed | $8M | Develops ultra-low-power tunnelling-magnetoresistance semiconductor sensors for magnetic signal detection. | Europe | Blackfinch Ventures |
| Ratel Semiconductor | Power Semiconductors | April 2025 | Unknown | ≈$220,000 | Designs fabless power-management ICs for displays, on-device AI computers and automotive electronics. | Asia-Pacific | Not disclosed |
| Blumind | Analog Semiconductors | April 2025 | Series A | ≈$24,026,000 | Develops ultra-low-power all-analog AI inference chips for always-on edge computing. | North America | Cycle Capital; BDC Capital |
| CalligoTech | Logic Semiconductors | April 2025 | Unknown | $1.1M | Designs RISC-V SoCs with Posit arithmetic acceleration for HPC and AI workloads. | Asia-Pacific | Seafund; Artha Venture Fund |
| FaradaIC | Sensor Semiconductors | April 2025 | Seed | ≈$2,910,000 | Develops wafer-manufactured chip-scale electrochemical gas sensors using solid-state ion conductors. | Europe | JOIN Capital |
| Icemos | Power Semiconductors | April 2025 | Series D+ | $22M | Develops and manufactures silicon power MOSFETs using MEMS-enabled super-junction structures. | North America | Not disclosed |
| CSCX Semiconductor | Logic Semiconductors | March 2025 | Series A | ≈$27,400,000 | Develops UWB SoCs combining precise ranging, positioning, communications and radar functions. | Asia-Pacific | Xingxiang Capital |
| Biren Technology | Logic Semiconductors | March 2025 | Series D+ | Not Disclosed | Develops high-performance general-purpose GPU and AI accelerator semiconductor chips. | Asia-Pacific | 上海国投先导人工智能产业母基金 |
| Celestial AI | Analog Semiconductors | March 2025 | Series C | $250M | Develops silicon-photonic optical-interconnect chiplets and its Photonic Fabric platform for AI compute and memory connectivity. | North America | Fidelity Management & Research Company |
| Sencure | Sensor Semiconductors | March 2025 | Series B | ≈$2,200,000 | Develops low-power biosensing front-end ICs for EEG, ECG and EMG medical wearables and devices. | Europe | Not disclosed |
| Pebble Square | Logic Semiconductors | March 2025 | Seed | ≈$2,380,000 | Develops analog processing-in-memory and neuromorphic AI semiconductor chips for edge inference. | Asia-Pacific | Not disclosed |
| VMEMS | Sensor Semiconductors | March 2025 | Seed | Not Disclosed | Develops CMOS-MEMS monolithically integrated infrared-array and other MEMS sensor chips. | Asia-Pacific | Xiamen High-tech Investment |
| Huachen Optoelectronics | Analog Semiconductors | March 2025 | Series A | ≈$27,400,000 | Designs and manufactures EEL and VCSEL semiconductor laser chips for optical communications, high-power lasers and 3D sensing. | Asia-Pacific | Not disclosed |
| Mingxin Qirui | Memory Semiconductors | March 2025 | Seed | ≈$23,700,000 | Develops RRAM memory and compute-in-memory chips, embedded RRAM technology and AI-oriented memory products. | Asia-Pacific | Jinqiu Fund |
| Atmosic | Logic Semiconductors | March 2025 | Series D+ | $40M | Develops ultra-low-power wireless connectivity and compute SoCs for IoT and edge devices. | North America | Sutter Hill Ventures |
| Giant Semiconductor | Analog Semiconductors | February 2025 | Series B | ≈$24,000,000 | Designs UWB and other short-range wireless communication and sensing SoCs. | Asia-Pacific | Not disclosed |
| Eagles Microelectronics | Sensor Semiconductors | February 2025 | Series B | >$21,000,000 | Develops and manufactures VCSEL optical-semiconductor chips for data communications, LiDAR and 3D sensing. | Asia-Pacific | Not disclosed |
| EMTAR Technology | Analog Semiconductors | February 2025 | Seed | ≈$22,900,000 | Designs wireless SoCs combining high-speed interfaces, wireless connectivity and edge computing. | North America | Not disclosed |
| Hyseim | Logic Semiconductors | February 2025 | Series A | ≈$24,000,000 | Designs RISC-V processor and SoC chips for automotive, industrial and edge-computing applications. | Asia-Pacific | Not disclosed |
| PNJ Semiconductor | Power Semiconductors | February 2025 | Series A | ≈$28,000,000 | Designs SiC MOSFETs, SiC Schottky diodes and GaN HEMT power semiconductor devices. | Asia-Pacific | Not disclosed |
| Lumotive | Sensor Semiconductors | February 2025 | Series B | $45M | Develops programmable optical-semiconductor beam-steering chips for 3D sensing and optical communications. | North America | Gates Frontier; MetaVC Partners |
| Cambridge GaN Devices | Power Semiconductors | February 2025 | Series C | $32M | Develops GaN-on-silicon power transistors and integrated power ICs. | Europe | Not disclosed |
| Danxi Technology | Power Semiconductors | February 2025 | Unknown | >$2,300,000 | Designs and sells GaN power transistors, gate-driver ICs and integrated GaN power devices. | Asia-Pacific | Unknown |
| XDXCT | Logic Semiconductors | February 2025 | Unknown | >$27,000,000 | Designs general-purpose GPU semiconductor chips for graphics and AI computing. | Asia-Pacific | Not disclosed |
| EnCharge AI | Analog Semiconductors | February 2025 | Series B | >$200,000,000 | Designs analog in-memory computing chips for energy-efficient AI inference and acceleration. | North America | Tiger Global |
| MIS Technology | Sensor Semiconductors | February 2025 | Series A | >$2,300,000 | Designs MEMS pressure and flow sensor chips for automotive, consumer, industrial and medical applications. | Asia-Pacific | Not disclosed |
| OSO Semiconductor | Analog Semiconductors | February 2025 | Seed | $5.2M | Designs RF beamforming chipsets for phased-array satellite, 5G and radar systems. | North America | Engine Ventures |
| TinyChip | Analog Semiconductors | February 2025 | Unknown | >$2,200,000 | Designs automotive analog and mixed-signal SoCs integrating control, sensing, actuation and power-management functions. | Asia-Pacific | Not disclosed |
| Salience Labs | Logic Semiconductors | February 2025 | Series A | $30M | Develops silicon-photonics optical-switch chips for high-bandwidth AI data-center interconnects. | Europe | ICM HPQC Fund; Applied Ventures |
| Pakal Technologies | Power Semiconductors | January 2025 | Series B | $25M | Develops high-voltage silicon power semiconductor switches for electrification and power-conversion systems. | North America | New Science Ventures |
| PseudolithIC | Analog Semiconductors | January 2025 | Seed | $6M | Develops RF semiconductor chipsets integrating compound-semiconductor chiplets with silicon manufacturing. | North America | Entrada Ventures |
| Zhixin Semiconductor | Logic Semiconductors | January 2025 | Unknown | Not Disclosed | Designs automotive semiconductor chips including MCUs, mixed-signal ICs and motor-control devices. | Asia-Pacific | 合肥产投资本 |
| InventChip | Power Semiconductors | January 2025 | Series C | Not Disclosed | Develops and manufactures SiC power semiconductor devices and associated power ICs using an IDM model. | Asia-Pacific | 国开制造业转型升级基金 |
| EVAS Intelligence | Logic Semiconductors | January 2025 | Series A | Not Disclosed | Designs RISC-V based compute and automotive edge-processing chips. | Asia-Pacific | National SME Development Fund (managed by Oriental Fortune Capital) |
| MT Silicon | Sensor Semiconductors | January 2025 | Series A | Not Disclosed | Designs high-performance CMOS image sensor chips for automotive, robotics and machine-vision applications. | Asia-Pacific | 开源证券; 西投控股 |
