What’s funding like in the semiconductor industry right now?
In our semiconductor industry deck, you will find everything you need to understand the market
SUMMARY
Semiconductor funding is strong right now for companies that have already proved themselves, but narrower overall: total capital has surged while fewer companies are getting funded, and most of the increase sits in very large scale-up rounds.
The headline looks spectacular. Recorded capital rose from $9.49 billion to $17.74 billion, yet deal count fell 16.1% and the number of funded companies dropped 16.0%.
The boom almost disappears once the biggest checks are removed. Capital excluding rounds above $100 million was nearly flat, while capital excluding rounds above $50 million fell 26.3%.
Nine-figure rounds have moved from exceptional to common. About one-third of current financings reached at least $100 million, compared with roughly one in ten during the previous period.
The market is rewarding follow-on companies much more aggressively than first-time fundraisers. First-financing activity barely changed, while follow-on capital and median follow-on round size jumped sharply.
Logic semiconductors and AI compute are absorbing the biggest share of the new money. Logic reached 57.8% of deals and 73.5% of recorded capital, with a current median financing of $117.5 million.
The middle of the market has thinned. Deals in the $20 million to $50 million range fell even as $100 million-plus financings exploded, which helps explain why total dollars and company breadth are moving in opposite directions.
The funding bar increasingly looks industrial rather than purely technical. Working silicon, customer deployments, tape-outs, manufacturing readiness and production capacity show up repeatedly around the largest recent rounds.
Geography has become more uneven too. North America gained deals, capital share and median round size at the same time, while Asia-Pacific kept roughly the same amount of capital with far fewer transactions.
Strategic investors are more visible as companies move toward production. Their participation rose to 41.5% of current deals, and many of the biggest rounds now combine financial capital with manufacturing, packaging, systems, customer or government relationships.
The clearest way to read the market today is that the financing ceiling is much higher, but the path to reaching it is narrower. Semiconductor companies with real execution proof can raise extraordinary amounts; companies still trying to establish themselves are seeing a much more ordinary market.
This market map, featured in our semiconductor industry deck, highlights top companies and startups in the semiconductor industry
All funding deals in the semiconductor industry over the last 24 months
Below is the table listing all the deals. You can find our methodology at the end of this page.
If you want a deeper understanding of the market and its current dynamics, get our report covering the Semiconductor Industry.
| Company | Category | Date | Stage | Deal size | What they do | Region | Lead investors |
|---|---|---|---|---|---|---|---|
| Teram | Memory Semiconductors | September 2026 | Seed | $37M | Develops custom vertically integrated 3D SRAM memory chips for high-bandwidth AI inference. | North America | Primary Venture Partners; B Capital; Hyperion; SemiAnalysis Capital |
| Ayar Labs | Logic Semiconductors | September 2026 | Series D+ | $150M | Develops silicon-photonic optical engines that provide chip-to-chip optical connectivity for AI processors. | North America | Not disclosed |
| Positron AI | Logic Semiconductors | September 2026 | Series C | $875M | Designs memory-first AI inference processors and systems centered on its custom Asimov silicon. | North America | NEA; Atreides Management; Valor Equity Partners; Andra Capital; SemiAnalysis Capital; Jim Clark |
| SciSemi | Logic Semiconductors | September 2026 | Unknown | ≈$2,760,000 | Develops memory-safe processors implementing hardware-enforced CHERI security for critical computing systems. | Europe | Mercia Ventures; PXN Ventures |
| NanoCore | Logic Semiconductors | September 2026 | Series C | ≈$249,000,000 | Develops 3D compute-in-memory AI inference chips combining near-memory, SRAM-CIM and RISC-V processing. | Asia-Pacific | Not disclosed |
| Tenstorrent | Logic Semiconductors | September 2026 | Series D+ | $1.3B | Designs AI accelerator processors and RISC-V-based computing silicon for AI workloads. | North America | Not disclosed |
| Celero | Logic Semiconductors | September 2026 | Series C | $275M | Designs coherent DSP semiconductors for high-bandwidth optical connectivity in AI data centers. | North America | Atreides Management; Valor Equity Partners; CapitalG |
| S-Transistors | Logic Semiconductors | August 2026 | Seed | $3M | Develops superconducting-transistor integrated circuits for ultra-low-power cryogenic control and computing. | Europe | Lifeline Ventures |
| Celera Semiconductor | Analog Semiconductors | August 2026 | Series B | $30M | Supplies custom and standard analog integrated circuits, including power-management ICs, using AI-assisted design automation. | North America | Maverick Silicon |
| Quintessent | Analog Semiconductors | August 2026 | Series A | $40M | Develops quantum-dot semiconductor laser chips and integrated photonic components for AI data-center optical interconnects. | North America | Cycle Capital |
| iHW | Logic Semiconductors | August 2026 | Series A | $37.5M | Develops ultra-low-power AI processors using analog compute-in-memory architectures. | Asia-Pacific | Kolon Investment |
| Singular Photonics | Sensor Semiconductors | August 2026 | Seed | $2.2M | Designs fabless CMOS SPAD image-sensor chips for photon counting, timing and computational imaging. | Europe | ACF Investors |
| Etched | Logic Semiconductors | August 2026 | Unknown | $700M | Designs proprietary high-performance AI inference processors and the rack-scale systems built around them. | North America | Jane Street |
| Velaura | Logic Semiconductors | August 2026 | Series A | $110M | Develops ultra-low-power AI silicon architectures and chips for data-center and physical-AI computing. | North America | Seligman Ventures |
| OLIX | Logic Semiconductors | August 2026 | Series B | $312M | Develops specialized AI-inference silicon connected through low-latency optical interconnects for large-scale inference systems. | Europe | Not disclosed |
| Xsight Labs | Logic Semiconductors | July 2026 | Series D+ | >$200,000,000 | Develops fabless Ethernet switch silicon and data-processing units for hyperscale, edge and AI data-center networks. | Middle East | Fidelity Management & Research Company |
| Eliyan | Logic Semiconductors | July 2026 | Series C | $145M | Develops high-bandwidth semiconductor interconnect and chiplet-connectivity technologies for AI compute, memory and networking systems. | North America | Seligman Ventures |
| Etched | Logic Semiconductors | July 2026 | Series C | $300M | Develops purpose-built semiconductor accelerators optimized for transformer-model AI inference. | North America | Sequoia |
| TYLsemi | Logic Semiconductors | July 2026 | Unknown | $43M | Develops production-ready chiplets for connectivity, power delivery and memory used to build custom AI silicon. | North America | Matter Venture Partners |
| Stathera | Analog Semiconductors | June 2026 | Series B | $55M | Develops fabless MEMS-based silicon timing oscillators and synchronization devices for mobile, IoT and data-center systems. | North America | Maverick Silicon |
| OpenChip | Logic Semiconductors | June 2026 | Growth Equity | $132M | Designs and commercializes energy-efficient RISC-V processors and SoCs for AI and high-performance computing. | Europe | Not disclosed |
| Reed Semiconductor | Power Semiconductors | June 2026 | Series D+ | $100M | Designs fabless power-management semiconductors including controllers, smart power stages, eFuses and power modules for AI/HPC and other electronics. | North America | Not disclosed |
| ALP Semiconductor | Power Semiconductors | June 2026 | Unknown | $19.5M | Develops wide- and ultra-wide-bandgap semiconductor power switches for solid-state circuit breakers and high-voltage power distribution. | Europe | Yotta Capital |
| Xiver | Foundry Services | June 2026 | Growth Equity | $28.9M | Operates an independent MEMS wafer foundry providing process development, industrialization and volume manufacturing services. | Europe | Cees Meeuwis |
| GreatASIC | Logic Semiconductors | June 2026 | Unknown | $6.9M | Designs custom ASICs and AI SoCs for data-center, edge-AI and automotive applications under a fabless model. | Asia-Pacific | Vertex Ventures Southeast Asia & India |
| InnoSeis | Sensor Semiconductors | June 2026 | Seed | $6.9M | Develops ultra-sensitive, low-power MEMS inertial sensors for precision motion and vibration measurement. | Europe | FORWARD.one |
| Rapidus | Foundry Services | June 2026 | Growth Equity | $943M | Develops and manufactures leading-edge logic semiconductors through a domestic advanced-node foundry, initially targeting 2nm production. | Asia-Pacific | Not disclosed |
| Xcena | Logic Semiconductors | May 2026 | Series B | $135M | Develops computational-memory semiconductor devices combining pooled DDR memory with near-data processors for AI infrastructure. | Asia-Pacific | Atinum Investment; IMM Investment |
| Moffett AI | Logic Semiconductors | May 2026 | Series C | ≈$240,000,000 | Designs sparse-computing AI inference accelerator chips for data-center workloads. | Asia-Pacific | Not disclosed |
| C2i Semiconductors | Power Semiconductors | May 2026 | Series A | $1.7M | Develops integrated voltage-regulator and power-delivery semiconductor devices for AI data-center processors. | Asia-Pacific | Not disclosed |
| PhotonicX AI | Analog Semiconductors | May 2026 | Unknown | Not Disclosed | Develops optical-I/O chiplets, silicon-photonic chips and associated high-speed driver and TIA ICs for AI interconnects. | Asia-Pacific | Not disclosed |
| Cyient Semiconductors | Power Semiconductors | May 2026 | Growth Equity | $10M | Designs custom semiconductor products and application-specific standard products, with a focus including power and mixed-signal ICs. | Asia-Pacific | Not disclosed |
| Vifan Intelligence | Logic Semiconductors | May 2026 | Seed | Not Disclosed | Develops AI fusion processor chips intended to serve as the central compute “brain” for embodied robots. | Asia-Pacific | Zhongguancun Capital (中关村资本); Qihang Investment (启航投资) |
| Sicoya | Analog Semiconductors | May 2026 | Series B | Not Disclosed | Develops silicon-photonic and analog electrical ICs for high-speed optical interconnects. | Asia-Pacific | Not disclosed |
| KD Technologies | Analog Semiconductors | May 2026 | Growth Equity | ≈$2,200,000 | Designs automotive optical-networking transceiver and PHY ASICs for high-speed plastic optical-fiber communications. | Europe | Not disclosed |
| Fractile | Logic Semiconductors | May 2026 | Series B | $220M | Designs inference accelerator chips using in-memory and near-memory compute architectures for AI workloads. | Europe | Accel; Factorial Funds; Founders Fund |
| PhotonCore | Logic Semiconductors | May 2026 | Seed | Not Disclosed | Develops heterogeneous photonic-electronic AI compute chips combining metasurface photonic computing with electronic chiplets. | Asia-Pacific | 苏州芯阳基金; 驰星创投; 盛景嘉成 |
| SemiDrive | Logic Semiconductors | May 2026 | Series C | ≈$200,000,000 | Designs automotive-grade SoCs and microcontrollers for vehicle compute, cockpit, gateway and control applications. | Asia-Pacific | Suzhou Industrial Investment (苏产投) |
