What are the latest funding trends in Data Center Cooling?

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Summary
The latest funding trend in Data Center Cooling is a genuine broadening in funded companies, but the surge in dollars is heavily concentrated in DCX and ZutaCore.
Seven companies have raised money in the current comparable period, versus four a year earlier and only two two years ago. That widening of the funded-company base is more convincing than the headline 409% increase in capital.
Funding reached $314.9 million, but DCX and ZutaCore alone account for $276 million, or 87.7% of the total. Remove rounds above $50 million and current funding is actually 37.2% below the comparable 2025 level.
The market has developed an unusually sharp barbell. Three of seven rounds are below $5 million, while two $100 million-plus transactions absorb nearly nine-tenths of all capital.
That split explains one of the strangest current trends: the median round has fallen from $24 million to $5.9 million even as the average has more than doubled to $45 million.
Younger companies are getting a real shot. Seed financings now represent 42.9% of current deals, and the estimated median company age at financing has dropped to roughly 2.8 years from 5.9 years a year earlier.
Direct-to-chip cooling has the broadest funding activity, with four of seven deals, but it does not dominate the dollars. DCX's single CDU transaction is larger than the entire direct-to-chip category.
The technology mix is also widening. Two years ago the comparable dataset was entirely immersion cooling; today direct-to-chip systems, CDUs, immersion cooling and heat-rejection technologies are all represented.
Large strategic checks are becoming much more important. Carrier, Mitsubishi Electric, Samsung Ventures and LITEON are treating cooling as part of the wider AI infrastructure stack, where thermal design increasingly intersects with chips, racks and power delivery.
Europe currently leads by capital, but that result is fragile because DCX supplies most of the region's funding. The cleaner geographic trend is that deal activity is appearing across Europe, North America and Asia-Pacific.
Overall, Data Center Cooling funding is stronger today because more companies and more technical approaches are finding investors. What has not improved nearly as much is ordinary-sized fundraising: the market is busier at the bottom, much richer at the top, and surprisingly thin in between.
Written by the New Market Pitch teamWe track new markets so founders and investors can move faster. About us

One event can change the funding picture overnight. Our data center cooling market report tracks the moments that moved the money.
All funding deals in the Data Center Cooling Market over the last years
Below is the table listing all the deals. You can find our methodology at the end of this page.
If you want a deeper understanding of the market and its current dynamics, get our report covering the Data Center Cooling Market.
| Company | Category | Date | Stage | Deal size | What they do | Region | Lead investors |
|---|---|---|---|---|---|---|---|
| DCX Liquid Cooling Systems (DCX POLSKA Sp. z o.o.) | Cooling Distribution Units | September 2026 | Growth Equity | $176M | Designs and manufactures liquid-cooling infrastructure for AI and HPC data centers, centered on CDUs/FDUs alongside cold plates and immersion systems. | Europe | LITEON Technology |
| MicroRefrigeration, Inc. | Direct-to-Chip Liquid Cooling | August 2026 | Unknown | $4.1M | Develops proprietary vapor-compression cooling hardware for removing heat directly from high-power components inside AI servers. | North America | Not disclosed |
| KuhlTherm Private Limited | Direct-to-Chip Liquid Cooling | July 2026 | Seed | $1.1M | Develops full-stack liquid-cooling systems for AI and high-density data centers, including cold plates, RDHx, CDUs and immersion systems. | Asia-Pacific | Arkam Ventures |
| ZutaCore | Direct-to-Chip Liquid Cooling | June 2026 | Series C | $100M | Develops waterless two-phase direct-to-chip liquid-cooling systems for high-density AI and HPC data centers. | North America | Mitsubishi Electric |