| PowerDiamond Systems | Power Semiconductors | January 2025 | Series A | ≈$640,000 | Develops diamond semiconductor devices for high-power and high-frequency electronics. | Asia-Pacific | Not disclosed |
| VisiNextek | Logic Semiconductors | January 2025 | Unknown | Not Disclosed | Designs edge-AI SoCs for intelligent vision, automotive, robotics and other embedded applications. | Asia-Pacific | Not disclosed |
| Vertical Compute | Memory Semiconductors | January 2025 | Seed | ≈$20,500,000 | Develops vertically integrated memory-compute semiconductor technology intended to reduce the memory bottleneck in AI computing. | Europe | imec.xpand |
| UNIM Innovation | Memory Semiconductors | January 2025 | Series A | Not Disclosed | Designs and supplies NAND flash memory chips, including SLC NAND devices for embedded and industrial applications. | Asia-Pacific | Not disclosed |
| Meritech | Analog Semiconductors | January 2025 | Series B | Not Disclosed | Designs automotive-grade high-speed analog and mixed-signal interface chips including SerDes devices. | Asia-Pacific | Not disclosed |
| YW MEMS | Sensor Semiconductors | January 2025 | Series A | Not Disclosed | Develops and manufactures MEMS semiconductor chips and related microdevices including flow sensors and micropumps. | Asia-Pacific | Not disclosed |
| Grecon Semiconductor | Power Semiconductors | January 2025 | Series B | Not Disclosed | Develops IGBT and SiC power semiconductor devices, wafers and power-device products. | Asia-Pacific | 国科长三角资本 |
| ETERN Laser | Logic Semiconductors | December 2024 | Unknown | ≈$2,200,000 | Develops semiconductor laser chips including VCSEL and DFB devices for optical communications and sensing. | Asia-Pacific | Not disclosed |
| Moore Threads | Logic Semiconductors | December 2024 | Growth Equity | ≈$216,000,000 | Designs fabless full-function GPU semiconductor processors for graphics and general-purpose accelerated computing. | Asia-Pacific | Not disclosed |
| HyperAccel | Logic Semiconductors | December 2024 | Series A | ≈$20,000,000 | Designs LLM Processing Unit semiconductor accelerators optimized for generative-AI inference and computation. | Asia-Pacific | Korea Investment Partners |
| SpacemiT | Logic Semiconductors | December 2024 | Series A | Not Disclosed | Designs high-performance RISC-V CPU and AI-computing semiconductor chips. | Asia-Pacific | Brizan III Fund |
| Mindgrove Technologies | Logic Semiconductors | December 2024 | Series A | $8M | Designs fabless RISC-V SoCs and microcontrollers for embedded, industrial, edge and vision applications. | Asia-Pacific | Rocketship.vc; Speciale Invest |
| OptiCore | Logic Semiconductors | December 2024 | Seed | $5M | Develops photonic optical-processing semiconductor chips intended to perform AI computation with optical rather than conventional electronic processing. | North America | Not disclosed |
| Beijixiongxin | Logic Semiconductors | December 2024 | Unknown | Not Disclosed | Develops high-performance computing semiconductor chips and chiplet-based processors. | Asia-Pacific | Not disclosed |
| EPIC | Logic Semiconductors | December 2024 | Unknown | Not Disclosed | Develops silicon-photonics semiconductor chips for high-speed optical communications and data-center interconnects. | Asia-Pacific | Hongrida Technology Co., Ltd. |
| Ayar Labs | Logic Semiconductors | December 2024 | Series D+ | $155M | Develops in-package silicon-photonics optical-I/O chiplets for high-bandwidth semiconductor interconnects. | North America | Advent Global Opportunities; Light Street Capital |
| Merchip Micro | Power Semiconductors | December 2024 | Series A | Not Disclosed | Develops digital power-management and power-control ICs including DSP power, motor-control and voltage-regulation chips. | Asia-Pacific | Not disclosed |
| Netrasemi | Logic Semiconductors | December 2024 | Unknown | ≈$2,180,000 | Develops edge-AI semiconductor SoCs for vision, signal-processing and intelligent embedded applications. | Asia-Pacific | Not disclosed |
| Axiado | Logic Semiconductors | December 2024 | Series C | $60M | Develops secure control and compute SoCs for platform management and hardware-rooted security in AI infrastructure. | North America | Maverick Silicon |
| Azimuth AI | Logic Semiconductors | December 2024 | Unknown | $11.5M | Designs purpose-built semiconductor SoCs for edge-computing and embedded applications. | North America | Unknown |
| PossumIC | Sensor Semiconductors | December 2024 | Series A | ≈$23,800,000 | Develops fabless millimeter-wave intelligent-sensing SoCs for automotive, industrial and consumer sensing applications. | Asia-Pacific | Not disclosed |
| Tenstorrent | Logic Semiconductors | December 2024 | Series D+ | >$293,000,000 | Designs high-performance AI accelerator processors and RISC-V-based compute chips. | North America | Samsung Securities; AFW Partners |
| Akhetonics | Logic Semiconductors | November 2024 | Seed | ≈$2,330,000 | Develops all-optical general-purpose processor chips using photonic integrated circuits for digital computing. | Europe | Matterwave Ventures |
| PowerDiamond Systems | Power Semiconductors | November 2024 | Unknown | ≈$2,600,000 | Develops diamond semiconductor power devices intended for extremely high-power and high-temperature applications. | Asia-Pacific | Not disclosed |
| UNISOC | Logic Semiconductors | November 2024 | Growth Equity | Not Disclosed | Designs mobile, communications, IoT and embedded system-on-chips and baseband semiconductor platforms. | Asia-Pacific | Not disclosed |
| Gejian Semiconductor | Logic Semiconductors | November 2024 | Series A | ≈$23,800,000 | Designs high-performance programmable DSP semiconductor chips for communications and signal-processing applications. | Asia-Pacific | Weiho Investment |
| Giant Semiconductor | Sensor Semiconductors | November 2024 | Unknown | Not Disclosed | Designs UWB semiconductor chips for precision ranging, positioning and short-range wireless connectivity. | Asia-Pacific | Yida Capital |
| MatX | Logic Semiconductors | November 2024 | Series A | ≈$20,000,000 | Designs purpose-built semiconductor accelerators for large-scale AI training and inference. | North America | Spark Capital |
| Ubitium | Logic Semiconductors | November 2024 | Seed | $3.7M | Develops a general-purpose RISC-V processor intended to consolidate multiple computing functions onto a single semiconductor architecture. | Europe | Runa Capital; Inflection; KBC Focus Fund |
| Xinlian Power | Power Semiconductors | November 2024 | Unknown | ≈$24,600,000 | Develops and manufactures automotive-grade silicon-carbide power semiconductor devices and related SiC manufacturing technology. | Asia-Pacific | Not disclosed |
| Oritek | Logic Semiconductors | November 2024 | Series B | Not Disclosed | Designs automotive system-on-chips for next-generation centralized vehicle electrical/electronic architectures. | Asia-Pacific | 国投招商 |
| Enfabrica | Logic Semiconductors | November 2024 | Series C | $115M | Designs high-bandwidth networking and memory-fabric silicon for connecting GPUs, accelerators and AI compute clusters. | North America | Spark Capital |