| Casimir | Power Semiconductors | May 2026 | Seed | $12M | Develops semiconductor chips intended to harvest ambient quantum-vacuum energy for electronic power applications. | North America | Scout Ventures |
| HRDWYR | Logic Semiconductors | May 2026 | Series A | $13M | Designs domain-specific and AI-native system-on-chip processors for high-performance computing applications. | Asia-Pacific | Ideaspring Capital |
| eyeo | Sensor Semiconductors | May 2026 | Series A | ≈$27,100,000 | Develops nanophotonic color-splitting image sensors intended to capture substantially more incoming light than conventional filtered sensors. | Europe | Innovation Industries |
| Legend Semiconductor | Analog Semiconductors | May 2026 | Series B | ≈$24,000,000 | Designs high-precision analog and mixed-signal signal-chain ICs including AFE, ADC and DAC products. | Asia-Pacific | Not disclosed |
| EVAS Intelligence | Logic Semiconductors | May 2026 | Growth Equity | Not Disclosed | Designs RISC-V-based AI accelerator chips for cloud and data-center computing. | Asia-Pacific | Not disclosed |
| Picocom | Logic Semiconductors | May 2026 | Series C | Not Disclosed | Designs programmable baseband SoCs for 5G, 5.5G, non-terrestrial and future wireless-network infrastructure. | Asia-Pacific | Not disclosed |
| FlexiIC | Logic Semiconductors | May 2026 | Seed | ≈$2,400,000 | Develops flexible thin-film integrated circuits for sensing, logic and communications applications. | Europe | Bullnet Capital |
| BigEndian Semiconductors | Logic Semiconductors | May 2026 | Unknown | $6M | Designs application-specific SoCs for surveillance, imaging, security and related embedded-compute markets. | Asia-Pacific | IAN Alpha Fund |
| Oritek | Logic Semiconductors | May 2026 | Series C | Not Disclosed | Designs system-level AI SoCs for automotive, industrial, robotics and AIoT applications. | Asia-Pacific | Not disclosed |
| Tsavorite SI | Logic Semiconductors | May 2026 | Unknown | $5M | Develops an integrated AI-processing semiconductor architecture combining CPU, GPU, memory and connectivity functions. | North America | Not disclosed |
| Reexen | Logic Semiconductors | May 2026 | Series C | Not Disclosed | Designs SRAM-based compute-in-memory AI processor chips and related mixed-signal semiconductor technology. | Asia-Pacific | Not disclosed |
| Mosaic SoC | Logic Semiconductors | April 2026 | Seed | $3.8M | Designs ultra-low-power perception processor chips for real-time spatial intelligence in wearables and mobile devices. | Europe | Founderful |
| OpenLight | Logic Semiconductors | April 2026 | Series A | $50M | Designs and manufactures heterogeneous silicon-photonic application-specific integrated circuits with integrated lasers, modulators, amplifiers and detectors. | North America | Matter Venture Partners |
| Point2 Technology | Analog Semiconductors | April 2026 | Series B | $31.4M | Develops RF and mixed-signal interconnect SoCs for multi-terabit AI data-center cable connectivity. | North America | Maverick Silicon |
| Hyfix | Logic Semiconductors | April 2026 | Seed | $15M | Designs integrated SoCs combining flight control, positioning, communications and onboard compute for drones and autonomous robots. | North America | Craft Ventures |
| Neye | Logic Semiconductors | April 2026 | Series C | $80M | Develops single-chip optical circuit switches integrating silicon photonics, MEMS and CMOS for AI data-center interconnects. | North America | Sutter Hill Ventures |
| CIX Technology | Logic Semiconductors | March 2026 | Series B | ≈$245,000,000 | Designs Arm-based general-purpose and AI-capable CPU chips for PCs, edge systems and intelligent terminals. | Asia-Pacific | Shanghai IC Fund; Pudong Venture Capital |
| Rebellions | Logic Semiconductors | March 2026 | Growth Equity | $400M | Designs AI inference accelerator semiconductors and related chip platforms. | Asia-Pacific | Mirae Asset Financial Group; Korea National Growth Fund |
| Anabatic Semiconductor | Analog Semiconductors | March 2026 | Unknown | ≈$20,000,000 | Develops analog-front-end and related battery-management semiconductor ICs for EV and energy-storage batteries. | Asia-Pacific | Not disclosed |
| Anabatic Semiconductor | Analog Semiconductors | March 2026 | Series B | ≈$20,300,000 | Develops analog-front-end and related battery-management semiconductor ICs for EV and energy-storage batteries. | Asia-Pacific | Not disclosed |
| Epic Microelectronics | Power Semiconductors | March 2026 | Series A | $21M | Develops semiconductor-based vertical power-delivery technology for high-power AI processors. | North America | Seligman Ventures |
| Kandou | Logic Semiconductors | March 2026 | Series A | $225M | Designs and sells high-speed semiconductor retimers, switches and chip-to-chip interconnect products for AI and other computing systems. | Europe | Maverick Silicon |
| SPARK Microsystems | Analog Semiconductors | March 2026 | Series B | ≈$22,400,000 | Designs fabless ultra-low-power UWB wireless transceiver chips for real-time device connectivity. | North America | Idealist Capital; Real Ventures |
| RongSemi | Foundry Services | March 2026 | Series A | ≈$252,000,000 | Manufactures 12-inch semiconductor wafers using mature and specialty process technologies. | Asia-Pacific | Not disclosed |
| AlpsenTek | Sensor Semiconductors | March 2026 | Series B | Not Disclosed | Develops hybrid-vision image sensor chips combining conventional imaging with event-based sensing. | Asia-Pacific | Not disclosed |
| Agnit Semiconductors | Analog Semiconductors | March 2026 | Seed | $2.6M | Develops and manufactures GaN semiconductor devices, initially focused on RF chips and expanding into power devices. | Asia-Pacific | Shastra VC |
| GreatSky AI | Logic Semiconductors | March 2026 | Seed | $14M | Develops superconducting optoelectronic computing chips designed for highly energy-efficient AI processing. | North America | Bison Ventures |
| Lenzo | Logic Semiconductors | March 2026 | Seed | ≈$2,200,000 | Develops compute chips based on its Coarse-Grained Linear Array architecture for energy-efficient AI and blockchain workloads. | Asia-Pacific | Not disclosed |
| Xscape Photonics | Logic Semiconductors | March 2026 | Series A | $37M | Develops silicon-photonics chips and optical connectivity technology for AI data-center interconnects. | North America | Addition |
| Amber Semiconductor | Power Semiconductors | March 2026 | Series C | $30M | Develops fabless power-management semiconductors for vertical power delivery to high-performance AI processors. | North America | Not disclosed |
| Eridu AI | Logic Semiconductors | March 2026 | Series A | $200M | Develops high-radix AI data-center networking switch silicon and associated networking systems. | North America | Socratic Partners; John Doerr; Hudson River Trading; Capricorn Investment Group; Matter Venture Partners |
| Vertical Compute | Memory Semiconductors | March 2026 | Seed | ≈$22,900,000 | Develops vertically integrated high-density memory chips intended to reduce AI memory-bandwidth bottlenecks. | Europe | Quantonation |
| Ayar Labs | Logic Semiconductors | March 2026 | Series D+ | $500M | Develops silicon-photonics optical I/O chiplets for high-bandwidth, low-power AI accelerator interconnects. | North America | Neuberger Berman |
| Fangqing Technology | Logic Semiconductors | March 2026 | Unknown | ≈$245,100,000 | Develops AI computing chips for decoupled and distributed AI-compute architectures. | Asia-Pacific | Not disclosed |
| Leapers Semiconductor | Power Semiconductors | March 2026 | Unknown | ≈$24,500,000 | Develops and sells automotive and industrial SiC and IGBT power semiconductor modules. | Asia-Pacific | Not disclosed |
| Rapidus | Foundry Services | February 2026 | Growth Equity | $1.7B | Develops and plans to manufacture leading-edge logic semiconductors as a 2nm wafer-foundry provider. | Asia-Pacific | Not disclosed |
| Axelera AI | Logic Semiconductors | February 2026 | Series C | >$250,000,000 | Designs energy-efficient AI inference accelerator chips using digital in-memory computing for edge and data-center applications. | Europe | Innovation Industries |
| MatX | Logic Semiconductors | February 2026 | Series B | $500M | Designs custom AI accelerator processors optimized for large-language-model training and inference. | North America | Jane Street; Situational Awareness |
| OptoML | Logic Semiconductors | February 2026 | Seed | $1.8M | Designs fabless AI accelerator SoCs combining analog in-memory computing with high-bandwidth optical interconnects. | Asia-Pacific | Bluehill.VC; a99 |
| BOS Semiconductors | Logic Semiconductors | February 2026 | Series A | $60.2M | Designs fabless automotive SoCs and AI accelerator chiplets for ADAS, in-vehicle computing and gateway applications. | Asia-Pacific | Not disclosed |
| Taalas | Logic Semiconductors | February 2026 | Unknown | $169M | Develops model-specific AI inference chips that hard-wire neural-network parameters into silicon. | North America | Not disclosed |
| Efficient Computer | Logic Semiconductors | February 2026 | Series A | $60M | Develops ultra-low-power general-purpose processors based on a reconfigurable spatial-dataflow architecture. | North America | Triatomic Capital |
| Verve Semiconductor | Analog Semiconductors | February 2026 | Series A | $10M | Designs fabless analog and mixed-signal ICs including data converters, analog front ends and sensing/control chips. | Asia-Pacific | Ashish Kacholia; Unicorn India Ventures |
| C2i Semiconductors | Power Semiconductors | February 2026 | Series A | $15M | Develops power-management ICs, multiphase controllers and smart power stages for AI and high-performance computing systems. | Asia-Pacific | Peak XV Partners |
| OLIX | Logic Semiconductors | February 2026 | Series A | $220M | Develops optical-digital AI accelerator processors for high-performance inference. | Europe | Hummingbird Ventures |
| Positron AI | Logic Semiconductors | February 2026 | Series B | $230M | Develops memory-optimized AI inference accelerators and custom ASICs for large-transformer workloads. | North America | ARENA Private Wealth; Jump Trading; Unless |
| PrimeMas | Logic Semiconductors | January 2026 | Series B | $72M | Develops hub chiplets and SoCs that connect compute, memory and I/O for AI and data-center systems. | North America | Not disclosed |
| Neurophos | Logic Semiconductors | January 2026 | Series A | $110M | Develops integrated photonic optical processing chips for energy-efficient AI inference acceleration. | North America | Gates Frontier |
| Optalysys | Logic Semiconductors | January 2026 | Series A | ≈$21,100,000 | Develops silicon-photonic computing chips that combine data movement and processing for AI and secure-computing workloads. | Europe | Northern Gritstone |
| Sense Semiconductor | Analog Semiconductors | January 2026 | Seed | ≈$2,750,000 | Develops ultra-low-power mixed-signal and edge-AI SoCs combining analog processing, embedded AI and wireless connectivity. | Asia-Pacific | Piper Serica |
| Ethernovia | Logic Semiconductors | January 2026 | Series B | >$20,000,000 | Develops Ethernet packet-processor semiconductor chips for high-bandwidth networking in vehicles, robots and autonomous machines. | North America | Maverick Silicon |
| SpacemiT | Logic Semiconductors | January 2026 | Series B | >$26,000,000 | Develops and sells RISC-V-based CPU and AI processor chips for edge, robotics and computing systems. | Asia-Pacific | Not disclosed |
| Etched | Logic Semiconductors | January 2026 | Series B | ≈$200,000,000 | Develops Sohu, a transformer-specific ASIC designed for high-throughput AI inference. | North America | Stripes |