| Iceotope Group | Immersion Cooling | May 2026 | Series B | $26M | Develops and licenses chassis-level dielectric liquid-cooling technology that removes heat directly from AI and HPC server components. | Europe | Two Seas Capital; Barclays Climate Ventures |
| Enaxiom | Chillers & Heat Rejection | May 2026 | Seed | $1.8M | Develops HydroCool, a heat-rejection system for AI data centers that reduces cooling energy use and recovers usable water. | Asia-Pacific | Epic Angels |
| MegaCool Technologies | Direct-to-Chip Liquid Cooling | February 2026 | Seed | ≈$5,900,000 | Develops generative-engineered direct-to-chip liquid-cooling cold plates for high-density AI and HPC data centers. | Europe | Vsquared Ventures |
| Accelsius | Direct-to-Chip Liquid Cooling | January 2026 | Series B | $65M | Develops two-phase direct-to-chip liquid-cooling systems for high-density AI and HPC data centers. | North America | Johnson Controls |
| YxinData (Beijing Yixintong Technology Co., Ltd.) | Cooling Distribution Units | December 2025 | Series B | >$14,200,000 | Develops full-stack data-center liquid-cooling hardware and systems including CDUs, manifolds, cold-plate and immersion solutions. | Asia-Pacific | Not disclosed |
| Corintis | Direct-to-Chip Liquid Cooling | December 2025 | Series A | $25M | Develops microfluidic direct-to-chip and in-chip liquid-cooling hardware for high-power AI and HPC processors. | Europe | Applied Digital |
| Corintis | Direct-to-Chip Liquid Cooling | September 2025 | Series A | $24M | Develops microfluidic direct-to-chip cold plates and co-packaged liquid cooling for high-power data-center processors. | Europe | BlueYard Capital |
| Guangzhou Hashcool Technology Co. Ltd. | Direct-to-Chip Liquid Cooling | September 2025 | Series A | Not Disclosed | Develops liquid-cooling systems and components for data centers and high-density computing, including cold plates, CDUs, manifolds and immersion systems. | Asia-Pacific | Wanlian Capital |
| Shenzhen Green Cloud Map Technology Co., Ltd. (深圳绿色云图科技有限公司) | Immersion Cooling | June 2025 | Unknown | ≈$7,900,000 | Designs, manufactures and delivers liquid-cooling systems and integrated cooling solutions for data centers. | Asia-Pacific | Not disclosed |
| ZutaCore | Direct-to-Chip Liquid Cooling | February 2025 | Unknown | $30M | Develops waterless two-phase direct-to-chip liquid cooling systems for high-density AI and HPC data centers. | North America | Carrier Ventures |
| Accelsius | Direct-to-Chip Liquid Cooling | November 2024 | Series A | $24M | Develops two-phase direct-to-chip liquid cooling systems for high-density data-center, AI and HPC infrastructure. | North America | Innventure |
| Submer | Immersion Cooling | October 2024 | Series C | $55.5M | Develops immersion-cooling systems that submerge data-center IT equipment in dielectric coolant for high-density computing. | Europe | M&G |
| LiquidStack Holding B.V. | Immersion Cooling | September 2024 | Series B | $20M | Provides direct-to-chip and immersion liquid-cooling systems, including CDUs, for data centers and high-performance computing. | North America | Tiger Global Management |

Funding is rarely spread evenly. See who's soaking up the capital in our data center cooling market report.
Is Data Center Cooling funding really booming right now?
Data Center Cooling funding is clearly more active today, although the typical financing has actually become much smaller.
We counted seven funded companies in the current comparable period, up from four a year earlier and two two years earlier. Because all seven financings went to different companies, the increase reflects genuinely broader deal activity rather than repeated rounds by the same names.
The dollar figure looks even stronger: $314.9 million of known capital versus $61.9 million a year earlier. But the median disclosed round moved the other way, falling from $24 million to $5.9 million. The average jumped to $45 million only because a couple of very large transactions pulled it upward.