| GEMESYS | Logic Semiconductors | November 2024 | Seed | ≈$2,100,000 | Develops memristor-based analog AI accelerator chips for highly energy-efficient neural-network inference. | Europe | Amadeus APEX Technology Fund; Atlantic Labs |
| BOE Integrated | Foundry Services | November 2024 | Unknown | ≈$2,764,000,000 | Manufactures semiconductor wafers across 6-, 8- and planned 12-inch production lines for display, mixed-signal, MCU, automotive and communications chips. | Asia-Pacific | Not disclosed |
| MintNeuro | Sensor Semiconductors | November 2024 | Seed | ≈$2,290,000 | Develops application-specific semiconductor chips for neural recording, stimulation and implantable brain interfaces. | Europe | Empirical Ventures |
| C2i Semiconductors | Power Semiconductors | November 2024 | Seed | $4M | Designs analog and mixed-signal semiconductor products including power-management ICs for automotive and industrial applications. | Asia-Pacific | Yali Capital |
| Forefront RF | Analog Semiconductors | November 2024 | Series A | ≈$20,700,000 | Designs adaptive RF semiconductor technology that replaces multiple switched RF components in mobile and connected devices. | Europe | Cambridge Innovation Capital; Octopus Ventures |
| Xavveo | Sensor Semiconductors | November 2024 | Seed | $8.6M | Develops silicon-photonics-based distributed radar sensor chips and sensor networks for high-resolution ranging. | Europe | Vsquared Ventures; imec.xpand |
| Geener | Power Semiconductors | October 2024 | Series B | ≈$20,200,000 | Develops and manufactures silicon and SiC MOSFET, IGBT and FRD power-semiconductor chips and modules. | Asia-Pacific | Not disclosed |
| Zhixin Semiconductor | Logic Semiconductors | October 2024 | Series B | Not Disclosed | Designs and sells automotive processors, MCUs and mixed-signal automotive integrated circuits. | Asia-Pacific | Hefei Industrial Investment |
| Lightmatter | Logic Semiconductors | October 2024 | Series D+ | $400M | Develops silicon-photonic interconnect semiconductor engines for linking processors in large AI computing systems. | North America | T. Rowe Price Associates, Inc. |
| Yuntong Technology | Power Semiconductors | October 2024 | Series B | Not Disclosed | Develops automotive-grade IGBT, MOSFET and other power-semiconductor chips and modules for electric-vehicle power electronics. | Asia-Pacific | Not disclosed |
| Xscape Photonics | Logic Semiconductors | October 2024 | Series A | $44M | Develops programmable multi-wavelength silicon-photonic semiconductor platforms for high-bandwidth AI data-center interconnects. | North America | IAG Capital Partners |
| Immorta | Analog Semiconductors | October 2024 | Series A | Not Disclosed | Designs automotive-grade mixed-signal ICs including system-basis, power, driver and compute-control chips. | Asia-Pacific | Xinwei Capital |
| iStarChip | Logic Semiconductors | October 2024 | Seed | Not Disclosed | Designs CPU-DSP-NPU integrated control processors and related chips for embedded AI and intelligent endpoint control. | Asia-Pacific | Not disclosed |
| CVSens | Sensor Semiconductors | October 2024 | Series A | Not Disclosed | Designs high-value CMOS image-sensor chips for automotive, security, machine-vision, IoT and medical imaging. | Asia-Pacific | Hanlian Semiconductor Industry Fund |
| Meridian Innovation | Sensor Semiconductors | October 2024 | Series C | $12.5M | Develops mass-producible CMOS thermal-imaging sensor chips for consumer, automotive, industrial and monitoring applications. | Asia-Pacific | Not disclosed |
| TinyChip | Analog Semiconductors | October 2024 | Growth Equity | Not Disclosed | Designs high-performance automotive mixed-signal SoCs and specialized MCUs integrating sensing, signal-chain, power and control functions. | Asia-Pacific | Not disclosed |
| Fermionic Design | Analog Semiconductors | September 2024 | Unknown | $6M | Designs mixed-signal MCUs, RF beamformers, GaN RF front ends and power-management ICs. | Asia-Pacific | Not disclosed |
| Innobase | Logic Semiconductors | September 2024 | Series A | ≈$42,300,000 | Designs cellular baseband SoCs integrating baseband, RF, power-management and application-processing functions for connected devices. | Asia-Pacific | Chengdu Ceyuan Capital |
| AscenPower | Power Semiconductors | September 2024 | Series A | ≈$141,000,000 | Manufactures automotive- and industrial-grade SiC SBD/JBS diodes and SiC MOSFETs. | Asia-Pacific | Guangdong Integrated Circuit Fund II; SDIC Venture Capital |
| Hefei Wanxin Integrated Circuit | Foundry Services | September 2024 | Growth Equity | ≈$1,345,000,000 | Builds and operates a 12-inch semiconductor wafer manufacturing line as a foundry subsidiary of Nexchip. | Asia-Pacific | Not disclosed |
| Xinpletek | Analog Semiconductors | September 2024 | Series A | ≈$14,000,000 | Develops RF front-end power-amplifier chips and modules for cellular devices and IoT equipment. | Asia-Pacific | Not disclosed |
| JT Microelectronics | Power Semiconductors | September 2024 | Unknown | ≈$8,450,000 | Develops and sells GaN power switches, GaN Schottky diodes and associated driver ICs. | Asia-Pacific | Not disclosed |
| Hefei Fangjing Technology | Power Semiconductors | September 2024 | Growth Equity | ≈$40,800,000 | Develops and commercializes power semiconductor devices. | Asia-Pacific | Not disclosed |
| MEMSonics | Analog Semiconductors | September 2024 | Growth Equity | >≈$28,000,000 | Designs and manufactures RF acoustic filters plus piezoelectric microphone and ultrasonic sensor chips. | Asia-Pacific | Not disclosed |
| PNJ Semiconductor | Power Semiconductors | September 2024 | Series A | >≈$28,000,000 | Designs and sells SiC MOSFETs, SiC diodes and GaN power transistors. | Asia-Pacific | Not disclosed |
| ZHCL Tech | Logic Semiconductors | September 2024 | Series B | ≈$84,000,000 | Develops high-performance AI accelerator chips and associated large-scale compute systems. | Asia-Pacific | Xingluo Zhonghao |
| Longsailing Semiconductor | Logic Semiconductors | September 2024 | Series A | ≈$14,000,000–$28,000,000 | Fabless developer of Wi-Fi and other short-range wireless communications chips. | Asia-Pacific | Not disclosed |
| Zhihe Computing | Logic Semiconductors | September 2024 | Series A | >≈$28,000,000 | Develops high-performance RISC-V processors for AI-compute workloads. | Asia-Pacific | Source Code Capital |
| CXMT | Memory Semiconductors | September 2024 | Growth Equity | ≈$1,158,000,000 | Develops and manufactures 12-inch DRAM memory wafers. | Asia-Pacific | Not disclosed |
| BigEndian Semiconductors | Logic Semiconductors | September 2024 | Seed | $3M | Fabless developer of system-on-chip semiconductors, initially targeting surveillance-camera applications. | Asia-Pacific | Vertex Ventures SEA & India |
| Senscomm Semiconductor | Logic Semiconductors | August 2024 | Unknown | Not Disclosed | Designs and sells Wi-Fi 6/6E/7 wireless-connectivity and AIoT SoCs. | Asia-Pacific | Not disclosed |
| Osemi Technology | Logic Semiconductors | August 2024 | Seed | Not Disclosed | Designs UWB and automotive millimeter-wave radar SoCs for positioning, connectivity and sensing applications. | Asia-Pacific | 金鼎康希产业基金 |
| Fabric Cryptography | Logic Semiconductors | August 2024 | Series A | $33M | Designs custom Verifiable Processing Unit chips that accelerate advanced cryptographic workloads. | North America | Blockchain Capital; 1kx |