| Qualinx | Analog Semiconductors | January 2026 | Unknown | ≈$23,300,000 | Develops ultra-low-power digitally implemented GNSS and radio receiver chips for positioning and connectivity devices. | Europe | Invest-NL Deep Tech Fund; FORWARD.ONE; InnovationQuarter; Waterman Ventures |
| Netforward Technology | Logic Semiconductors | December 2025 | Series C | >$242,900,000 | Designs network-interconnect chips including Ethernet switch, PHY, NIC-controller and PCIe-switch devices. | Asia-Pacific | Not disclosed |
| TinyChip | Analog Semiconductors | December 2025 | Growth Equity | ≈$24,300,000 | Designs automotive mixed-signal MCU and SoC chips integrating signal-chain, sensing, power-management and control functions. | Asia-Pacific | Not disclosed |
| 芯微泰克 | Foundry Services | December 2025 | Unknown | >$2,400,000 | Provides specialty wafer-foundry and ultra-thin backside-processing services for advanced power semiconductor devices. | Asia-Pacific | Not disclosed |
| Mythic | Logic Semiconductors | December 2025 | Series D+ | $125M | Designs analog compute-in-memory AI accelerator chips and chiplets for edge and data-center inference. | North America | DCVC |
| NanoXplore | Logic Semiconductors | December 2025 | Growth Equity | ≈$23,500,000 | Designs radiation-hardened FPGA and SoC FPGA semiconductor devices for space, defense and avionics. | Europe | Not disclosed |
| 原集微 | Foundry Services | December 2025 | Seed | ≈$24,200,000 | Develops 2D-semiconductor IC processes and is building an engineering-validation wafer line for external chip fabrication and its own 2D ICs. | Asia-Pacific | 中赢创投; 浦东创投 |
| Innochips | Logic Semiconductors | December 2025 | Series D+ | >≈$14,100,000 | Designs baseband, RF and communications SoCs for mobile, satellite, IoT and base-station applications. | Asia-Pacific | Sichuan Development Xinyun Fund |
| Winner Micro | Logic Semiconductors | December 2025 | Growth Equity | >$1,400,000 | Develops Wi-Fi, Bluetooth, MCU and secure wireless communication semiconductor chips for IoT applications. | Asia-Pacific | Loongson Capital |
| LM Semiconductor | Logic Semiconductors | December 2025 | Seed | >$1,170,000 | Develops fabless connectivity SoCs using its NR+ non-cellular 5G technology for IoT and edge devices. | Europe | Not disclosed |
| Random Power | Logic Semiconductors | December 2025 | Seed | >≈$3,000,000 | Develops quantum random-number-generator ASICs based on semiconductor quantum effects for hardware security. | Europe | Emerald Development Managers; Deep Blue Ventures |
| VisIC Technologies | Power Semiconductors | December 2025 | Series B | $26M | Develops fabless GaN power semiconductor devices for EV traction and other high-power conversion applications. | Middle East | Not disclosed |
| Newsonic | Analog Semiconductors | December 2025 | Series C | ≈$38,000,000 | Designs RF acoustic filter chips and RF front-end semiconductor devices including BAW, SAW and TC-SAW products. | Asia-Pacific | Not disclosed |
| Unconventional AI | Logic Semiconductors | December 2025 | Seed | $475M | Develops physics-based analog AI computing silicon co-designed with its compute architecture and software stack. | North America | Lightspeed Venture Partners; Andreessen Horowitz |
| Starshine Semiconductor | Analog Semiconductors | December 2025 | Series C | >≈$14,100,000 | Develops and manufactures RF acoustic filter chips using SAW, TC-SAW, BAW and related technologies. | Asia-Pacific | Not disclosed |
| Niobium Microsystems | Logic Semiconductors | December 2025 | Seed | >$23,000,000 | Develops custom silicon accelerators for fully homomorphic encrypted computing. | North America | Not disclosed |
| Axiado | Logic Semiconductors | December 2025 | Series C | >$100,000,000 | Develops security and system-management processor silicon for AI servers and data centers. | North America | Maverick Silicon |
| TsingMicro | Logic Semiconductors | December 2025 | Series C | >≈$283,000,000 | Develops reconfigurable AI accelerator and computing chips based on proprietary processor architecture. | Asia-Pacific | Beijing Energy Investment Holding |
| ETL Chip | Logic Semiconductors | December 2025 | Series A | >$1,400,000 | Develops automotive and industrial Ethernet PHY and switch semiconductor chips. | Asia-Pacific | Bojiang Capital |
| Mastiska | Logic Semiconductors | November 2025 | Seed | $10M | Develops fabless GPU-class AI accelerator silicon for data-center training and inference workloads. | Middle East | Not disclosed |
| Sophrosyne Technologies | Sensor Semiconductors | November 2025 | Seed | $2M | Develops ultra-low-power biosensing system-on-chip devices for measuring physiological signals in wearables and digital-health equipment. | Asia-Pacific | Bluehill.VC |
| PowerLattice | Power Semiconductors | November 2025 | Series A | $25M | Develops an integrated power-delivery semiconductor chiplet for GPUs, CPUs and AI accelerators. | North America | Playground Global; Celesta Capital |
| Ferroelectric Memory Company | Memory Semiconductors | November 2025 | Series C | $89M | Designs ferroelectric DRAM+ and 3D CACHE+ memory semiconductor devices based on hafnium-oxide technology. | Europe | HV Capital; DeepTech & Climate Fonds (DTCF) |
| Skycore Semiconductor | Power Semiconductors | November 2025 | Seed | $5.8M | Designs fabless high-voltage power-conversion ICs based on switched-capacitor architectures. | Europe | Amadeus APEX Technology Fund |
| d-Matrix | Logic Semiconductors | November 2025 | Series C | $275M | Develops digital in-memory-compute semiconductor accelerators and chiplets purpose-built for generative-AI inference. | North America | Bullhound Capital; Triatomic Capital; Temasek |
| RAAM Technologies | Memory Semiconductors | November 2025 | Series A | $17.5M | Develops GCRAM embedded-memory semiconductor devices designed as denser, lower-power alternatives to conventional on-chip SRAM. | Middle East | NXP Semiconductors |
| NanoCore | Logic Semiconductors | October 2025 | Series B | >$14,000,000 | Develops 3D compute-in-memory AI processor chips combining CIM, 3D near-memory architecture and RISC-V compute. | Asia-Pacific | 蓝驰创投 |
| LeadingSpeed | Analog Semiconductors | October 2025 | Series B | ≈$14,000,000 | Designs high-speed optical-communications ICs including TIA, driver, CDR and PLL chips for telecom and data-center links. | Asia-Pacific | Not disclosed |
| Eagles Microelectronics | Sensor Semiconductors | October 2025 | Series B | >$98,000,000 | Designs and manufactures VCSEL semiconductor chips for optical interconnect, LiDAR and 3D sensing. | Asia-Pacific | 中信金石; 国新基金 |
| R-Semi | Analog Semiconductors | October 2025 | Series A | >$14,000,000 | Develops and sells automotive high-speed SerDes semiconductor chips for in-vehicle video and sensor data links. | Asia-Pacific | Not disclosed |
| Hefei Wanxin Integrated Circuit | Foundry Services | October 2025 | Growth Equity | ≈$421,000,000 | Builds and operates a 12-inch wafer fabrication line providing foundry manufacturing across logic, display-driver, CIS, power-management and MCU processes. | Asia-Pacific | Not disclosed |
| Vertical Semiconductor | Power Semiconductors | October 2025 | Seed | $11M | Develops vertical gallium-nitride power transistors for high-efficiency power conversion in AI infrastructure and other high-power applications. | North America | Playground Global |
| CVSens | Sensor Semiconductors | October 2025 | Series B | >≈$28,000,000 | Designs high-value CMOS image-sensor chips for automotive vision, security, machine vision, IoT and medical imaging. | Asia-Pacific | Not disclosed |
| Tachyum | Logic Semiconductors | October 2025 | Series C | $220M | Develops the Prodigy universal processor, a compute semiconductor combining CPU, HPC and AI-accelerator workloads. | North America | Not disclosed |
| CIMO Micro | Analog Semiconductors | October 2025 | Series B | >$14,000,000 | Designs high-performance analog signal-chain ICs including ADCs, DACs, amplifiers, voltage references and LDOs. | Asia-Pacific | 北京京国瑞投资管理有限公司 |
| CXMT | Memory Semiconductors | October 2025 | Growth Equity | ≈$63,200,000 | Designs and manufactures DRAM memory semiconductors as an integrated device manufacturer. | Asia-Pacific | Not disclosed |
| MAGICS Technologies | Analog Semiconductors | October 2025 | Unknown | ≈$4,650,000 | Designs and supplies radiation-tolerant CMOS integrated circuits including timing, clocking, imaging and control chips. | Europe | SC One; PMV |
| Falcomm | Analog Semiconductors | October 2025 | Seed | $5.8M | Develops fabless RF power-amplifier and front-end semiconductor devices for satellite, telecom and defense systems. | North America | Not disclosed |
| Cerebras | Logic Semiconductors | September 2025 | Series D+ | $1.1B | Designs wafer-scale AI processors and computing systems centered on its Wafer Scale Engine semiconductor. | North America | Fidelity Management & Research Company; Atreides Management |
| InGaGe MEMS | Sensor Semiconductors | September 2025 | Seed | $7M | Develops fabless multi-axis MEMS inertial sensor chips for high-accuracy navigation. | Europe | Supernova Invest; 360 Capital |
| Rebellions | Logic Semiconductors | September 2025 | Series C | $250M | Designs fabless AI inference accelerator chips for data-center deployments. | Asia-Pacific | Not disclosed |
| Morse Micro | Logic Semiconductors | September 2025 | Series C | ≈$29,000,000 | Designs fabless Wi-Fi HaLow system-on-chip semiconductors for long-range, low-power IoT connectivity. | Asia-Pacific | MegaChips |
| Empower Semiconductor | Power Semiconductors | September 2025 | Series D+ | >$240,000,000 | Develops integrated voltage-regulator and silicon-capacitor semiconductor products for AI and high-performance processors. | North America | Fidelity Management & Research Company |
| Sphere Semiconductor | Analog Semiconductors | September 2025 | Unknown | $12.5M | Develops and fabricates AI-designed custom analog, RF and mixed-signal semiconductor chips. | North America | ACME Capital; Future Ventures |
| Groq | Logic Semiconductors | September 2025 | Unknown | $750M | Designs proprietary LPU inference processors and deploys them in hardware and cloud infrastructure for AI inference. | North America | Disruptive |
| OptiCore | Logic Semiconductors | September 2025 | Seed | $7.5M | Develops photonic optical processing units for compute-intensive and memory-intensive AI workloads. | North America | Origin Ventures; Jetha Global |
| Agate Sensors | Sensor Semiconductors | September 2025 | Seed | ≈$2,700,000 | Develops chip-scale hyperspectral semiconductor sensors for material identification and imaging. | Europe | Voima Ventures; LIFTT |
| SCINTIL Photonics | Logic Semiconductors | September 2025 | Series B | $58M | Develops silicon-photonic integrated circuits with integrated lasers for high-bandwidth AI-data-center interconnects. | Europe | Yotta Capital Partners; NGP Capital |
| NanoPower Semiconductor | Power Semiconductors | September 2025 | Unknown | ≈$2,400,000 | Develops ultra-low-power power-management ICs that minimize standby energy consumption in battery-powered electronics. | Europe | Not disclosed |
| Lightelligence | Logic Semiconductors | September 2025 | Series C | >$210,000,000 | Develops photonic computing and optical-interconnect hardware centered on proprietary silicon-photonic chips for AI computing and data centers. | Asia-Pacific | Not disclosed |
| Lanxin Computing | Logic Semiconductors | August 2025 | Unknown | Not Disclosed | Develops RISC-V server CPU chips for data-center, cloud and AI computing. | Asia-Pacific | Not disclosed |