The market today is broader, but the distribution of money is far more uneven.
| Funding measure | 2026 YTD | 2025 comparable | 2024 comparable | Change vs 2025 |
|---|---|---|---|---|
| Deals | 7 | 4 | 2 | +75.0% |
| Unique funded companies | 7 | 4 | 2 | +75.0% |
| Known capital | $314.9M | $61.9M | $75.5M | +408.7% |
| Median disclosed round | $5.9M | $24.0M | $37.75M | -75.4% |
| Average disclosed round | $45.0M | $20.6M | $37.75M | +118.1% |
| Largest round | $176M | $30M | $55.5M | +486.7% |
| Companies with multiple rounds | 0 | 0 | 0 | No change |
Is the Data Center Cooling funding surge mostly coming from a couple of huge deals?
Yes. Most of the increase in Data Center Cooling funding currently comes from DCX and ZutaCore.
DCX's announced $176 million strategic investment represents 55.9% of current capital by itself. ZutaCore adds another $100 million. Together, those two transactions account for $276 million, or 87.7% of all the money we counted this year.
Removing DCX still leaves $138.9 million, comfortably ahead of the comparable 2025 total. So the increase does have a second leg through ZutaCore rather than depending entirely on one unusual transaction.
Remove both rounds above $50 million, however, and current funding falls to $38.9 million. A year earlier, comparable disclosed capital was $61.9 million.
The headline makes fundraising conditions for the average cooling company look considerably stronger than they really are.
Would Data Center Cooling funding still be up without the biggest rounds?
Data Center Cooling funding would actually be down year over year if we remove rounds above $50 million.
Current capital drops from $314.9 million to $38.9 million under that test, versus $61.9 million during the same period a year earlier. That is a 37.2% decline.
The result changes if we remove only rounds strictly above $100 million because ZutaCore's $100 million Series C remains in the calculation. Current funding then comes to $138.9 million.
Investors are putting much larger sums behind a small number of companies, while financing across ordinary-sized rounds has not strengthened in the same way. The 2026 market is richer at the top and busier at the bottom.
| Outlier test | 2026 YTD | 2025 comparable | 2024 comparable | 2026 vs 2025 |
|---|---|---|---|---|
| Known capital | $314.9M | $61.9M | $75.5M | +408.7% |
| Excluding >$50M rounds | $38.9M | $61.9M | $20.0M | -37.2% |
| Excluding >$100M rounds | $138.9M | $61.9M | $75.5M | +124.3% |
| Median round | $5.9M | $24.0M | $37.75M | -75.4% |
| Top-1 capital share | 55.9% | 48.5% | 73.5% | Higher |
| Top-3 capital share | 95.9% | 100% | 100% | Extremely high |
| $100M+ rounds | 2 | 0 | 0 | New this year |

When the price drops below the right threshold, everything speeds up. We track it closely in our data center cooling market report.
Are more Data Center Cooling startups actually getting funded today?
Yes. More Data Center Cooling companies are raising money now, and that increase survives every outlier test.
Seven companies received financing in the current period, compared with four a year earlier. We also see a much wider group of businesses: MegaCool raised about $5.9 million, KuhlTherm $1.1 million, Enaxiom $1.8 million, MicroRefrigeration roughly $4.1 million, Iceotope $26 million, ZutaCore $100 million and DCX $176 million.
That mix ranges from young engineering startups to established cooling platforms and a strategic growth investment. It is much broader than the two-company 2024 comparable period.
The improvement by company count is therefore more convincing than the fourfold increase in total dollars. More businesses are finding investors, even though most are raising nowhere near the amounts going into the two largest companies.
Why has the typical Data Center Cooling round become so much smaller?
The typical Data Center Cooling round is smaller because several very young companies have entered the funding market with Seed-sized checks.
Three current rounds are below $5 million: KuhlTherm at $1.1 million, Enaxiom at $1.8 million and MicroRefrigeration at roughly $4.1 million. MegaCool adds another deal at approximately $5.9 million.
Then the distribution jumps sharply. Iceotope raised $26 million, ZutaCore $100 million and DCX $176 million.
That is how you end up with a $5.9 million median and a $45 million average. There are really two funding markets here: relatively modest checks for emerging technologies and unusually large checks for companies that investors already view as strategically important.
Has Data Center Cooling become a barbell funding market?