| Lisuan Technology | Logic Semiconductors | August 2024 | Unknown | ≈$26,000,000 | Designs and sells proprietary graphics-rendering GPU chips. | Asia-Pacific | Not disclosed |
| CNSilicon | Analog Semiconductors | August 2024 | Seed | Not Disclosed | Designs and sells high-performance mixed-signal LED matrix driver ICs for display backlights and automotive lighting. | Asia-Pacific | 金鼎力芯微产业基金 |
| CX Semi | Power Semiconductors | August 2024 | Series C | Not Disclosed | Designs and sells power-management and battery-management ICs, including fast-charging and charge-pump devices. | Asia-Pacific | Not disclosed |
| BEAM Technologies | Sensor Semiconductors | August 2024 | Seed | ≈$211,000 | Develops Far-UVC AlGaN LED semiconductor devices. | Asia-Pacific | Tokyo University of Science Innovation Capital Co., Ltd. |
| Hexin Hulian | Analog Semiconductors | August 2024 | Series C | >$21,800,000 | Designs and sells mixed-signal signal-chain and high-speed interconnect ICs including ADC/DAC, voltage-reference, clock and SerDes-related chips. | Asia-Pacific | CICC Capital |
| Feidu Micro | Analog Semiconductors | August 2024 | Seed | Not Disclosed | Designs and sells mixed-signal sensor-conditioning ASICs and signal-chain ICs including ADCs, DACs and AFEs. | Asia-Pacific | Cowin Capital |
| Fractile | Logic Semiconductors | July 2024 | Seed | $15M | Develops compute-in-memory semiconductor processors optimized for high-performance AI inference. | Europe | Kindred Capital; NATO Innovation Fund; Oxford Science Enterprises |
| Rebellions | Logic Semiconductors | July 2024 | Series B | $15M | Designs fabless AI inference accelerator chips for data-center and specialized computing workloads. | Asia-Pacific | Not disclosed |
| DreamBig Semiconductor | Logic Semiconductors | July 2024 | Series B | $75M | Develops semiconductor chiplets and chiplet-hub devices for AI acceleration, networking, memory connectivity and data-center systems. | North America | Samsung Catalyst Fund; Sutardja Family |
| Gwanak Analog | Analog Semiconductors | July 2024 | Series B | $15.9M | Develops and supplies analog, power-management, sensor-conditioning and mixed-signal semiconductor ICs and SoCs. | Asia-Pacific | Not disclosed |
| IVP Semiconductor | Power Semiconductors | July 2024 | Unknown | $5M | Designs fabless power semiconductor chips and related intelligent power devices for automotive, industrial, renewable-energy and consumer applications. | Asia-Pacific | Not disclosed |
| Millibeam | Analog Semiconductors | July 2024 | Series A | $2M | Develops fabless millimeter-wave radio chipsets for 5G and 6G communications networks. | Asia-Pacific | Not disclosed |
| Vaire Computing | Logic Semiconductors | July 2024 | Seed | $4M | Develops silicon processors based on reversible computing architectures designed to dramatically reduce computation energy loss and heat. | Europe | 7percent Ventures; Jude Gomila |
| Axelera AI | Logic Semiconductors | June 2024 | Series B | $68M | Designs fabless AI-processing-unit chips for energy-efficient edge and inference workloads. | Europe | Not disclosed |
| Innatera | Logic Semiconductors | June 2024 | Series A | $5M | Designs ultra-low-power neuromorphic processor chips for sensor-edge AI applications. | Europe | Innavest; Invest-NL |
| Starshine Semiconductor | Analog Semiconductors | June 2024 | Series B | $137.5M | Develops and sells SAW, TC-SAW and BAW RF filter chips and RF front-end modules. | Asia-Pacific | China Mobile Industry Chain Development Fund |
| Etched | Logic Semiconductors | June 2024 | Series A | $120M | Designs Sohu, a purpose-built ASIC accelerator optimized specifically for transformer-model inference. | North America | Primary Venture Partners; Positive Sum |
| HPMicro | Logic Semiconductors | June 2024 | Series B | Not Disclosed | Designs high-performance RISC-V microcontrollers, microprocessors and related embedded semiconductor devices. | Asia-Pacific | Paradise Silicon Valley Capital |
| EagleChip | Logic Semiconductors | June 2024 | Unknown | Not Disclosed | Designs high-end FPGA logic chips for communications, data-center, automotive and computing applications. | Asia-Pacific | Not disclosed |
| TOF 3D | Sensor Semiconductors | June 2024 | Series C | Not Disclosed | Designs and sells i-ToF and d-ToF depth-sensing chips and miniature ToF sensor devices. | Asia-Pacific | Jinghuijuxin Fund, managed by Gaoxin Capital |
| Black Semiconductor | Analog Semiconductors | June 2024 | Series A | $27.6M | Develops graphene-based electro-optical semiconductor technology for high-bandwidth chip-to-chip interconnects. | Europe | Porsche Ventures; Project A Ventures |
| Vector Photonics | Analog Semiconductors | June 2024 | Seed | $2.1M | Develops fabless photonic-crystal surface-emitting semiconductor laser devices for datacom and other optical applications. | Europe | Not disclosed |
| Aris Micro | Analog Semiconductors | June 2024 | Series A | Not Disclosed | Designs USB-PD power-management, USB4 retimer and other high-speed mixed-signal interface chips. | Asia-Pacific | Weihao Chuangxin |
| Ixana | Analog Semiconductors | June 2024 | Series A | $10M | Develops ultra-low-power mixed-signal Wi-R communication chips for wearable and body-area networks. | North America | 10x Founders |
| UNISOC | Logic Semiconductors | June 2024 | Growth Equity | $552M | Designs and sells mobile, communications, IoT and automotive SoCs and connectivity chipsets. | Asia-Pacific | Not disclosed |
| EyeQ Lab | Power Semiconductors | May 2024 | Series B | $18M | Designs and manufactures silicon-carbide power semiconductor devices for high-voltage power applications. | Asia-Pacific | Not disclosed |
| MetisX | Memory Semiconductors | May 2024 | Series A | $44M | Develops CXL-based intelligent-memory semiconductor devices for memory-centric data processing. | Asia-Pacific | Not disclosed |
| DEEPX | Logic Semiconductors | May 2024 | Series C | $80.5M | Develops low-power neural-processing-unit semiconductors for on-device AI inference. | Asia-Pacific | SkyLake Equity Partners |
| Niobium Microsystems | Logic Semiconductors | May 2024 | Seed | $5.5M | Develops custom silicon accelerators for fully homomorphic encryption and secure computing. | North America | Fusion Fund |
| Blaize | Logic Semiconductors | April 2024 | Series D+ | $106M | Develops proprietary graph-streaming AI processors and associated software for edge and data-center inference. | North America | Not disclosed |
| Rivos | Logic Semiconductors | April 2024 | Series A | >$250,000,000 | Develops RISC-V server-class CPUs and data-parallel accelerator silicon for AI and data-analytics workloads. | North America | Matrix Capital Management |
| Falcomm | Analog Semiconductors | April 2024 | Seed | $4M | Develops fabless silicon RF power-amplifier semiconductors for wireless communications. | North America | Squadra Ventures |
| SiMa.ai | Logic Semiconductors | April 2024 | Series B | $70M | Develops machine-learning systems-on-chip for power-efficient AI inference at the embedded edge. | North America | Maverick Capital |
| Hailo | Logic Semiconductors | April 2024 | Series C | $120M | Designs and sells dedicated edge-AI processors and vision accelerators for running neural-network workloads locally on devices. | Middle East | Zisapel family; Gil Agmon; Delek Motors; Alfred Akirov; DCLBA; Vasuki; OurCrowd; Talcar; Comasco; Automotive Equipment (AEV); Poalim Equity |