| TAKR MEMS | Sensor Semiconductors | August 2025 | Series A | Not Disclosed | Develops and manufactures MEMS gas-sensing and temperature-sensing semiconductor devices. | Asia-Pacific | Wuchuang Huagong Fund |
| Minghong Microelectronics | Sensor Semiconductors | August 2025 | Seed | Not Disclosed | Designs silicon-CMOS millimeter-wave radar and sensing chips for communications, security and low-altitude sensing. | Asia-Pacific | Falcon Capital |
| Aowei Lingxin | Logic Semiconductors | August 2025 | Seed | Not Disclosed | Designs high-performance RISC-V processors and programmable acceleration chips for industrial and edge computing. | Asia-Pacific | Chuangdongfang Investment |
| Chengke Microelectronics | Logic Semiconductors | August 2025 | Unknown | >$13,900,000 | Designs high-speed optical-module DSP and SerDes semiconductor chips for data-center and telecom links. | Asia-Pacific | Not disclosed |
| Paragraf | Sensor Semiconductors | August 2025 | Series C | $55M | Manufactures graphene-based semiconductor sensors including Hall-effect and molecular sensing devices. | Europe | Mubadala Capital |
| AzurEngine | Logic Semiconductors | August 2025 | Series B | ≈$14,000,000 | Develops reconfigurable parallel-processing chips for edge AI and embedded computing. | Asia-Pacific | Flyfot Ventures |
| JSCJ Electronics | Power Semiconductors | August 2025 | Growth Equity | Not Disclosed | Produces power discrete semiconductors and power-management ICs including MOSFETs, IGBTs and diodes. | Asia-Pacific | Not disclosed |
| ETL Chip | Logic Semiconductors | August 2025 | Series A | ≈$14,000,000 | Designs automotive and industrial Ethernet communication chips including switching and PHY devices. | Asia-Pacific | Not disclosed |
| PHOVIR | Sensor Semiconductors | August 2025 | Seed | ≈$5,400,000 | Develops chip-scale MEMS near-infrared sensors for compact spectroscopy. | Europe | Northern Gritstone; SCVC |
| SiEngine | Logic Semiconductors | August 2025 | Series B | >$139,000,000 | Designs high-performance automotive SoCs for digital cockpits, intelligent driving and vehicle computing. | Asia-Pacific | China State-owned Enterprise Structural Adjustment Fund II |
| NeoLogic | Logic Semiconductors | August 2025 | Series A | $10M | Develops server CPU chips using its proprietary logic architecture to reduce power and transistor count. | Middle East | KOMPAS VC |
| Newsonic | Analog Semiconductors | August 2025 | Series B | ≈$40,100,000 | Designs and sells BAW, SAW and related RF filter chips and front-end modules. | Asia-Pacific | Hongtai Fund |
| GaNext | Power Semiconductors | August 2025 | Series B | Not Disclosed | Designs and commercializes high-voltage GaN-on-silicon power semiconductor devices. | Asia-Pacific | Not disclosed |
| Celera Semiconductor | Analog Semiconductors | August 2025 | Series A | $20M | Develops custom analog integrated circuits using an automated analog-chip design platform. | North America | Not disclosed |
| YXME | Memory Semiconductors | August 2025 | Seed | ≈$14,000,000 | Develops ReRAM memory devices and compute-in-memory chips. | Asia-Pacific | Linghang Xinjie; Yanyuan Venture Capital |
| Flagchip | Logic Semiconductors | August 2025 | Series C | Not Disclosed | Designs automotive-grade MCU and high-performance controller chips for vehicle control systems. | Asia-Pacific | Not disclosed |
| SiMa.ai | Logic Semiconductors | August 2025 | Unknown | $85M | Develops machine-learning system-on-chip processors for edge and physical-AI inference. | North America | Maverick Capital |
| FuriosaAI | Logic Semiconductors | July 2025 | Series C | $125M | Designs AI inference accelerator chips based on its proprietary Tensor Contraction Processor architecture. | Asia-Pacific | Not disclosed |
| YXME | Memory Semiconductors | July 2025 | Seed | ≈$23,900,000 | Develops ReRAM memory devices, embedded non-volatile memory and compute-in-memory semiconductor chips. | Asia-Pacific | 领航新界; 燕缘创投 |
| Netrasemi | Logic Semiconductors | July 2025 | Series A | ≈$22,500,000 | Designs fabless edge-AI SoCs integrating proprietary compute, vision and image-processing capabilities. | Asia-Pacific | Zoho Corporation; Unicorn India Ventures |
| Lumotive | Sensor Semiconductors | July 2025 | Series B | $14M | Develops programmable optical semiconductor chips that electronically steer light for lidar, sensing and optical applications. | North America | Not disclosed |
| Sunrise | Logic Semiconductors | July 2025 | Unknown | ≈$239,500,000 | Develops and commercializes high-performance GPUs and AI inference accelerator chips. | Asia-Pacific | Not disclosed |
| Yanshan Technology | Analog Semiconductors | July 2025 | Series A | ≈$23,900,000 | Develops and manufactures vertically stacked full-color GaN MicroLED semiconductor chips for microdisplay and direct-display applications. | Asia-Pacific | Not disclosed |
| Kunlunxin | Logic Semiconductors | July 2025 | Unknown | >$23,900,000 | Designs and sells AI accelerator chips for data-center and large-scale inference and training workloads. | Asia-Pacific | Not disclosed |
| Arago | Logic Semiconductors | July 2025 | Seed | $26M | Develops photonic AI processors designed to perform high-efficiency inference and compute workloads. | Europe | Earlybird Venture Capital; Protagonist; Visionaries Tomorrow |
| SiPearl | Logic Semiconductors | July 2025 | Series A | ≈$27,600,000 | Designs Arm-based high-performance processors for European supercomputing and AI systems. | Europe | Not disclosed |
| Gejian Semiconductor | Logic Semiconductors | July 2025 | Series A | ≈$23,900,000 | Designs high-performance real-time DSP semiconductor chips for industrial control, power electronics, automotive and robotics applications. | Asia-Pacific | 微禾投资 |
| SiCRED | Power Semiconductors | July 2025 | Growth Equity | ≈$23,900,000 | Designs and sells SiC MOSFET chips and other silicon-carbide power semiconductor devices. | Asia-Pacific | Not disclosed |
| Hurricane Chip | Analog Semiconductors | July 2025 | Series B | ≈$21,800,000 | Develops and manufactures GaN semiconductor laser-diode chips spanning ultraviolet, blue and green wavelengths. | Asia-Pacific | 深创投制造业转型升级新材料基金; 国风投新智基金 |
| Sunrise | Logic Semiconductors | June 2025 | Unknown | ≈$239,000,000 | Develops high-performance AI GPUs for computer-vision and large-model inference workloads. | Asia-Pacific | Not disclosed |
| Seekwave Tech | Logic Semiconductors | June 2025 | Series B | Not Disclosed | Designs highly integrated Wi-Fi and Bluetooth connectivity SoCs for consumer and IoT equipment. | Asia-Pacific | Fuhan Microelectronics |
| BASiC Semiconductor | Power Semiconductors | June 2025 | Series D+ | ≈$20,900,000 | Develops and manufactures SiC MOSFETs, diodes, power modules and related power-semiconductor devices. | Asia-Pacific | Not disclosed |
| Vertilite | Sensor Semiconductors | June 2025 | Growth Equity | Not Disclosed | Designs and manufactures VCSEL laser chips and high-speed optical semiconductor devices for sensing and optical communications. | Asia-Pacific | Guangdong HEC Technology Holding Co., Ltd. |
| Swave Photonics | Analog Semiconductors | June 2025 | Series A | $6.9M | Develops CMOS-based holographic semiconductor chipsets that directly modulate light for spatial displays. | Europe | IAG Capital Partners |
| ONiO | Logic Semiconductors | June 2025 | Series A | ≈$2,800,000 | Develops ultra-low-power general-purpose microcontrollers capable of operating from harvested ambient energy. | Europe | node.vc; Maki.vc |
| Oritek | Logic Semiconductors | June 2025 | Series B | ≈$23,900,000 | Designs automotive SoCs for zonal controllers, edge intelligent components and centralized driving/parking compute platforms. | Asia-Pacific | Sunny Industrial Fund |
| Haawking | Logic Semiconductors | June 2025 | Unknown | Not Disclosed | Designs RISC-V DSP and processor chips for industrial control, power electronics, machine vision and related embedded applications. | Asia-Pacific | Not disclosed |
| SPARC Foundry | Foundry Services | June 2025 | Unknown | ≈$29,800,000 | Is building an open-access pure-play III-V semiconductor foundry for photonic integrated circuits and discrete GaAs, InP and GaN devices. | Europe | Not disclosed |
| Volantis Semiconductor | Logic Semiconductors | June 2025 | Seed | $9M | Develops wafer-scale photonic semiconductor architectures integrating optical interconnects and compute for AI systems. | North America | Not disclosed |
| MLink Tech | Logic Semiconductors | June 2025 | Series D+ | Not Disclosed | Designs cellular-IoT and satellite-communications baseband/SoC chips including NB-IoT, Cat.1 bis, RedCap and NTN devices. | Asia-Pacific | Beijing Commercial Aerospace and Low-Altitude Economy Industry Investment Fund |
| Phoenix Semiconductor | Logic Semiconductors | June 2025 | Seed | $5.5M | Recreates discontinued and obsolete semiconductor chips as drop-in replacements for long-life critical systems. | North America | J2 Ventures; RTX Ventures |
| LECArc | Logic Semiconductors | June 2025 | Unknown | Not Disclosed | Designs Arm-based server CPU chips for cloud, edge and AI-inference computing. | Asia-Pacific | Yida Capital; Nanjing Innovation Investment |
| JL Semiconductor | Analog Semiconductors | June 2025 | Series D+ | Not Disclosed | Designs Ethernet PHY, switch and other high-speed wired-networking semiconductor chips, particularly for automotive networks. | Asia-Pacific | Not disclosed |
| Semi Zabala | Power Semiconductors | June 2025 | Unknown | ≈$2,500,000 | Develops and manufactures GaN HEMT power-semiconductor devices for high-reliability and aerospace power electronics. | Europe | Not disclosed |
| VisiNextek | Logic Semiconductors | June 2025 | Series A | ≈$23,900,000 | Designs edge-AI SoCs integrating image processing and AI acceleration for vision, automotive and robotics applications. | Asia-Pacific | Junxin Capital |
| Speedata | Logic Semiconductors | June 2025 | Series B | $44M | Develops Analytics Processing Unit chips purpose-built to accelerate large-scale data analytics workloads. | Middle East | Walden Catalyst Ventures; 83North; Koch Disruptive Technologies; Pitango First; Viola Ventures |
| YHGX Technology | Analog Semiconductors | May 2025 | Series B | >≈$13,800,000 | Designs high-reliability power-management ICs including regulators, motor drivers and radiation-hardened power chips. | Asia-Pacific | Chizhou Industrial Investment; Plum Ventures |
| SciSemi | Logic Semiconductors | May 2025 | Seed | ≈$3,350,000 | Develops CHERI-secured microcontroller chips with hardware memory-safety features. | Europe | Mercia Ventures |
| ICY Tech | Logic Semiconductors | May 2025 | Seed | Not Disclosed | Develops spintronic magnetic-computing chips for AI inference and specialized high-performance computing. | Asia-Pacific | Not disclosed |
| Lanxin Computing | Logic Semiconductors | May 2025 | Unknown | ≈$1,390,000 | Designs high-performance RISC-V server CPU chips for data-center, enterprise and AI-compute workloads. | Asia-Pacific | Not disclosed |
| Light Chip | Analog Semiconductors | May 2025 | Series A | Not Disclosed | Designs silicon-based CMOS microdisplay driver chips for MicroLED and other digital-light-field displays. | Asia-Pacific | Guangdong Hengqin Guangdong-Macao In-Depth Cooperation Zone Industrial Investment |
| Pixelcore AI | Sensor Semiconductors | May 2025 | Unknown | Not Disclosed | Develops intelligent image-sensor chips integrating pixel-level sensing, storage and edge computation. | Asia-Pacific | Beijing Infotech Ventures |
| Finwave Semiconductor | Analog Semiconductors | May 2025 | Unknown | $8.2M | Develops GaN-on-silicon RF semiconductor devices including switches and power-amplifier products for wireless networks. | North America | Fine Structure Ventures; Engine Ventures; Safar Partners |