Yes. Data Center Cooling financing currently has a pronounced barbell shape, with many small rounds and almost all the money concentrated at the other end.
Rounds below $5 million account for three of seven transactions, or 42.9% of current activity, but just 2.2% of capital. The two $100 million-plus deals make up 28.6% of transactions and absorb 87.7% of the money.
The middle is surprisingly thin. There is one financing between $5 million and $20 million, one between $20 million and $50 million, and nothing between $50 million and $100 million.
As seen above, the falling median and rising average are two sides of that same pattern.
| Deal size | 2026 deals | Deal share | Capital share | 2025 deals |
|---|---|---|---|---|
| <$5M | 3 | 42.9% | 2.2% | 0 |
| $5M–<$20M | 1 | 14.3% | 1.9% | 1 |
| $20M–<$50M | 1 | 14.3% | 8.3% | 2 |
| $50M–<$100M | 0 | 0% | 0% | 0 |
| $100M+ | 2 | 28.6% | 87.7% | 0 |
| Disclosed rounds | 7 | 100% | 100% | 3 |
| Undisclosed rounds | 0 | - | - | 1 |

Not every part of this market gets the same attention from investors. Our data center cooling market report shows where the money goes.
Are new Data Center Cooling startups getting a real shot at funding?
Yes, but new Data Center Cooling startups are mostly getting small checks rather than large pools of capital.
Three of the seven current transactions are first financings in our financing-history review. There were two in the comparable 2025 period and none two years earlier.
At first glance, the capital behind first financings looks enormous: $183 million today. DCX alone contributes $176 million of that figure, despite being founded in 2019. The other two first financings together account for only $7 million.
Company count is more useful than total capital here. New names are entering the funded universe, but there is no broad wave of heavily financed new entrants.
Are younger Data Center Cooling companies breaking through now?
Yes. Data Center Cooling funding has shifted noticeably toward younger companies.
Our estimated median company age at financing moved from roughly 10.7 years in the 2024 comparable period to 5.9 years a year later and about 2.8 years currently.
The current Seed rounds are especially young, with a median age close to one year. MegaCool and KuhlTherm are recent entrants, while Enaxiom is only a few years old.
The larger checks still tend to sit with more mature companies such as ZutaCore and DCX, so younger businesses are widening the deal pipeline rather than taking over the capital pool. For founders, that is still encouraging: investors are willing to fund technologies before they have years of operating history behind them.
Is direct-to-chip cooling where investors are putting their money now?
Direct-to-chip cooling is currently where we see the most funded companies, although its dominance is much stronger in deal count than in dollars.
Four of seven current financings fall into direct-to-chip cooling, giving the category 57.1% of deals. Those companies raised $111.1 million, or 35.3% of total capital.
ZutaCore explains $100 million of that amount. MegaCool, KuhlTherm and MicroRefrigeration collectively account for a much smaller sum, which shows how much experimentation is happening underneath the category leader.
Direct-to-chip also represented 75% of deals a year earlier. Its absolute deal count has risen from three to four, but its market share has fallen because other cooling approaches are now raising money too.
Is the huge jump in CDU funding real?
The jump in Cooling Distribution Unit funding is real in dollar terms, but today it comes from one company: DCX.
DCX accounts for the entire $176 million attributed to the CDU category in the current period. That gives CDUs 55.9% of market capital despite representing only one of seven deals.
LITEON's announcement helps explain why the transaction is so large. The company said its investment would combine DCX's CDUs, facility distribution units, cold plates and immersion systems with LITEON's AI-server power management, rack-level power delivery and 800VDC architecture.
That is a much broader industrial proposition than financing a single cooling component. DCX sits close to the intersection of power infrastructure and thermal infrastructure, which makes the company strategically relevant to a large hardware supplier.
We would not treat the $176 million as evidence that CDU startups as a group are suddenly attracting giant rounds.

Market size is where every investment case starts. Get the full picture in our data center cooling market report.