| CXMT | Memory Semiconductors | March 2024 | Growth Equity | ≈$1,496,000,000 | Develops and manufactures DRAM memory semiconductors through its ChangXin Memory Technologies operating business. | Asia-Pacific | Not disclosed |
| Celestial AI | Analog Semiconductors | March 2024 | Series C | $175M | Develops silicon-photonic and mixed-signal semiconductor technology for optical compute-to-compute and compute-to-memory interconnects. | North America | U.S. Innovative Technology Fund |
| e-peas | Power Semiconductors | March 2024 | Unknown | ≈$19,000,000 | Designs ultra-low-power energy-harvesting power-management ICs, microcontrollers and imaging chips. | Europe | Otium Capital |
| Innatera | Logic Semiconductors | March 2024 | Series A | ≈$16,300,000 | Develops ultra-low-power analog-mixed-signal neuromorphic processor chips for sensor-edge inference. | Europe | Not disclosed |
| NeuReality | Logic Semiconductors | March 2024 | Unknown | $20M | Develops the NR1 Network Addressable Processing Unit SoC and associated hardware for AI-inference data paths. | Middle East | Not disclosed |
| MUCSE | Logic Semiconductors | March 2024 | Series A | >$27,800,000 | Designs reconfigurable security chips and intelligent network-controller semiconductor chips. | Asia-Pacific | Ant Group |
| Quintessent | Analog Semiconductors | March 2024 | Seed | $11.5M | Develops heterogeneous silicon-photonic integrated devices and quantum-dot laser technology for high-speed optical interconnects. | North America | Osage University Partners |
| Efficient Computer | Logic Semiconductors | March 2024 | Seed | $16M | Develops highly energy-efficient programmable general-purpose processor chips based on its Fabric dataflow architecture. | North America | Eclipse |
| TopoLogic | Memory Semiconductors | February 2024 | Series A | $4.7M | Develops topological-material semiconductor devices, led by its TL-RAM nonvolatile memory technology. | Asia-Pacific | Not disclosed |
| Wise-integration | Power Semiconductors | February 2024 | Series B | $16.2M | Develops GaN power ICs and digital-control technology for high-density power conversion. | Europe | imec.xpand |
| Zenosic | Logic Semiconductors | February 2024 | Series A | Not Disclosed | Designs high-performance programmable Ethernet/network switching chips for data centers and communications equipment. | Asia-Pacific | Not disclosed |
| Core Vision Microelectronics | Sensor Semiconductors | February 2024 | Series C | Not Disclosed | Develops SPAD-based 1D and 3D direct time-of-flight optical sensor chips. | Asia-Pacific | Chengxin Venture Capital |
| XDLTEK | Logic Semiconductors | February 2024 | Series A | Not Disclosed | Develops reconfigurable parallel-processing and general-purpose GPU-class compute chips. | Asia-Pacific | Not disclosed |
| sensiBel | Sensor Semiconductors | February 2024 | Unknown | $7.6M | Develops and sells optical-readout MEMS microphone sensor devices. | Europe | Sennheiser |
| Uhnder | Sensor Semiconductors | February 2024 | Series D+ | $50M | Designs software-defined digital imaging radar-on-chip devices for automotive, industrial and defense sensing. | North America | ACME Capital |
| Recogni | Logic Semiconductors | February 2024 | Series C | $102M | Develops dedicated AI inference accelerator processors for generative AI and intelligent autonomous systems. | North America | Celesta Capital; GreatPoint Ventures |
| Meipusen | Power Semiconductors | February 2024 | Series A | Not Disclosed | Designs and sells silicon and SiC MOSFETs, IGBTs, diodes and other discrete power devices. | Asia-Pacific | Not disclosed |
| Point2 Technology | Analog Semiconductors | February 2024 | Series B | $22.6M | Designs ultra-low-power mixed-signal SerDes SoCs for high-speed data-center and automotive interconnects. | North America | Bosch Ventures; Molex |
| Chengling Microelectronics | Power Semiconductors | February 2024 | Seed | Not Disclosed | Develops high-performance power-management ICs including DC-DC, isolated-power and wireless-charging chips. | Asia-Pacific | Cowin Capital |
| Guibu Microelectronics | Sensor Semiconductors | February 2024 | Growth Equity | Not Disclosed | Designs 77GHz/4D millimeter-wave radar chips and integrated radar SoCs for automotive sensing. | Asia-Pacific | Bosch Ventures; Jinxin Capital |
| Acela Micro | Analog Semiconductors | February 2024 | Series C | Not Disclosed | Develops high-speed ADCs, DACs, clock-conditioning and RF signal-chain ICs. | Asia-Pacific | Beijing China Mobile Digital New Economy Industry Fund |
| YT Micro | Logic Semiconductors | February 2024 | Series B | Not Disclosed | Designs and sells automotive-grade 32-bit MCUs and high-performance control processors for vehicle electronics. | Asia-Pacific | China Structural Reform Fund |
| Rebellions | Logic Semiconductors | January 2024 | Series B | $124M | Designs fabless AI inference accelerator processors for data-center and high-performance computing workloads. | Asia-Pacific | KT Corporation |
| SEMRON | Logic Semiconductors | January 2024 | Seed | ≈$7,900,000 | Develops analog in-memory AI semiconductor chips using its memcapacitor-based CapRAM architecture. | Europe | JOIN Capital |
| VoxelSensors | Sensor Semiconductors | January 2024 | Seed | ≈$3,250,000 | Develops single-photon active-event semiconductor sensors for low-power 3D perception. | Europe | SFPIM Relaunch |
| SCALINX | Analog Semiconductors | January 2024 | Unknown | ≈$18,500,000 | Designs fabless mixed-signal SoCs centered on ultra-high-speed ADC and DAC technology. | Europe | Not disclosed |
| Osemi Technology | Analog Semiconductors | January 2024 | Seed | ≈$13,900,000 | Designs automotive millimeter-wave radar and UWB wireless SoCs. | Asia-Pacific | Lihe Capital |
| YunSilicon | Logic Semiconductors | January 2024 | Seed | >≈$13,900,000 | Designs network-interconnect ASICs for cloud data centers and large-scale computing infrastructure. | Asia-Pacific | Not disclosed |
| EpicMEMS | Analog Semiconductors | January 2024 | Series B | >$27,800,000 | Designs RF front-end semiconductor devices including acoustic filters and integrated RF front-end chips. | Asia-Pacific | Xienuo Investment |
| SiChain Semiconductor | Power Semiconductors | January 2024 | Series B | >$27,800,000 | Develops and commercializes SiC MOSFETs, diodes, bare dies and related power-semiconductor devices. | Asia-Pacific | Meituan DragonBall |
| Velinktech | Analog Semiconductors | January 2024 | Series B | >$13,900,000 | Designs fabless high-speed automotive A-PHY SerDes and in-vehicle networking communication chips. | Asia-Pacific | Wuyuefeng Capital |
| Mobilint | Logic Semiconductors | January 2024 | Series B | ≈$15,300,000 | Designs fabless NPUs and AI accelerator chips for edge inference. | Asia-Pacific | Not disclosed |
As this chart shows, and as featured in our semiconductor industry deck, search interest in semiconductors has been rising steadily
Semiconductor funding: what is actually changing in 2026?
Is semiconductor funding really booming right now?
Semiconductor funding is booming in dollars right now, but far fewer companies are sharing in that boom.
