Semiconductor Funding Tracker (373 deals)
In our semiconductor industry deck, you will find everything you need to understand the market
SUMMARY
Semiconductor Funding Tracker (383 deals) shows a market worth at least $34.22 billion, but that headline is much larger than the market most semiconductor companies actually experience. In the analyzed cohort, the typical disclosed financing was about $24 million, and less than $5 billion remains once rounds above $100 million are removed.
Funding is unusually concentrated. Ten companies collected roughly 52% of quantifiable capital, with BOE Integrated, CXMT, Rapidus and Cerebras alone accounting for more than $10 billion.
Repeat fundraisers punch far above their numbers. Only 55 of the 309 companies raised more than once during the period, yet those companies accumulated about $20.2 billion, versus roughly $14.0 billion for the 254 companies that appeared only once.
The normal financing still sits well below the rounds that dominate semiconductor headlines. Roughly 69% of disclosed deals were below $50 million, while financings of $100 million or more generated about 86% of all quantifiable capital.
Different semiconductor businesses barely belong in the same funding market. Logic produced 191 deals and $20.48 billion, while just ten foundry-services financings absorbed $7.51 billion. Sensors produced 39 deals but only about $455 million.
The real funding cliff appears around Series C. Median round size moves from roughly $27.8 million at Series B to about $135 million at Series C, while the number of companies continuing through later stages drops sharply.
Investors are mostly financing companies they already know. We classified 313 of 374 financings as follow-ons, and their median size was about $27 million compared with only $7.9 million for first financings.
Strategic capital is deeply embedded in the sector. Corporate investors appeared in roughly 38% of the financings we tracked, and rounds involving an identifiable strategic investor had a median size of about $43.5 million, versus $16.7 million without one.
Geography changes depending on whether we count deals or dollars. China produced 161 financings worth at least $12.81 billion, while the United States generated only 86 deals but roughly $13.90 billion. Europe contributed 66 financings yet only about $2.53 billion.
The $34.22 billion total should be read as a documented floor. Only 303 of 374 financings had a usable amount, and semiconductor deals frequently mix equity, government capital, grants, loans, tranches and other structures that make neat comparisons difficult.
This market map, featured in our semiconductor industry deck, highlights top companies and startups in the semiconductor industry
Our funding tracker covering the semiconductor industry
Below is the table listing all the deals. You may find our methodology at the end of this page.
And, if you want to gain a deeper understanding of the market and its current dynamics, get our report covering the Semiconductor Industry.
| Company | Category | Date | Stage | Deal size | What they do | Region | Lead investors |
|---|---|---|---|---|---|---|---|
| Teram | Memory Semiconductors | September 2026 | Seed | $37M | Develops custom vertically integrated 3D SRAM memory chips for high-bandwidth AI inference. | North America | Primary Venture Partners; B Capital; Hyperion; SemiAnalysis Capital |
| Ayar Labs | Logic Semiconductors | September 2026 | Series D+ | $150M | Develops silicon-photonic optical engines that provide chip-to-chip optical connectivity for AI processors. | North America | Not disclosed |
| Positron AI | Logic Semiconductors | September 2026 | Series C | $875M | Designs memory-first AI inference processors and systems centered on its custom Asimov silicon. | North America | NEA; Atreides Management; Valor Equity Partners; Andra Capital; SemiAnalysis Capital; Jim Clark |
| SciSemi | Logic Semiconductors | September 2026 | Unknown | ≈$2,760,000 | Develops memory-safe processors implementing hardware-enforced CHERI security for critical computing systems. | Europe | Mercia Ventures; PXN Ventures |
| NanoCore | Logic Semiconductors | September 2026 | Series C | ≈$249,000,000 | Develops 3D compute-in-memory AI inference chips combining near-memory, SRAM-CIM and RISC-V processing. | Asia-Pacific | Not disclosed |