| Starshine Semiconductor | Analog Semiconductors | May 2025 | Series B | >≈$13,800,000 | Develops and manufactures SAW, TF-SAW and BAW RF filter chips and RF front-end semiconductor modules. | Asia-Pacific | Not disclosed |
| HYBRD Chip | Logic Semiconductors | May 2025 | Unknown | Not Disclosed | Designs and sells high-performance FPGA and programmable heterogeneous computing chips. | Asia-Pacific | 初芯基金 |
| eyeo | Sensor Semiconductors | May 2025 | Seed | ≈$17,000,000 | Develops image-sensor technology using nanophotonic color splitting to increase CMOS sensor light sensitivity and resolution. | Europe | imec.xpand; Invest-NL |
| VSORA | Logic Semiconductors | April 2025 | Unknown | $46M | Develops high-performance AI inference accelerator chips for datacenter and edge workloads. | Europe | Otium; French family office (name not disclosed) |
| HFKON Semiconductor | Memory Semiconductors | April 2025 | Series B | Not Disclosed | Designs flash-memory controller ICs and embedded eMMC storage products. | Asia-Pacific | Not disclosed |
| YMTC Holding | Memory Semiconductors | April 2025 | Growth Equity | Not Disclosed | Controls semiconductor manufacturing businesses led by YMTC's 3D NAND memory operations. | Asia-Pacific | Not disclosed |
| R-Semi | Analog Semiconductors | April 2025 | Series A | Not Disclosed | Designs automotive SerDes and high-speed mixed-signal connectivity chipsets for in-vehicle data transmission. | Asia-Pacific | Not disclosed |
| Lansus | Analog Semiconductors | April 2025 | Growth Equity | ≈$21,800,000 | Designs and sells RF front-end semiconductors including power amplifiers, RF switches and integrated RF modules. | Asia-Pacific | Not disclosed |
| Element Labs | Logic Semiconductors | April 2025 | Series A | $50M | Develops AI inference processors aimed primarily at local and smaller datacenter deployments. | Middle East | Fidelity |
| Tauren Technology | Analog Semiconductors | April 2025 | Series D+ | Not Disclosed | Designs high-speed analog and mixed-signal ICs including ADC/DAC, SerDes, optical DSP and RF transceiver chips. | Asia-Pacific | Not disclosed |
| Neye | Logic Semiconductors | April 2025 | Series B | $58M | Develops chip-scale silicon-photonic optical circuit switches for AI and high-performance datacenter networks. | North America | CapitalG |
| Axera | Logic Semiconductors | April 2025 | Series C | >≈$236,000,000 | Designs AI perception and edge-computing SoCs for vision, intelligent vehicles and other edge devices. | Asia-Pacific | Not disclosed |
| Neuranics | Sensor Semiconductors | April 2025 | Seed | $8M | Develops ultra-low-power tunnelling-magnetoresistance semiconductor sensors for magnetic signal detection. | Europe | Blackfinch Ventures |
| Ratel Semiconductor | Power Semiconductors | April 2025 | Unknown | ≈$220,000 | Designs fabless power-management ICs for displays, on-device AI computers and automotive electronics. | Asia-Pacific | Not disclosed |
| Blumind | Analog Semiconductors | April 2025 | Series A | ≈$24,026,000 | Develops ultra-low-power all-analog AI inference chips for always-on edge computing. | North America | Cycle Capital; BDC Capital |
| CalligoTech | Logic Semiconductors | April 2025 | Unknown | $1.1M | Designs RISC-V SoCs with Posit arithmetic acceleration for HPC and AI workloads. | Asia-Pacific | Seafund; Artha Venture Fund |
| FaradaIC | Sensor Semiconductors | April 2025 | Seed | ≈$2,910,000 | Develops wafer-manufactured chip-scale electrochemical gas sensors using solid-state ion conductors. | Europe | JOIN Capital |
| Icemos | Power Semiconductors | April 2025 | Series D+ | $22M | Develops and manufactures silicon power MOSFETs using MEMS-enabled super-junction structures. | North America | Not disclosed |
| CSCX Semiconductor | Logic Semiconductors | March 2025 | Series A | ≈$27,400,000 | Develops UWB SoCs combining precise ranging, positioning, communications and radar functions. | Asia-Pacific | Xingxiang Capital |
| Biren Technology | Logic Semiconductors | March 2025 | Series D+ | Not Disclosed | Develops high-performance general-purpose GPU and AI accelerator semiconductor chips. | Asia-Pacific | 上海国投先导人工智能产业母基金 |
| Celestial AI | Analog Semiconductors | March 2025 | Series C | $250M | Develops silicon-photonic optical-interconnect chiplets and its Photonic Fabric platform for AI compute and memory connectivity. | North America | Fidelity Management & Research Company |
| Sencure | Sensor Semiconductors | March 2025 | Series B | ≈$2,200,000 | Develops low-power biosensing front-end ICs for EEG, ECG and EMG medical wearables and devices. | Europe | Not disclosed |
| Pebble Square | Logic Semiconductors | March 2025 | Seed | ≈$2,380,000 | Develops analog processing-in-memory and neuromorphic AI semiconductor chips for edge inference. | Asia-Pacific | Not disclosed |
| VMEMS | Sensor Semiconductors | March 2025 | Seed | Not Disclosed | Develops CMOS-MEMS monolithically integrated infrared-array and other MEMS sensor chips. | Asia-Pacific | Xiamen High-tech Investment |
| Huachen Optoelectronics | Analog Semiconductors | March 2025 | Series A | ≈$27,400,000 | Designs and manufactures EEL and VCSEL semiconductor laser chips for optical communications, high-power lasers and 3D sensing. | Asia-Pacific | Not disclosed |
| Mingxin Qirui | Memory Semiconductors | March 2025 | Seed | ≈$23,700,000 | Develops RRAM memory and compute-in-memory chips, embedded RRAM technology and AI-oriented memory products. | Asia-Pacific | Jinqiu Fund |
| Atmosic | Logic Semiconductors | March 2025 | Series D+ | $40M | Develops ultra-low-power wireless connectivity and compute SoCs for IoT and edge devices. | North America | Sutter Hill Ventures |
| Giant Semiconductor | Analog Semiconductors | February 2025 | Series B | ≈$24,000,000 | Designs UWB and other short-range wireless communication and sensing SoCs. | Asia-Pacific | Not disclosed |
| Eagles Microelectronics | Sensor Semiconductors | February 2025 | Series B | >$21,000,000 | Develops and manufactures VCSEL optical-semiconductor chips for data communications, LiDAR and 3D sensing. | Asia-Pacific | Not disclosed |
| EMTAR Technology | Analog Semiconductors | February 2025 | Seed | ≈$22,900,000 | Designs wireless SoCs combining high-speed interfaces, wireless connectivity and edge computing. | North America | Not disclosed |
| Hyseim | Logic Semiconductors | February 2025 | Series A | ≈$24,000,000 | Designs RISC-V processor and SoC chips for automotive, industrial and edge-computing applications. | Asia-Pacific | Not disclosed |
| PNJ Semiconductor | Power Semiconductors | February 2025 | Series A | ≈$28,000,000 | Designs SiC MOSFETs, SiC Schottky diodes and GaN HEMT power semiconductor devices. | Asia-Pacific | Not disclosed |
| Lumotive | Sensor Semiconductors | February 2025 | Series B | $45M | Develops programmable optical-semiconductor beam-steering chips for 3D sensing and optical communications. | North America | Gates Frontier; MetaVC Partners |
| Cambridge GaN Devices | Power Semiconductors | February 2025 | Series C | $32M | Develops GaN-on-silicon power transistors and integrated power ICs. | Europe | Not disclosed |
| Danxi Technology | Power Semiconductors | February 2025 | Unknown | >$2,300,000 | Designs and sells GaN power transistors, gate-driver ICs and integrated GaN power devices. | Asia-Pacific | Unknown |
| XDXCT | Logic Semiconductors | February 2025 | Unknown | >$27,000,000 | Designs general-purpose GPU semiconductor chips for graphics and AI computing. | Asia-Pacific | Not disclosed |
| EnCharge AI | Analog Semiconductors | February 2025 | Series B | >$200,000,000 | Designs analog in-memory computing chips for energy-efficient AI inference and acceleration. | North America | Tiger Global |
| MIS Technology | Sensor Semiconductors | February 2025 | Series A | >$2,300,000 | Designs MEMS pressure and flow sensor chips for automotive, consumer, industrial and medical applications. | Asia-Pacific | Not disclosed |
| OSO Semiconductor | Analog Semiconductors | February 2025 | Seed | $5.2M | Designs RF beamforming chipsets for phased-array satellite, 5G and radar systems. | North America | Engine Ventures |
| TinyChip | Analog Semiconductors | February 2025 | Unknown | >$2,200,000 | Designs automotive analog and mixed-signal SoCs integrating control, sensing, actuation and power-management functions. | Asia-Pacific | Not disclosed |
| Salience Labs | Logic Semiconductors | February 2025 | Series A | $30M | Develops silicon-photonics optical-switch chips for high-bandwidth AI data-center interconnects. | Europe | ICM HPQC Fund; Applied Ventures |
| Pakal Technologies | Power Semiconductors | January 2025 | Series B | $25M | Develops high-voltage silicon power semiconductor switches for electrification and power-conversion systems. | North America | New Science Ventures |
| PseudolithIC | Analog Semiconductors | January 2025 | Seed | $6M | Develops RF semiconductor chipsets integrating compound-semiconductor chiplets with silicon manufacturing. | North America | Entrada Ventures |
| Zhixin Semiconductor | Logic Semiconductors | January 2025 | Unknown | Not Disclosed | Designs automotive semiconductor chips including MCUs, mixed-signal ICs and motor-control devices. | Asia-Pacific | 合肥产投资本 |
| InventChip | Power Semiconductors | January 2025 | Series C | Not Disclosed | Develops and manufactures SiC power semiconductor devices and associated power ICs using an IDM model. | Asia-Pacific | 国开制造业转型升级基金 |
| EVAS Intelligence | Logic Semiconductors | January 2025 | Series A | Not Disclosed | Designs RISC-V based compute and automotive edge-processing chips. | Asia-Pacific | National SME Development Fund (managed by Oriental Fortune Capital) |
| MT Silicon | Sensor Semiconductors | January 2025 | Series A | Not Disclosed | Designs high-performance CMOS image sensor chips for automotive, robotics and machine-vision applications. | Asia-Pacific | 开源证券; 西投控股 |
| PowerDiamond Systems | Power Semiconductors | January 2025 | Series A | ≈$640,000 | Develops diamond semiconductor devices for high-power and high-frequency electronics. | Asia-Pacific | Not disclosed |
| VisiNextek | Logic Semiconductors | January 2025 | Unknown | Not Disclosed | Designs edge-AI SoCs for intelligent vision, automotive, robotics and other embedded applications. | Asia-Pacific | Not disclosed |
| Vertical Compute | Memory Semiconductors | January 2025 | Seed | ≈$20,500,000 | Develops vertically integrated memory-compute semiconductor technology intended to reduce the memory bottleneck in AI computing. | Europe | imec.xpand |
| UNIM Innovation | Memory Semiconductors | January 2025 | Series A | Not Disclosed | Designs and supplies NAND flash memory chips, including SLC NAND devices for embedded and industrial applications. | Asia-Pacific | Not disclosed |
| Meritech | Analog Semiconductors | January 2025 | Series B | Not Disclosed | Designs automotive-grade high-speed analog and mixed-signal interface chips including SerDes devices. | Asia-Pacific | Not disclosed |
| YW MEMS | Sensor Semiconductors | January 2025 | Series A | Not Disclosed | Develops and manufactures MEMS semiconductor chips and related microdevices including flow sensors and micropumps. | Asia-Pacific | Not disclosed |
| Grecon Semiconductor | Power Semiconductors | January 2025 | Series B | Not Disclosed | Develops IGBT and SiC power semiconductor devices, wafers and power-device products. | Asia-Pacific | 国科长三角资本 |