Is immersion cooling losing ground to direct-to-chip systems?
Immersion cooling has clearly lost relative funding share, while the wider Data Center Cooling market has become more technologically diverse.
Both deals in the comparable 2024 period were classified as immersion cooling. Today, immersion accounts for one of seven financings: Iceotope's $26 million Series B.
Iceotope also shows why a simple winner-versus-loser story would be too neat. The company raised fresh capital to push product engineering, patents and ecosystem partnerships around next-generation AI infrastructure. Investors are still backing immersion-related technology; they simply have more alternatives to choose from now.
Direct-to-chip systems, CDUs and heat-rejection technology have all appeared alongside immersion in the current period. The bigger change is the widening of the cooling stack.
| Category | 2026 deals | Deal share | Capital | Capital share |
|---|---|---|---|---|
| Direct-to-Chip Liquid Cooling | 4 | 57.1% | $111.1M | 35.3% |
| Cooling Distribution Units | 1 | 14.3% | $176.0M | 55.9% |
| Immersion Cooling | 1 | 14.3% | $26.0M | 8.3% |
| Chillers & Heat Rejection | 1 | 14.3% | $1.8M | 0.6% |
| Total current deals | 7 | 100% | $314.9M | 100% |
| Categories represented today | 4 | - | - | - |
| Categories represented in comparable 2024 | 1 | - | - | - |
Are early-stage Data Center Cooling startups finally getting funded?
Early-stage Data Center Cooling funding is much more visible today, although the dollars going into those startups remain small.
Three current deals are Seed rounds, representing 42.9% of all transactions. Together, they raised only $8.8 million, or 2.8% of the market's current disclosed capital.
At the other end, the Series C and Growth Equity transactions alone account for $276 million. Add Iceotope's $26 million Series B and most of the capital pool is already spoken for.
Early-stage companies have gained access to the market by count. The large pools of money still sit with businesses that have moved further along commercially or have obvious strategic value.
Are Data Center Cooling investors becoming pickier?
Data Center Cooling investors look more selective about where they commit large checks, even while they fund a wider range of companies.
We see more funded businesses, more Seed rounds and more technical categories than in previous comparable periods. At the same time, ordinary-sized capital below $50 million has weakened year over year, while two companies absorb nearly nine-tenths of current dollars.
Investors appear willing to finance new engineering ideas cheaply, then commit much more heavily once a company has stronger commercial evidence or strategic relevance.
The financing patterns around ZutaCore, DCX and Iceotope fit that reading. ZutaCore is scaling commercialization and deployments, DCX attracted an industrial investor sitting directly next to cooling in the infrastructure stack, and Iceotope is using a larger institutional Series B to push product and ecosystem development.
We still have a small sample, so selectivity is a better description of current behavior than a permanent market rule.

Still early or already mainstream? Our data center cooling market report answers that with real numbers.
Why are big industrial companies investing in Data Center Cooling now?
Industrial investors are paying more attention to Data Center Cooling because cooling is becoming tightly connected to how AI racks, power systems and chips are designed.
NVIDIA's current rack-scale products make that easy to see. The GB200 NVL72 was designed as a liquid-cooled 72-GPU system, and NVIDIA now also describes its GB300 NVL72 as a fully liquid-cooled rack-scale architecture. Cooling increasingly arrives with the computing platform rather than being treated as an afterthought at the facility level.
Carrier's behavior points in the same direction. After leading an investment in ZutaCore in 2025, Carrier expanded that investment in 2026 and said high-density AI was making thermal management a constraint on scaling. Mitsubishi Electric and Samsung Ventures also participated in ZutaCore's $100 million Series C.
LITEON's move into DCX adds a second example from the power side. Its stated goal is to combine rack-level electrical infrastructure with liquid cooling.
These companies are starting to treat thermal management as part of the core AI infrastructure stack, and that makes the stronger cooling platforms much more strategically valuable.
Are strategic investors taking over Data Center Cooling funding?
Strategic investors are not appearing in more Data Center Cooling deals, but the deals they back have become dramatically larger.