We counted 92 qualifying financings across 85 semiconductor companies in the current year-to-date period, for at least $13.45 billion of disclosed or conservatively measurable capital. That is almost four times the capital raised over the same stretch of 2025.
The strange part is that dealmaking moved the other way. The comparable 2025 period produced 111 deals across 108 companies. So while capital jumped 274%, deals fell 17% and the number of funded companies dropped 21%.
Round sizes explain most of that disconnect. The median priced round rose from $22.25 million last year to $40 million currently. The average shot from $45 million to $162 million because 2026 has produced an unusually thick layer of very large financings.
The comparison with 2024 is useful too. We found 77 deals and 73 funded companies over the equivalent period two years ago. Activity today is still comfortably above that level. What has changed most dramatically this year is how much money can now pile into a relatively small number of financings.
| Funding measure | 2026 YTD | 2025 same period | 2024 same period |
|---|---|---|---|
| Deals | 92 | 111 | 77 |
| Unique funded companies | 85 | 108 | 73 |
| Capital raised | ≥$13.45B | ≥$3.60B | ≥$5.45B |
| Capital excluding >$50M rounds | $778M | $1.20B | $736M |
| Capital excluding >$100M rounds | $1.21B | $1.45B | $1.11B |
| Median priced round | $40.0M | $22.25M | $21.8M |
| Average priced round | $162.1M | $45.0M | $92.4M |
| Largest round | $1.70B | $750M | $1.496B |
Would semiconductor funding still look strong without the giant rounds?
Semiconductor funding would actually be down versus last year if we removed the biggest rounds.
Below $50 million, we calculate only $778 million of capital this year, compared with about $1.20 billion over the same period in 2025. That is a 35% decline.
Even after raising the cutoff to $100 million, the result remains negative. Current capital below that level comes to roughly $1.21 billion versus $1.45 billion last year, down 17%.
That changes how the headline growth figure should be read. Ordinary venture financings have not suddenly become much easier or more plentiful. Most of the extra money sits in a new upper tier of $100 million, $300 million, $500 million and even billion-dollar rounds.
The unusual part is that this upper tier is no longer tiny. We counted 33 current financings above $100 million under our conservative treatment of round amounts, compared with just eight over the same stretch of 2025.
So today's funding surge survives the "one giant deal" test, but it fails the "broad boom" test.
This chart, featured in our semiconductor industry deck, shows annual venture capital investment in semiconductor startups
Is one company making semiconductor funding look bigger than it really is?
No. Semiconductor funding is heavily driven by megadeals these days, but there are too many of them for one company to explain the market.
Rapidus has the largest current financing in our research at $1.7 billion, followed by another $943 million financing later in the year. Those amounts are huge, yet the largest deal represents only around 13% of total current capital.
Several other companies are operating in the same extraordinary financing bracket. Tenstorrent raised roughly $1.29 billion. Positron announced an $875 million Series C. Etched raised $700 million. Ayar Labs closed a $500 million Series E before adding further capital later in the year, while MatX also raised about $500 million.
As of now, 39 rounds in our dataset exceed $50 million, compared with 12 during the equivalent 2025 period. The top five deals account for about 41% of current capital, which is actually lower than the top-five concentration we calculated for both 2025 and 2024.
That looks contradictory at first, but it isn't. The market has become much more dependent on large rounds overall, while dependence on the five very largest rounds has fallen because so many other companies are also raising nine-figure amounts.
| Large-round measure | 2026 YTD | 2025 same period | 2024 same period |
|---|---|---|---|
| Rounds above $50M | 39 | 12 | 16 |
| Rounds above $100M | 33 | 8 | 11 |
| $100M+ share of priced rounds | 41.0% | 10.0% | 18.6% |
| $100M+ share of disclosed capital | 91.8% | 59.7% | 79.6% |
| Top-1 share of capital | 12.6% | 20.8% | 27.4% |
| Top-3 share of capital | 29.2% | 34.4% | 58.8% |
| Top-5 share of capital | 40.9% | 46.8% | 66.6% |
Why are semiconductor startups raising so much money now?
Today's biggest semiconductor startups need enormous amounts of money to turn AI chips, optical interconnects and advanced manufacturing projects into products that can ship at scale.
Positron shows how quickly those requirements can ramp. The company announced a $50 million-plus Series A in 2025, followed by a $230 million Series B early in 2026 and an $875 million Series C later in the year. Positron says the latest capital is intended to bring its next-generation inference silicon to market and scale its systems business.
Etched offers another good example. The company said in August that it had shipped its first rack to Jane Street and raised another $700 million to accelerate production. Its own description of what comes next includes factories, global supply chains and gigawatt-scale deployment. Those are very different costs from funding a chip-design team before commercialization.
Ayar Labs is scaling another bottleneck: optical connectivity inside AI infrastructure. It raised $500 million to accelerate volume production of co-packaged optics, then announced another $150 million as it expanded manufacturing readiness and high-volume production plans.
Xsight Labs raised more than $300 million after gaining traction for connectivity silicon used in AI and cloud networks. The company explicitly tied the round to growing demand across hyperscalers, service providers and equipment manufacturers.
The funding market is following physical scale. Once a semiconductor company gets past the early technical-risk phase, commercial deployment can require manufacturing capacity, packaging, networking, validation, inventory and customer infrastructure. Hundreds of millions of dollars can disappear very quickly into that transition.
This chart, featured in our semiconductor industry deck, looks at TSMC’s strategy in semiconductors
Is AI really driving the semiconductor funding boom?
AI infrastructure is currently the clearest force behind the semiconductor funding boom, especially in compute and networking.
Logic Semiconductors account for 59 of the 92 current deals we researched and about $9.94 billion of capital. Their share of transactions rose from 44% last year to 64% today, while the median Logic round climbed from roughly $25 million to $135 million.
That pattern goes well beyond companies simply putting "AI" in a pitch deck. Positron is building inference silicon. Etched is scaling inference hardware. MatX is developing processors for AI training and inference. Ayar Labs is tackling the bandwidth and power constraints that appear when increasingly large AI systems need to connect chips together. Xsight Labs is selling high-speed connectivity silicon into AI and cloud networks.
Demand further down the infrastructure chain points in the same direction. NVIDIA announced $2 billion investments in both Lumentum and Coherent this year as part of agreements designed to expand optical capacity for next-generation AI infrastructure. Coherent subsequently reported record fiscal-year revenue and said AI data-center architectures were increasingly shifting toward optical connectivity.
AMD Ventures provides another useful window into what strategic investors are chasing today. Its current investment focus explicitly includes silicon technologies and high-performance interconnects, and AMD says it has invested more than $2 billion across AI.
We cannot attribute every large semiconductor round to AI, and Rapidus is an obvious example where national industrial policy plays a major role. Still, the category data and the companies receiving the biggest checks put AI compute and the infrastructure around it at the center of this financing cycle.
Is Logic Semiconductor taking over startup funding?
Logic Semiconductor has become the clear center of gravity in semiconductor startup funding.
Logic now represents almost two-thirds of the deals we found and roughly three-quarters of current capital. More importantly, it is gaining on both dimensions at once.
Its deal share increased by about 20 percentage points versus the comparable 2025 period. The category's median round also climbed to $135 million, roughly 5.4 times last year's level.
More Logic companies are raising, and the checks going into them are much larger.
Analog currently represents 15% of deals but only 2% of capital. Power accounts for almost 10% of transactions and less than 2% of funding. Sensors have dropped to four current deals. Memory is smaller again.