| ETERN Laser | Logic Semiconductors | December 2024 | Unknown | ≈$2,200,000 | Develops semiconductor laser chips including VCSEL and DFB devices for optical communications and sensing. | Asia-Pacific | Not disclosed |
| Moore Threads | Logic Semiconductors | December 2024 | Growth Equity | ≈$216,000,000 | Designs fabless full-function GPU semiconductor processors for graphics and general-purpose accelerated computing. | Asia-Pacific | Not disclosed |
| HyperAccel | Logic Semiconductors | December 2024 | Series A | ≈$20,000,000 | Designs LLM Processing Unit semiconductor accelerators optimized for generative-AI inference and computation. | Asia-Pacific | Korea Investment Partners |
| SpacemiT | Logic Semiconductors | December 2024 | Series A | Not Disclosed | Designs high-performance RISC-V CPU and AI-computing semiconductor chips. | Asia-Pacific | Brizan III Fund |
| Mindgrove Technologies | Logic Semiconductors | December 2024 | Series A | $8M | Designs fabless RISC-V SoCs and microcontrollers for embedded, industrial, edge and vision applications. | Asia-Pacific | Rocketship.vc; Speciale Invest |
| OptiCore | Logic Semiconductors | December 2024 | Seed | $5M | Develops photonic optical-processing semiconductor chips intended to perform AI computation with optical rather than conventional electronic processing. | North America | Not disclosed |
| Beijixiongxin | Logic Semiconductors | December 2024 | Unknown | Not Disclosed | Develops high-performance computing semiconductor chips and chiplet-based processors. | Asia-Pacific | Not disclosed |
| EPIC | Logic Semiconductors | December 2024 | Unknown | Not Disclosed | Develops silicon-photonics semiconductor chips for high-speed optical communications and data-center interconnects. | Asia-Pacific | Hongrida Technology Co., Ltd. |
| Ayar Labs | Logic Semiconductors | December 2024 | Series D+ | $155M | Develops in-package silicon-photonics optical-I/O chiplets for high-bandwidth semiconductor interconnects. | North America | Advent Global Opportunities; Light Street Capital |
| Merchip Micro | Power Semiconductors | December 2024 | Series A | Not Disclosed | Develops digital power-management and power-control ICs including DSP power, motor-control and voltage-regulation chips. | Asia-Pacific | Not disclosed |
| Netrasemi | Logic Semiconductors | December 2024 | Unknown | ≈$2,180,000 | Develops edge-AI semiconductor SoCs for vision, signal-processing and intelligent embedded applications. | Asia-Pacific | Not disclosed |
| Axiado | Logic Semiconductors | December 2024 | Series C | $60M | Develops secure control and compute SoCs for platform management and hardware-rooted security in AI infrastructure. | North America | Maverick Silicon |
| Azimuth AI | Logic Semiconductors | December 2024 | Unknown | $11.5M | Designs purpose-built semiconductor SoCs for edge-computing and embedded applications. | North America | Unknown |
| PossumIC | Sensor Semiconductors | December 2024 | Series A | ≈$23,800,000 | Develops fabless millimeter-wave intelligent-sensing SoCs for automotive, industrial and consumer sensing applications. | Asia-Pacific | Not disclosed |
| Tenstorrent | Logic Semiconductors | December 2024 | Series D+ | >$293,000,000 | Designs high-performance AI accelerator processors and RISC-V-based compute chips. | North America | Samsung Securities; AFW Partners |
| Akhetonics | Logic Semiconductors | November 2024 | Seed | ≈$2,330,000 | Develops all-optical general-purpose processor chips using photonic integrated circuits for digital computing. | Europe | Matterwave Ventures |
| PowerDiamond Systems | Power Semiconductors | November 2024 | Unknown | ≈$2,600,000 | Develops diamond semiconductor power devices intended for extremely high-power and high-temperature applications. | Asia-Pacific | Not disclosed |
| UNISOC | Logic Semiconductors | November 2024 | Growth Equity | Not Disclosed | Designs mobile, communications, IoT and embedded system-on-chips and baseband semiconductor platforms. | Asia-Pacific | Not disclosed |
| Gejian Semiconductor | Logic Semiconductors | November 2024 | Series A | ≈$23,800,000 | Designs high-performance programmable DSP semiconductor chips for communications and signal-processing applications. | Asia-Pacific | Weiho Investment |
| Giant Semiconductor | Sensor Semiconductors | November 2024 | Unknown | Not Disclosed | Designs UWB semiconductor chips for precision ranging, positioning and short-range wireless connectivity. | Asia-Pacific | Yida Capital |
| MatX | Logic Semiconductors | November 2024 | Series A | ≈$20,000,000 | Designs purpose-built semiconductor accelerators for large-scale AI training and inference. | North America | Spark Capital |
| Ubitium | Logic Semiconductors | November 2024 | Seed | $3.7M | Develops a general-purpose RISC-V processor intended to consolidate multiple computing functions onto a single semiconductor architecture. | Europe | Runa Capital; Inflection; KBC Focus Fund |
| Xinlian Power | Power Semiconductors | November 2024 | Unknown | ≈$24,600,000 | Develops and manufactures automotive-grade silicon-carbide power semiconductor devices and related SiC manufacturing technology. | Asia-Pacific | Not disclosed |
| Oritek | Logic Semiconductors | November 2024 | Series B | Not Disclosed | Designs automotive system-on-chips for next-generation centralized vehicle electrical/electronic architectures. | Asia-Pacific | 国投招商 |
| Enfabrica | Logic Semiconductors | November 2024 | Series C | $115M | Designs high-bandwidth networking and memory-fabric silicon for connecting GPUs, accelerators and AI compute clusters. | North America | Spark Capital |
| GEMESYS | Logic Semiconductors | November 2024 | Seed | ≈$2,100,000 | Develops memristor-based analog AI accelerator chips for highly energy-efficient neural-network inference. | Europe | Amadeus APEX Technology Fund; Atlantic Labs |
| BOE Integrated | Foundry Services | November 2024 | Unknown | ≈$2,764,000,000 | Manufactures semiconductor wafers across 6-, 8- and planned 12-inch production lines for display, mixed-signal, MCU, automotive and communications chips. | Asia-Pacific | Not disclosed |
| MintNeuro | Sensor Semiconductors | November 2024 | Seed | ≈$2,290,000 | Develops application-specific semiconductor chips for neural recording, stimulation and implantable brain interfaces. | Europe | Empirical Ventures |
| C2i Semiconductors | Power Semiconductors | November 2024 | Seed | $4M | Designs analog and mixed-signal semiconductor products including power-management ICs for automotive and industrial applications. | Asia-Pacific | Yali Capital |
| Forefront RF | Analog Semiconductors | November 2024 | Series A | ≈$20,700,000 | Designs adaptive RF semiconductor technology that replaces multiple switched RF components in mobile and connected devices. | Europe | Cambridge Innovation Capital; Octopus Ventures |
| Xavveo | Sensor Semiconductors | November 2024 | Seed | $8.6M | Develops silicon-photonics-based distributed radar sensor chips and sensor networks for high-resolution ranging. | Europe | Vsquared Ventures; imec.xpand |
| Geener | Power Semiconductors | October 2024 | Series B | ≈$20,200,000 | Develops and manufactures silicon and SiC MOSFET, IGBT and FRD power-semiconductor chips and modules. | Asia-Pacific | Not disclosed |
| Zhixin Semiconductor | Logic Semiconductors | October 2024 | Series B | Not Disclosed | Designs and sells automotive processors, MCUs and mixed-signal automotive integrated circuits. | Asia-Pacific | Hefei Industrial Investment |
| Lightmatter | Logic Semiconductors | October 2024 | Series D+ | $400M | Develops silicon-photonic interconnect semiconductor engines for linking processors in large AI computing systems. | North America | T. Rowe Price Associates, Inc. |
| Yuntong Technology | Power Semiconductors | October 2024 | Series B | Not Disclosed | Develops automotive-grade IGBT, MOSFET and other power-semiconductor chips and modules for electric-vehicle power electronics. | Asia-Pacific | Not disclosed |
| Xscape Photonics | Logic Semiconductors | October 2024 | Series A | $44M | Develops programmable multi-wavelength silicon-photonic semiconductor platforms for high-bandwidth AI data-center interconnects. | North America | IAG Capital Partners |
| Immorta | Analog Semiconductors | October 2024 | Series A | Not Disclosed | Designs automotive-grade mixed-signal ICs including system-basis, power, driver and compute-control chips. | Asia-Pacific | Xinwei Capital |
| iStarChip | Logic Semiconductors | October 2024 | Seed | Not Disclosed | Designs CPU-DSP-NPU integrated control processors and related chips for embedded AI and intelligent endpoint control. | Asia-Pacific | Not disclosed |
| CVSens | Sensor Semiconductors | October 2024 | Series A | Not Disclosed | Designs high-value CMOS image-sensor chips for automotive, security, machine-vision, IoT and medical imaging. | Asia-Pacific | Hanlian Semiconductor Industry Fund |
| Meridian Innovation | Sensor Semiconductors | October 2024 | Series C | $12.5M | Develops mass-producible CMOS thermal-imaging sensor chips for consumer, automotive, industrial and monitoring applications. | Asia-Pacific | Not disclosed |
| TinyChip | Analog Semiconductors | October 2024 | Growth Equity | Not Disclosed | Designs high-performance automotive mixed-signal SoCs and specialized MCUs integrating sensing, signal-chain, power and control functions. | Asia-Pacific | Not disclosed |
| Fermionic Design | Analog Semiconductors | September 2024 | Unknown | $6M | Designs mixed-signal MCUs, RF beamformers, GaN RF front ends and power-management ICs. | Asia-Pacific | Not disclosed |
| Innobase | Logic Semiconductors | September 2024 | Series A | ≈$42,300,000 | Designs cellular baseband SoCs integrating baseband, RF, power-management and application-processing functions for connected devices. | Asia-Pacific | Chengdu Ceyuan Capital |
| AscenPower | Power Semiconductors | September 2024 | Series A | ≈$141,000,000 | Manufactures automotive- and industrial-grade SiC SBD/JBS diodes and SiC MOSFETs. | Asia-Pacific | Guangdong Integrated Circuit Fund II; SDIC Venture Capital |
| Hefei Wanxin Integrated Circuit | Foundry Services | September 2024 | Growth Equity | ≈$1,345,000,000 | Builds and operates a 12-inch semiconductor wafer manufacturing line as a foundry subsidiary of Nexchip. | Asia-Pacific | Not disclosed |
| Xinpletek | Analog Semiconductors | September 2024 | Series A | ≈$14,000,000 | Develops RF front-end power-amplifier chips and modules for cellular devices and IoT equipment. | Asia-Pacific | Not disclosed |
| JT Microelectronics | Power Semiconductors | September 2024 | Unknown | ≈$8,450,000 | Develops and sells GaN power switches, GaN Schottky diodes and associated driver ICs. | Asia-Pacific | Not disclosed |
| Hefei Fangjing Technology | Power Semiconductors | September 2024 | Growth Equity | ≈$40,800,000 | Develops and commercializes power semiconductor devices. | Asia-Pacific | Not disclosed |
| MEMSonics | Analog Semiconductors | September 2024 | Growth Equity | >≈$28,000,000 | Designs and manufactures RF acoustic filters plus piezoelectric microphone and ultrasonic sensor chips. | Asia-Pacific | Not disclosed |
| PNJ Semiconductor | Power Semiconductors | September 2024 | Series A | >≈$28,000,000 | Designs and sells SiC MOSFETs, SiC diodes and GaN power transistors. | Asia-Pacific | Not disclosed |
| ZHCL Tech | Logic Semiconductors | September 2024 | Series B | ≈$84,000,000 | Develops high-performance AI accelerator chips and associated large-scale compute systems. | Asia-Pacific | Xingluo Zhonghao |
As this chart shows, and as featured in our semiconductor industry deck, search interest in semiconductors has been rising steadily
Is semiconductor funding actually healthier now?