Two of seven current financings include strategic investors, compared with two of four during the comparable 2025 period. Their share of transactions has therefore fallen from 50% to 28.6%.
The size picture goes the opposite way. ZutaCore's $100 million Series C and DCX's $176 million transaction produce a $138 million median across the two current strategically backed deals. The comparable strategic median a year earlier was roughly $19 million.
Corporate capital these days appears much more targeted. Large industrial groups are concentrating on companies that can slot directly into their own data-center, power or thermal-management platforms.
Is Europe becoming the center of Data Center Cooling funding?
Europe currently leads Data Center Cooling funding by dollars, although DCX explains most of that lead.
Three of seven current deals involve European companies, compared with two in North America and two in Asia-Pacific. Europe therefore has the largest deal share at 42.9%.
Its $207.9 million of capital looks much more dominant, representing 66% of the market. DCX supplies $176 million of that amount. Without DCX, Europe falls to $31.9 million.
North America has only two current deals but $104.1 million of capital, largely through ZutaCore. Asia-Pacific has two financings and just $2.9 million.
Geographic deal activity is broadening. The capital ranking between regions is still highly dependent on individual companies.

Investors don't value every company the same way. Our data center cooling market report explains who gets the premium and why.
Is the Data Center Cooling investor base getting broader?
Yes. More lead investors are showing up in Data Center Cooling funding today, with no single firm repeatedly controlling the market.
We identified seven distinct disclosed lead or co-lead investors across six of the seven current deals. The comparable 2025 period had three disclosed leads across three of four transactions.
The current group includes Vsquared Ventures, Epic Angels, Two Seas Capital, Barclays Climate Ventures, Mitsubishi Electric, Arkam Ventures and LITEON. They span traditional venture investors, climate-focused investors and industrial companies.
That mix reinforces what we see on the company side: the cooling market is attracting a wider set of participants. The dollars remain concentrated, but the group willing to write at least one check is becoming more varied.
Has Data Center Cooling funding already beaten last year?
Data Center Cooling has already matched the previous full year's deal count and surpassed its known capital total, although DCX makes the dollar comparison look much stronger.
After assigning Accelsius's $65 million Series B to its actual 2025 closing period, we count seven full-year 2025 deals across six companies and at least $166.1 million of known or lower-bound capital.
The current period already has seven deals and $314.9 million. That is roughly 190% of the previous full-year known capital before the current year is finished.
Without DCX, current funding would stand at $138.9 million, around 84% of the previous full-year amount. Deal activity has unquestionably caught up quickly; the claim that overall funding has nearly doubled depends much more heavily on one large transaction.
Why is Data Center Cooling attracting so much attention these days?
Data Center Cooling is getting more attention because AI infrastructure is pushing heat, power density and cooling design into the same engineering conversation.
NVIDIA's liquid-cooled rack-scale systems are one obvious example. Carrier said in 2026 that rising AI chip densities were increasing demand for advanced cooling. ZutaCore said its $100 million round would support commercialization as bookings and deployments expanded. Iceotope raised $26 million to develop products and ecosystem partnerships around next-generation AI infrastructure. Enaxiom is taking a different route by tackling the heat-rejection layer and water use.
Those companies are solving different pieces of the same physical problem: more compute is being packed into increasingly dense infrastructure.
That helps explain why funding is expanding across direct-to-chip systems, CDUs, immersion technologies and heat rejection at the same time. Investors are financing several parts of a thermal stack that is becoming more important as AI hardware gets denser.

Market size is where every investment case starts. Get the full picture in our data center cooling market report.
What is actually changing in Data Center Cooling funding?
Data Center Cooling funding is genuinely getting broader, while the increase in capital remains heavily concentrated.
The strongest development is the rise in funded companies. Seven businesses have raised in the current comparable period versus four a year earlier and two two years earlier. Younger companies and Seed rounds are also appearing much more often.