Foundry Services is the one category that rivals Logic on sheer capital intensity, although for a very different reason.
| Semiconductor category | Deals | Deal share | Capital | Capital share | Median round | Deal-share change vs 2025 |
|---|---|---|---|---|---|---|
| Logic | 59 | 64.1% | $9.94B | 73.9% | $135M | +20.0 pp |
| Analog | 14 | 15.2% | $264M | 2.0% | $22.9M | -5.5 pp |
| Power | 9 | 9.8% | $234M | 1.7% | $19.5M | -3.7 pp |
| Foundry Services | 4 | 4.3% | $2.92B | 21.7% | $598M | +3.4 pp |
| Sensor | 4 | 4.3% | $36M | 0.3% | $6.9M | -11.9 pp |
| Memory | 2 | 2.2% | $60M | 0.4% | $30.0M | -2.3 pp |
| Total | 92 | 100% | ≥$13.45B | 100% | $40M market median | — |
This chart, featured in our semiconductor industry deck, shows annual funding in semiconductor startups
Is there really a foundry startup boom?
The apparent foundry funding boom is mostly a Rapidus story for now.
We calculate about $2.92 billion of current Foundry Services capital, up from less than $30 million over the comparable period last year. That gives the category more than one-fifth of semiconductor funding despite only four transactions.
Rapidus accounts for roughly $2.64 billion of that amount.
The Japanese company completed a 267.6 billion yen financing worth about $1.7 billion early in the year, including capital from the Japanese government and dozens of private-sector companies. It then received another 150 billion yen, around $943 million, through Japan's Information-Technology Promotion Agency.
Rapidus says the funding is meant to support its move from R&D toward mass production of 2nm logic semiconductors in 2027.
The jump is real, but it is narrow. It shows that semiconductor manufacturing has become important enough for governments and large corporations to commit venture-sized and infrastructure-sized sums to individual projects. It does not show a large new population of privately financed foundry startups suddenly appearing.
Are semiconductor investors moving away from early-stage startups?
Semiconductor investors have moved noticeably toward later-stage companies, but early-stage funding is still alive.
Seed and Series A together represent 39.1% of current transactions, down from 42.3% over the same stretch last year. Later-stage deals rose much more sharply, from 36.9% to 47.8%.
Series C is where the change becomes easy to see. We counted 13 current Series C rounds compared with eight last year, and the median current Series C financing reached roughly $245 million.
Growth Equity also expanded from four deals to eight. Those eight financings alone account for more than $3.2 billion of capital.
Series D+ is small by volume, with five transactions, but carries a $300 million median. Meanwhile, Seed rounds have a median of only $3.4 million.
The market still funds companies at the beginning of the journey. The much bigger change is how aggressively capital piles into businesses once investors believe those companies are ready to commercialize and scale.
| Stage | Current deals | Deal share | 2025 deal share | Current capital | Median round |
|---|---|---|---|---|---|
| Seed | 16 | 17.4% | 18.9% | $129M | $3.4M |
| Series A | 20 | 21.7% | 23.4% | $1.74B | $45M |
| Series B | 18 | 19.6% | 19.8% | $2.14B | $63.5M |
| Series C | 13 | 14.1% | 7.2% | $2.64B | $244.5M |
| Series D+ | 5 | 5.4% | 6.3% | $2.34B | $300M |
| Growth Equity | 8 | 8.7% | 3.6% | $3.22B | $132M |
| Stage not established | 12 | 13.0% | 20.7% | $1.25B | $23.3M |
This chart, featured in our semiconductor industry deck, compares the main business model options for fabless semiconductor companies
Can a new semiconductor startup still get funded today?
Yes. New semiconductor startups are still entering the funding market, although their first checks are currently much smaller than the money flowing into established companies.
Our financing-history research identifies 17 first financings this year, equal to 18.5% of classified deals. The comparable share was only 13.6% last year.
So fewer total semiconductor deals have not translated into fewer first-time financings in proportional terms.
The size gap is huge, though. We calculate a $6.9 million median for first financings, down from $14 million last year. Follow-on rounds currently have a $90 million median, compared with $23.9 million previously.
First-financing capital totals around $180 million. Follow-ons account for roughly $13.27 billion.
Investors are still willing to fund new technical teams, but once a company has already raised, proved enough of its technology and found a believable route to commercial deployment, its access to capital can move into a completely different league.
We treat the first-financing classification as a researched funding-history indicator rather than a claim that every historical transaction for every company is publicly discoverable. The gap between initial and follow-on round sizes is large enough that this limitation does not change the basic picture.
Are giant semiconductor rounds only going to old companies?
No. Many of today's huge semiconductor rounds are going to surprisingly young companies.
The median company age at financing is currently four years among businesses for which we could establish a founding year. It was five years in the comparable 2025 period.
Even some later-stage recipients are younger than we might expect. Current Series C companies have a median age of around five years, compared with 7.5 years last year. Growth Equity recipients are around four years old at the median.
The category mix helps explain why. Logic companies currently have a median age of four years, while Power and Memory companies are around two. Analog businesses are much older at eight years.
Companies such as MatX, Etched and Positron illustrate how quickly funding can escalate when investors believe a young semiconductor company has a real shot at an AI infrastructure bottleneck.
These days, maturity in semiconductor funding is increasingly about technical and commercial milestones rather than simply years since incorporation.
This chart, featured in our semiconductor industry deck, shows the revenue mix across customer segments in the semiconductor industry
Is semiconductor startup funding shifting from China to the US?
Yes. Semiconductor deal activity has swung sharply toward the United States this year while Chinese funding activity has dropped.
We counted 32 current U.S. deals, almost twice the 17 found over the same stretch of 2025. China moved from 63 deals last year to 17 currently.
At the regional level, North America's deal share rose from 17.1% to 38.0%. Asia-Pacific fell from 62.2% to 39.1%.
That is too large a shift to explain through one or two megarounds.
Japan looks very different. It has only three current deals in our research but about $2.65 billion of recorded capital because Rapidus is so large. Japan therefore has extraordinary capital intensity without broad startup activity.
Europe presents another useful contrast. We found exactly 20 European deals in both periods, but capital increased from roughly $381 million to $1.76 billion. European semiconductor companies are not raising more often; the rounds themselves have become much larger.
The current geographic shift therefore has several layers: more U.S. transactions, far fewer Chinese transactions, unusually concentrated Japanese capital and much larger European checks.
| Region | 2026 deal share | 2025 deal share | 2024 deal share | Change vs 2025 | Current capital share |
|---|---|---|---|---|---|
| North America | 38.0% | 17.1% | 19.5% | +20.9 pp | 48.5% |
| Asia-Pacific | 39.1% | 62.2% | 61.0% | -23.0 pp | 36.2% |
| Europe | 21.7% | 18.0% | 16.9% | +3.7 pp | 13.0% |
| Middle East | 1.1% | 2.7% | 2.6% | -1.6 pp | 2.2% |
| United States | 32 deals | 17 deals | 15 deals | +15 deals | — |
| China | 17 deals | 63 deals | 35 deals | -46 deals | — |
| Europe | 20 deals | 20 deals | — | No change | $1.76B |
Are corporate investors piling into semiconductor startups now?
Strategic investors are much more visible in semiconductor funding again, especially around AI logic and connectivity.
We found corporate or other strategic investors in 39 current financings, or 42.4% of all deals. Their share was only 29.7% over the same part of 2025.
Their checks have changed even more. The median strategic-backed financing rose from about $24 million last year to $145 million currently.
Logic accounts for 28 of those 39 strategic-backed deals. The participation is also spread across Series A, Series B and Series C rather than appearing only after companies become mature.