Semiconductor funding is healthier for companies that have already proved themselves, but the market as a whole is funding fewer businesses than it did a year ago.
We counted 135 financings from 20 September 2025 to 19 September 2026, compared with 161 during the previous 12 months. The number of funded companies fell from 150 to 126.
Money moved in the opposite direction. Recorded capital increased from $9.49 billion to $17.74 billion, while the median disclosed round climbed from $21.8 million to $29.5 million.
That gives us a fairly clear picture of the market today. Investors are making fewer bets, but the companies that do get financed can raise much more money.
The change is particularly visible further along the company lifecycle. Later-stage deals now make up just over half of the market, and the biggest increase in capital went to companies that had already raised before.
For a founder looking for a first check, conditions have changed surprisingly little. For a semiconductor company with proven technology and a credible plan to scale production, the funding environment is much stronger.
| Metric | Current 12M | Previous 12M | Change |
|---|---|---|---|
| Deals | 135 | 161 | -16.1% |
| Funded companies | 126 | 150 | -16.0% |
| Recorded capital | $17.74bn | $9.49bn | +86.8% |
| Median disclosed round | $29.5m | $21.8m | +35.3% |
| Average disclosed round | $140.8m | $81.8m | +72.0% |
| First-financing share | 17.8% | 16.8% | +1.0 pp |
| Later-stage deal share | 51.1% | 36.0% | +15.1 pp |
| Capital excluding >$50m rounds | $1.18bn | $1.60bn | -26.3% |
Does the semiconductor funding boom survive without the giant rounds?
Once we strip out the giant semiconductor rounds, most of the apparent funding boom disappears.
Total capital increased 86.8%, but capital excluding rounds above $100 million was almost flat at +2.1%. Go one step further and remove rounds above $50 million, and funding actually falls 26.3%.
That gap tells us where the extra money went. It mostly went into very large scale-up financings rather than spreading through seed, Series A and ordinary mid-sized rounds.
The monthly numbers make the picture harder to dismiss as a lucky burst of transactions. Median monthly capital increased from $457 million to $1.09 billion even though the typical month had fewer deals. Large checks appeared across the year rather than arriving in one isolated financing window.
The upper end is also broader than last year. Previously, the top three deals accounted for 51.2% of capital. Today they account for 23%. There are simply many more companies raising hundreds of millions of dollars.
Cerebras raised $1.1 billion. Rapidus secured a $1.7 billion public-private equity package. Positron announced an $875 million Series C structure. Ayar Labs raised $500 million in March and added another $150 million later in the year. Etched raised $300 million and then another $700 million as it moved into production and customer deployments.
So these days the semiconductor funding boom is real at the scale-up end of the market, while the lower financing tiers look much more ordinary.
This chart, featured in our semiconductor industry deck, shows annual venture capital investment in semiconductor startups
Are more semiconductor companies getting funded now?
Semiconductor funding is reaching fewer companies today, and the decline is broad enough that we would treat it as a genuine narrowing of the market.
Unique funded companies fell from 150 to 126. Deals fell by almost exactly the same proportion, from 161 to 135.
The slowdown also shows up month after month. Average monthly deal count dropped from 13.4 to 11.3, while the median fell from 13.5 to 10.5. Both periods had activity in every month, so a couple of unusually quiet months do not explain the gap.
Companies raising more than once within the same 12-month period also became slightly rarer, falling from 11 to eight.
For founders, that distinction is important. A record-looking amount of money can coexist with a market where fewer companies actually manage to raise. That is what we are seeing currently in semiconductors.
Are new semiconductor startups still getting funded, or are investors doubling down on existing winners?
New semiconductor startups are still getting funded, but almost all of the extra capital is flowing to companies that already have a financing history.
We counted 24 first financings, only slightly below the previous 27. Their share of deals stayed roughly flat at 17.8%, versus 16.8% a year earlier.
Even the size of a typical first financing barely changed. The median was $8.5 million, compared with $8.6 million previously.
Follow-ons look completely different. They attracted roughly $17.03 billion during the latest period, up from $4.73 billion, and their median size increased from $23.8 million to $52.5 million.
That is where the market has really changed.
Companies such as Cerebras, Rebellions, Ayar Labs and Etched have been able to return to investors with stronger products, manufacturing plans or customer evidence and raise much larger sums. Meanwhile, the financing available to a typical company entering the funded ecosystem looks almost unchanged.
For now, semiconductor investors seem much more willing to increase the size of a successful existing bet than to dramatically expand the number or size of new ones.
This chart, featured in our semiconductor industry deck, looks at TSMC’s strategy in semiconductors
Have $100 million semiconductor rounds become normal?
Nine-figure semiconductor rounds are now common enough to shape the whole funding market.
We counted 43 financings strictly above $100 million, compared with 16 during the previous period. If rounds at exactly $100 million are included, the current figure rises to 45.
That means roughly one in three semiconductor financings in our current dataset reached at least $100 million. A year earlier, it was roughly one in ten.
Some of the latest examples are huge even by semiconductor standards. A Tenstorrent Form D filed with the SEC reports $1.2868 billion already sold to 134 investors. Cerebras closed $1.1 billion. Positron announced an $875 million round structure. Etched raised $700 million in August after raising $300 million only weeks earlier.
Below those headline deals, we still find $500 million for Ayar Labs, $500 million for MatX, $400 million for Rebellions and $312 million for OLIX.
A $200 million or $300 million semiconductor round no longer automatically sits among the two or three exceptional deals of the year.
| Funding measure | Current 12M | Previous 12M |
|---|---|---|
| Median disclosed round | $29.5m | $21.8m |
| Average disclosed round | $140.8m | $81.8m |
| Rounds strictly above $50m | 53 | 21 |
| Rounds strictly above $100m | 43 | 16 |
| Rounds at $100m or more | 45 | 16 |
| Capital from >$50m rounds | 93.4% | 83.2% |
| Capital from >$100m rounds | 89.0% | 79.8% |
| Top-three share of capital | 23.0% | 51.2% |
Which part of semiconductor funding is gaining the most momentum?
Logic semiconductors and AI compute have become the center of gravity of semiconductor funding.
Logic companies increased their share of deals from 46.6% to 57.8%. Their share of capital jumped even more, from 40.8% to 73.5%.
Typical rounds also became much bigger. The logic-semiconductor median climbed from about $23.9 million to $117.5 million.
Several very recent financings make the shift easy to see. Positron raised around its next generation of inference silicon. Etched is financing large-scale inference systems. MatX says its $500 million Series B will help finish development of its LLM processor and scale manufacturing. OLIX raised $312 million as it works toward its first AI infrastructure racks. Rebellions followed a $250 million Series C with a $400 million pre-IPO financing.
Cerebras sits at the more mature end of the same trend. The company said its $1.1 billion raise would fund processor and system development alongside more manufacturing and data-center capacity.
Demand outside the private funding market points in the same direction. In its latest second-quarter earnings call, TSMC described AI-related demand as "extremely robust" and said the growth of AI continues to increase demand for leading-edge silicon. TSMC's dollar revenue for the quarter was up 33.7% year over year.
Right now, logic is the rare semiconductor category where deal breadth, capital share and financing size are all moving strongly upward together.
| Category | Current deal share | Previous deal share | Current capital share | Current median |
|---|---|---|---|---|
| Logic semiconductors | 57.8% | 46.6% | 73.5% | $117.5m |
| Analog | 17.0% | 18.0% | 2.2% | $14.0m |
| Power | 10.4% | 14.9% | 3.1% | $20.3m |
| Sensors | 5.9% | 14.9% | 1.0% | $7.0m |
| Foundry services | 5.2% | 1.9% | 19.0% | $252m |
| Memory | 3.7% | 3.7% | 1.3% | $37m |
This chart, featured in our semiconductor industry deck, shows annual funding in semiconductor startups
Is AI chip funding squeezing the rest of the semiconductor market?
AI chip funding is taking a much bigger share of semiconductor capital while several less AI-heavy parts of the market have thinned out.
Sensors provide the clearest contrast. Sensor-semiconductor deals fell from 24 to eight, cutting their share of activity from 14.9% to 5.9%.
Power semiconductors also lost deal share, from 14.9% to 10.4%. Analog activity was more stable, but analog companies captured only 2.2% of current capital.
There is another useful clue in deal sizes. The $20 million to $50 million segment fell from 46 financings to 30, while nine-figure rounds exploded in frequency. The middle of the market has become noticeably thinner.
We cannot show that investors literally redirected money from a sensor startup into an AI accelerator startup. Funding decisions do not work that neatly. What we can see is where investors are willing to stretch round sizes far beyond last year's norms.
The latest industry demand evidence helps explain why. TSMC recently said AI-related demand remained extremely strong while price-sensitive consumer end markets were under more pressure. That gap between AI infrastructure and more conventional electronics is now visible in private fundraising too.
Has semiconductor funding moved later-stage?
Semiconductor funding is much more later-stage today, with Series C showing the sharpest jump.
Later-stage financings increased from 36.0% to 51.1% of all deals. Early-stage share moved from 42.9% to 37.8%.
Series C tells the story particularly well. Deal count went from 11 to 23, while the median financing doubled from $115 million to $230 million.
Series A moved the other way in terms of share. It represented 17.8% of current deals, down from 24.8%, despite a higher median round.
Seed financing is still active, with 27 deals in the latest period. The change is more about where the weight of the market has moved. A much bigger portion of current activity now sits with companies several financing steps beyond initial formation.
That fits what we see in the large company announcements lately: manufacturing ramps, rack-scale products, tape-outs, data-center deployments and international expansion are showing up more often than basic company formation.
| Stage | Current deals | Current share | Current median | Previous share |
|---|---|---|---|---|
| Seed | 27 | 20.0% | $5.8m | 18.0% |
| Series A | 24 | 17.8% | $37.3m | 24.8% |
| Series B | 24 | 17.8% | $30.7m | 16.1% |
| Series C | 23 | 17.0% | $230m | 6.8% |
| Series D+ | 9 | 6.7% | $200m | 6.2% |
| Growth Equity | 13 | 9.6% | $46.1m | 6.8% |
| Unknown | 15 | 11.1% | $16m | 21.1% |
This chart, featured in our semiconductor industry deck, compares the main business model options for fabless semiconductor companies
Are semiconductor investors getting more selective?