The second major change is the split between small and very large rounds. As pointed out above, three sub-$5 million financings coexist with two $100 million-plus transactions. That is why the median has fallen even while headline funding has surged.
Investor attention is also spreading across more technologies. Direct-to-chip cooling currently leads by company count, but CDUs, immersion cooling and heat-rejection systems are all represented. The market has moved well beyond the immersion-heavy picture we saw two years ago.
The biggest dollars increasingly have strategic logic behind them. ZutaCore and DCX attracted industrial investors whose businesses sit next to thermal management in HVAC, electronics, server power and rack infrastructure.
The apparent European funding boom deserves the most caution because one Polish company provides roughly 85% of Europe's current capital. The same caution applies to the headline market growth rate: remove the rounds above $50 million and year-over-year capital growth disappears.
Overall, today's market is seeing a real expansion in deal activity and technical breadth, paired with much tougher concentration at the dollar level. More companies are getting funded, but only a few are currently convincing investors to write very large checks.
| Importance | What has changed | Our read |
|---|---|---|
| Highest | More companies are getting funded | Clearly stronger |
| Very high | Headline capital has surged | Mostly driven by DCX and ZutaCore |
| Very high | Typical rounds have become smaller | Clear from the median |
| High | Seed and young-company activity has increased | Genuine pipeline expansion |
| High | Funding now spans more cooling architectures | Broader than in 2024 |
| High | Strategic capital is becoming much larger | Concentrated around mature assets |
| Watch carefully | Europe leads current capital | Heavily dependent on DCX |
Our methodology
This analysis measures the latest funding trends in Data Center Cooling using comparable fundraising activity from January 1 through October 7, 2026, against the same periods in 2025 and 2024. Full-calendar-year figures are used only when they add useful context and are kept separate from the like-for-like YTD comparison.
We built the dataset from company and investor announcements, regulatory filings, official corporate disclosures, established funding databases, and reputable financial or industry reporting. We include qualifying private-company equity financings and exclude debt, grants, loans, unconverted convertibles, SAFEs, public offerings and transactions where the qualifying equity component cannot be isolated.
Market eligibility is deliberately strict. Data Center Cooling had to represent an overwhelming part of the company's business at the time of financing. Duplicate reports of the same transaction were consolidated, while extensions, additional closes and tranches were reviewed to determine whether they represented separate financings or parts of the same round.
Dates, stages, lead investors, strategic investors, financing histories, founding dates and use-of-funds information are recorded only when public evidence supports them. We do not infer a financing stage from round size, assume a prominent investor was the lead, or estimate genuinely undisclosed rounds.
Transaction timing is based on the underlying financing evidence rather than the date a story happens to appear. Accelsius is an important example: its $65 million Series B was announced publicly in 2026, but regulatory filings show the capital was funded through 2025 closings, so we assign it to 2025 for period analysis. DCX's $176 million transaction is retained as an announced equity investment while preserving the fact that it was announced subject to closing.
We also ran a separate completeness and quality-control pass to check period boundaries, equity eligibility, minimum deal size, market fit and duplicate transactions. When public evidence supports only a lower-bound amount or leaves a structural uncertainty, we keep that uncertainty visible rather than forcing a cleaner-looking number.
Key sources include NVIDIA on the GB200 NVL72 liquid-cooled rack architecture, NVIDIA's current Data Center Products materials, ZutaCore's $100 million Series C announcement, Carrier on its expanded ZutaCore investment, Carrier on its initial ZutaCore investment and technology partnership, LITEON on its strategic investment in DCX, DCX's announcement of the LITEON transaction, Iceotope's $26 million Series B announcement, Enaxiom on its $1.8 million Seed financing and HydroCool development, Accelsius on its $65 million Series B, the SEC disclosure covering Accelsius and Innventure's financing, MicroRefrigeration's SEC Form D, Applied Digital on the $25 million Corintis financing, LiquidStack on its $20 million Series B extension, and Submer on its $55.5 million growth round.

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Written by the New Market Pitch teamWe track new markets so founders and investors can move faster. About us