Recent corporate actions fit that pattern closely. NVIDIA's $2 billion investments in Lumentum and Coherent were paired with capacity and technology agreements around advanced optics for AI infrastructure. Ayar Labs says its strategic backers include AMD, Intel, MediaTek and NVIDIA. NVIDIA also joined iPronics' recent $125 million round for programmable optical networking.
We see the same theme from the investor side. AMD Ventures explicitly describes compute, memory, power management, packaging and interconnects as core parts of its current AI investment strategy.
Corporate capital is showing up where strategic supply-chain value is becoming obvious: compute silicon, optical links, advanced packaging and other pieces that determine how much AI infrastructure can actually be built.
This chart, featured in our semiconductor industry deck, shows how advanced foundry node manufacturing technology has evolved over time
Are the same semiconductor investors funding everything?
No. The semiconductor lead-investor pool remains broad, but repeat investors are showing up much more often this year.
We identified 82 unique disclosed lead or co-lead investors currently, very close to the 85 found during the same 2025 period.
What changed is repeat activity. Eight lead investors appear on more than one current deal, compared with only two last year.
Maverick Silicon appears five times in our research. Innovation Industries, Matter Venture Partners and Seligman Ventures appear three times each. Atreides Management, Jane Street, SemiAnalysis Capital and Valor Equity Partners each show up twice.
Jane Street is particularly interesting because its role extends beyond writing checks. Etched said Jane Street led its $700 million financing after testing the company's hardware, and Etched had already shipped its first rack to the firm. Jane Street also co-led MatX's roughly $500 million financing.
Investor disclosure is better this year too: we could identify a disclosed lead in about two-thirds of deals, up from 55% last year. That makes the rise in repeat participation harder to explain away as a data-availability quirk.
The market still has plenty of investor breadth. What seems to be increasing is conviction: a subset of investors is making repeated bets across semiconductor infrastructure rather than appearing once and moving on.
Which semiconductor categories are getting left behind?
Sensors have lost the most deal momentum, while Analog has suffered the biggest drop in capital relevance.
Sensor companies represent only 4.3% of current transactions, down almost 12 percentage points from last year. We found four current Sensor deals carrying only around $36 million in total capital.
Analog remains much more active, with 14 deals, but its deal share fell by 5.5 points and its capital share dropped by more than 18 points.
Power is still present with nine transactions, although those deals amount to only about $234 million. Memory currently has two financings worth roughly $60 million.
These categories do not look dead. They are simply being dwarfed by what has happened in Logic.
A $20 million or $30 million financing that would normally look substantial now sits beside repeated $300 million, $500 million and billion-dollar rounds in AI compute and semiconductor infrastructure. The center of gravity can move fast when that happens.
In our semiconductor industry deck, we identify pain points entrepreneurs should prioritize
Has semiconductor funding already beaten the last two full years?
Current semiconductor funding has already exceeded the capital raised during both full-year 2025 and full-year 2024 in our research.
Capital raised so far equals roughly 168% of our full-year 2025 total and 119% of the 2024 figure.
Yet current deal count represents only around 60% of all deals recorded in 2025 and 74% of those recorded in 2024.
That comparison is more revealing than simply calling this a "record year." We are comparing a partial year with complete years, so we would not annualize the figure or assume that the current pace continues.
What we can say confidently is that the market has already absorbed more capital while completing far fewer transactions.
Whatever happens next, 2026 has already become an unusually capital-intensive semiconductor funding year.
So what is actually changing in semiconductor funding?
Semiconductor funding is becoming a two-speed market: ordinary financings remain competitive, while companies tied to AI compute, interconnects and manufacturing scale can now raise extraordinary amounts.
The biggest change is round size rather than startup participation. Fewer companies have raised than last year, yet the median financing has increased sharply and the number of nine-figure rounds has exploded.
The megadeal effect is strong enough to reverse the direction of the market. Strip out rounds above $50 million and year-on-year funding turns negative. At the same time, dozens of companies now clear that threshold, so dismissing the whole cycle as one freak transaction would also be wrong.
Investor attention has rotated strongly toward Logic Semiconductors. Foundry Services has also absorbed enormous capital, although Rapidus accounts for most of that story. Sensors, Analog and several smaller categories have lost relative ground.
Capital is moving further toward scaling companies. Later-stage financings take a much larger share of activity, while follow-on rounds are several times larger at the median than first financings. New startups can still get backed, but they are playing in a very different funding bracket.
The geographic picture has shifted too. U.S. transaction activity is much stronger, Chinese deal count has fallen sharply, Europe is seeing larger checks without more deals, and Japan's headline capital is dominated by one strategically important manufacturing project.
Strategic investors are also playing a bigger role, particularly in the infrastructure surrounding AI compute. Recent activity from NVIDIA, AMD and other corporate investors shows why optical connectivity, packaging and specialized silicon are attracting capital far beyond traditional venture investors.
For now, the clearest description is a capital-intensity boom rather than a broad startup boom. Investors are paying unprecedented amounts for companies they believe can remove real bottlenecks in AI infrastructure, while the rest of the financing market looks much more ordinary.
This chart, featured in our semiconductor industry deck, shows the revenue mix across Europe, Asia, North America, Africa, and South America in the semiconductor industry
OUR METHODOLOGY
This analysis tracks private-company semiconductor financings announced from January 1 through September 21, 2026 and compares them primarily with the same January 1-September 21 windows in 2025 and 2024. Full-year 2025 and 2024 totals are used only as secondary context where noted.
We use a strict semiconductor market definition. A company needed to have semiconductors, semiconductor IP, foundry services, chip-related interconnect technology or another clearly semiconductor-centered activity as an overwhelming part of its core business at the time of financing. Borderline companies were excluded rather than stretched into the dataset.
The core funding totals include qualifying private-company equity financings announced inside the comparison window. Debt, loans, grants, public offerings, unconverted convertible instruments, SAFEs and transactions whose equity component could not be isolated reliably were excluded from the main capital calculations.
Each genuinely separate financing was counted once. Duplicate articles or database entries describing the same financing were consolidated, while extensions, additional closes and separate tranches were reviewed individually to determine whether they represented a new financing or another report of the same transaction.
We recorded dates, stages, investors, financing history, company age and other deal characteristics only when public evidence supported them. We did not infer a Series stage from round size, assume that a prominent investor was the lead investor, or invent an exact amount when a source disclosed only a range, lower bound or no figure.
Quality control included a separate audit of date boundaries, transaction type, semiconductor eligibility, duplicate reports and major outliers. Duplicate or overlapping reports for Anabatic Semiconductor, Sunrise and YXME were consolidated; a YMTC Holding disclosure was excluded from current-period activity because the underlying investment decision predated the comparison window; and Longsailing Semiconductor remained in deal counts but was excluded from calculations requiring one precise amount.
Xsight Labs was treated as a financing above $300 million after the company's own announcement confirmed that threshold. More generally, lower bounds and ranges were preserved as uncertainty rather than forced into exact estimates, which is why several totals are expressed as "at least" figures.
We prioritized first-hand company and investor announcements, government and regulatory records, established financial and industry reporting, and funding databases used as cross-checks. Key sources include Rapidus on its February 2026 financing and 2nm production plan, Rapidus on the additional June 2026 financing, Positron's official press archive, Xsight Labs on its $300 million-plus financing, Etched on its $700 million financing and first Jane Street deployment, and Ayar Labs on its $500 million Series E.
For the strategic-investor and AI-infrastructure sections, we also used AMD Ventures' stated investment focus, NVIDIA's Lumentum partnership announcement, NVIDIA's Coherent partnership announcement, the related Coherent SEC filing and Lumentum SEC filing, plus iPronics' September 2026 financing announcement.
This chart, featured in our semiconductor industry deck, shows annual venture capital investment in semiconductor startups