Semiconductor investors look more selective now: fewer companies are getting checks, while repeat conviction among active investors has become more visible.
We found 112 unique disclosed lead-investor names in the latest period, compared with 116 previously. Investor breadth therefore barely changed even though deal activity declined.
Repeat participation moved more clearly. Twelve investors appeared as disclosed leads more than once, up from five.
There is some data-quality improvement in the comparison, because disclosed lead coverage rose from 54.0% to 63.7%. We would therefore avoid turning the exact change into a sweeping claim about the entire investor population.
Still, the wider funding picture points in the same direction. The market has fewer funded companies, larger follow-ons, more late-stage activity and many more nine-figure rounds.
Investors have plenty of money for semiconductor companies they really like. Getting into that group appears harder than it was a year ago.
Are strategic investors becoming more important in semiconductor funding?
Strategic capital is playing a bigger role in semiconductor funding now, especially when companies move from chip development into production.
Strategic investors participated in 41.5% of current deals, up from 31.7%. The median strategically backed financing rose from $24 million to $84.5 million.
The individual deals make that shift feel much less abstract.
Ayar Labs' $500 million round included strategic semiconductor investors such as AMD, Alchip and MediaTek, while NVIDIA was already among its strategic backers. The company later disclosed another $150 million in funding and a strategic investment from Wiwynn as it moved toward high-volume manufacturing.
Rebellions' $250 million Series C brought in Arm and Samsung Ventures. The company followed it with a $400 million pre-IPO round aimed at scaled production and international expansion.
Rapidus goes even further. Its $1.7 billion February financing combined ¥100 billion from Japan's Information-Technology Promotion Agency with ¥167.6 billion from 32 private companies. Japan's Ministry of Economy, Trade and Industry explicitly framed the project as part of the country's advanced-semiconductor strategy.
These deals show why strategic investors become more useful as semiconductor companies mature. Scaling a chip company requires access to manufacturing, packaging, memory, systems integration, customers and sometimes government support. Money is only one part of the relationship.
This chart, featured in our semiconductor industry deck, shows the revenue mix across customer segments in the semiconductor industry
Is North America pulling ahead in semiconductor funding?
North America is the clearest geographic gainer in semiconductor funding right now.
Deals rose from 28 to 47, even as overall market activity fell. North America's share of transactions consequently doubled from 17.4% to 34.8%.
Round size moved even faster. The regional median climbed from $24.5 million to $80 million, while recorded capital increased from about $2.70 billion to $9.14 billion.
The current AI-compute cycle explains a large part of that move. Cerebras, Tenstorrent, Positron, Etched, Ayar Labs and MatX all sit in the North American ecosystem and all raised unusually large amounts during the period.
This is one place where the change goes beyond headline capital. North America gained actual deals, a much higher median and a larger capital share at the same time.
Europe also improved on financing size, with its median rising from $7.45 million to $21.1 million despite relatively little change in absolute deal volume.
For now, North America's advantage comes mainly from the part of the semiconductor market attracting the largest checks: AI compute, inference, interconnect and adjacent infrastructure.
Is Asia-Pacific semiconductor funding actually weakening?
Asia-Pacific semiconductor funding has become far more selective, with roughly half as many deals competing for almost the same amount of money.
Deal count fell from 104 to 57. Yet regional capital remained around $6.3 billion to $6.5 billion.
That is a dramatic change in the experience of raising money even though the capital total itself looks stable.
Rapidus is an extreme example of what the surviving upper end can look like, with its $1.7 billion financing tied to 2nm production. Rebellions raised $250 million and then $400 million within roughly six months as it pushed its inference infrastructure overseas.
At the same time, many smaller Asia-Pacific financings disappeared from the comparison. The region's deal share fell from 64.6% to 42.2%.
So an aggregate funding chart would make Asia-Pacific look surprisingly resilient. A founder counting how many companies actually got financed would come away with a very different impression.
This chart, featured in our semiconductor industry deck, shows how advanced foundry node manufacturing technology has evolved over time
Are semiconductor companies raising again faster now?
Semiconductor companies are raising much larger follow-ons, but we cannot show that they are coming back to market faster.
For current follow-on deals where we could reconstruct an earlier financing, the median interval was 12.7 months. The equivalent figure in the previous period was 5.5 months.
The problem is coverage. We have usable prior-round dates for 42 of 111 current follow-ons, compared with only 16 of 134 in the earlier period. Comparing those two medians as if they represented the full market would give the numbers more authority than they deserve.
Round-size step-ups have a similar issue. Among the usable current pairs, the median new round was 1.6 times the previous one, and 40.5% increased by more than 2x. The earlier period has only nine usable size pairs.
We therefore have good evidence that follow-on checks got bigger. The timing question remains open.
Do semiconductor startups need more proof to raise big money now?
The biggest semiconductor rounds currently cluster around companies that can show working silicon, real deployments or a credible path into high-volume production.
Several of the latest financings are unusually concrete on this point.
Etched announced its $700 million round after shipping its first rack to Jane Street. The company says it is now ramping production and building factories, supply chains and fleet software.
Ayar Labs raised $500 million to accelerate high-volume production of its co-packaged optics technology, then added another $150 million to support manufacturing readiness, validation and further product development.
Rapidus had already demonstrated electrical characteristics from prototype 2nm GAA transistors before completing its major 2026 financing. Its stated objective is mass production in 2027.
Positron says more than 50 Atlas racks had been deployed at Oracle before its latest $875 million financing. The new capital is tied to next-generation Asimov silicon and Titan systems.
Interestingly, company age barely changed. The median remained four years across both periods, while the average moved only from 4.9 to 5.3 years. Investors are therefore paying up for progress much more than for age itself.
The current bar for very large checks looks increasingly industrial: show that the chip works, show that someone wants it, and show that you can turn it into a product at scale.
In our semiconductor industry deck, we identify pain points entrepreneurs should prioritize
What are semiconductor companies raising money to do now?
Big semiconductor rounds are increasingly paying for manufacturing, tape-outs, data-center capacity and customer deployment.
Cerebras said its $1.1 billion financing would expand AI processor and system development, U.S. manufacturing capacity and U.S. data-center capacity.
Positron has described a similarly practical set of uses around its next-generation silicon, Titan systems, engineering infrastructure and production ramp.
Ayar Labs is putting capital into product development, validation and the manufacturing ecosystem needed for high-volume co-packaged optics.
MatX's founder said its $500 million Series B would help complete development, reach tape-out and scale manufacturing.
Rapidus is using capital to move a 2nm program from R&D toward mass production, while Etched says its latest funding will support the factories, supply chains and infrastructure needed for gigawatt-scale inference deployments.
We cannot put a clean percentage on this shift because use of funds is not consistently disclosed across every financing. Still, the company announcements around many of the largest recent rounds line up remarkably well.
These days, a lot of semiconductor capital is paying for the expensive jump between proving a chip and delivering it at industrial scale.
What is the most misleading semiconductor funding headline right now?
"Semiconductor funding nearly doubled" is technically true and still gives the wrong picture of today's market.
Headline capital rose 86.8%, but the increase sits overwhelmingly in large scale-up rounds. As seen above, capital below the >$50 million group actually contracted, while the number of companies receiving funding also fell.
The first-financing market changed very little in typical round size. Later-stage companies, by contrast, can now raise amounts that would have looked exceptional only a year ago.
That distinction explains why two people can look at the same market and reach opposite conclusions. A late-stage AI-chip company with working silicon may see one of the best fundraising environments the sector has had. A younger semiconductor startup looking for an ordinary institutional round is facing a market with fewer funded companies and a thinner middle.
The biggest story in semiconductor funding today is the higher financing ceiling, alongside a higher bar for getting meaningful scale capital.
This chart, featured in our semiconductor industry deck, shows the revenue mix across Europe, Asia, North America, Africa, and South America in the semiconductor industry
What really changed over the last 12 months?
The biggest change is the split between breadth and depth. Semiconductor funding now supports fewer companies, while the companies that clear the funding bar can raise far more capital.
Large rounds have become a normal part of the market rather than rare exceptions. Roughly one-third of current financings reached at least $100 million, and the capital is spread across a much larger group of scale-stage businesses than a year ago.
Existing winners captured most of the improvement. Initial financing conditions barely changed, while follow-on capital expanded dramatically. Investors appear much more willing to scale a proven semiconductor company than to broaden the pool of new ones.
AI compute and logic semiconductors have the clearest momentum. They gained deal share as well as capital share, which makes the current shift much more convincing than a category boom created by one oversized transaction.
The funding bar has also moved toward industrial proof. Working silicon, customer deployments, tape-outs, manufacturing readiness and production capacity show up repeatedly around today's biggest rounds. Median company age barely changed, so maturity here is about execution rather than simply being older.
Geography moved as well. North America gained both transactions and financing size, while Asia-Pacific kept roughly the same amount of capital with far fewer deals. The experience of fundraising has therefore become much more uneven across regions and company types.
Overall, the semiconductor market currently looks more mature and much better at financing scale, while access to funding has narrowed. Looking only at total dollars would miss the most important change: more capital is available than before, but a smaller group of companies is getting most of the benefit.
OUR METHODOLOGY
This analysis asks what funding is like in the semiconductor industry right now by comparing private-company financing activity from 20 September 2025 through 19 September 2026 with the immediately preceding 12 months, from 20 September 2024 through 19 September 2025. Using consecutive periods of identical length lets us compare the current market with a clean prior-period baseline rather than mixing a partial year with a full calendar year.
We built the dataset deal by deal from company and investor announcements, regulatory filings, government records, reputable financial and industry reporting, and established funding databases. Where several public sources were available, we cross-checked material facts such as the financing date, amount, stage, investor participation and use of funds.
We included qualifying private-company equity financings where semiconductors were the company's overwhelming core business at the time of the deal. Debt, grants, loans, public offerings and financing structures whose equity component could not be isolated reliably were excluded. Each genuinely separate financing counts as one deal, while duplicate reports, extensions, additional closes and tranches were reviewed individually.
The quality-control pass focused on duplicate financings, date boundaries, financing type, company eligibility and unusually large or small amounts. We consolidated duplicate reports including Anabatic Semiconductor's KRW15 billion financing, Sunrise's near-RMB1 billion round and YXME's near-RMB100 million angel financing before calculating the period comparisons.
Amounts described only as approximate or minimum values remain approximate or lower-bound amounts in the analysis. We did not infer undisclosed funding stages, assume that a prominent investor led a round, or fill in missing company milestones. The same caution applies to funding-velocity analysis, where prior-round-date coverage is much thinner than it is for basic deal count and financing size.
Key sources used to verify the company examples and market explanations include Cerebras on its $1.1 billion financing and use of funds, Rapidus on its ¥267.6 billion public-private financing, Rapidus on its 2nm GAA transistor milestone, Japan's Ministry of Economy, Trade and Industry on government and private-sector participation, Positron's financing history, Ayar Labs on its $500 million Series E and production plans, Ayar Labs on the additional $150 million, Etched on its $700 million financing and production ramp, Rebellions on its $250 million Series C, Rebellions on its $400 million pre-IPO financing, OLIX on its $312 million Series B, Tenstorrent Holdings' SEC Form D, TSMC's second-quarter 2026 results, and TSMC's second-quarter 2026 earnings transcript.
This chart, featured in our semiconductor industry deck, shows annual venture capital investment in semiconductor startups