| Tenstorrent | Logic Semiconductors | September 2026 | Series D+ | $1.3B | Designs AI accelerator processors and RISC-V-based computing silicon for AI workloads. | North America | Not disclosed |
| Celero | Logic Semiconductors | September 2026 | Series C | $275M | Designs coherent DSP semiconductors for high-bandwidth optical connectivity in AI data centers. | North America | Atreides Management; Valor Equity Partners; CapitalG |
| S-Transistors | Logic Semiconductors | August 2026 | Seed | $3M | Develops superconducting-transistor integrated circuits for ultra-low-power cryogenic control and computing. | Europe | Lifeline Ventures |
| Celera Semiconductor | Analog Semiconductors | August 2026 | Series B | $30M | Supplies custom and standard analog integrated circuits, including power-management ICs, using AI-assisted design automation. | North America | Maverick Silicon |
| Quintessent | Analog Semiconductors | August 2026 | Series A | $40M | Develops quantum-dot semiconductor laser chips and integrated photonic components for AI data-center optical interconnects. | North America | Cycle Capital |
| iHW | Logic Semiconductors | August 2026 | Series A | $37.5M | Develops ultra-low-power AI processors using analog compute-in-memory architectures. | Asia-Pacific | Kolon Investment |
| Singular Photonics | Sensor Semiconductors | August 2026 | Seed | $2.2M | Designs fabless CMOS SPAD image-sensor chips for photon counting, timing and computational imaging. | Europe | ACF Investors |
| Etched | Logic Semiconductors | August 2026 | Unknown | $700M | Designs proprietary high-performance AI inference processors and the rack-scale systems built around them. | North America | Jane Street |
| Velaura | Logic Semiconductors | August 2026 | Series A | $110M | Develops ultra-low-power AI silicon architectures and chips for data-center and physical-AI computing. | North America | Seligman Ventures |
| OLIX | Logic Semiconductors | August 2026 | Series B | $312M | Develops specialized AI-inference silicon connected through low-latency optical interconnects for large-scale inference systems. | Europe | Not disclosed |
| Xsight Labs | Logic Semiconductors | July 2026 | Series D+ | >$200,000,000 | Develops fabless Ethernet switch silicon and data-processing units for hyperscale, edge and AI data-center networks. | Middle East | Fidelity Management & Research Company |
| Eliyan | Logic Semiconductors | July 2026 | Series C | $145M | Develops high-bandwidth semiconductor interconnect and chiplet-connectivity technologies for AI compute, memory and networking systems. | North America | Seligman Ventures |
| Etched | Logic Semiconductors | July 2026 | Series C | $300M | Develops purpose-built semiconductor accelerators optimized for transformer-model AI inference. | North America | Sequoia |
| TYLsemi | Logic Semiconductors | July 2026 | Unknown | $43M | Develops production-ready chiplets for connectivity, power delivery and memory used to build custom AI silicon. | North America | Matter Venture Partners |
| Stathera | Analog Semiconductors | June 2026 | Series B | $55M | Develops fabless MEMS-based silicon timing oscillators and synchronization devices for mobile, IoT and data-center systems. | North America | Maverick Silicon |
| OpenChip | Logic Semiconductors | June 2026 | Growth Equity | $132M | Designs and commercializes energy-efficient RISC-V processors and SoCs for AI and high-performance computing. | Europe | Not disclosed |
| Reed Semiconductor | Power Semiconductors | June 2026 | Series D+ | $100M | Designs fabless power-management semiconductors including controllers, smart power stages, eFuses and power modules for AI/HPC and other electronics. | North America | Not disclosed |
| ALP Semiconductor | Power Semiconductors | June 2026 | Unknown | $19.5M | Develops wide- and ultra-wide-bandgap semiconductor power switches for solid-state circuit breakers and high-voltage power distribution. | Europe | Yotta Capital |
| Xiver | Foundry Services | June 2026 | Growth Equity | $28.9M | Operates an independent MEMS wafer foundry providing process development, industrialization and volume manufacturing services. | Europe | Cees Meeuwis |
| GreatASIC | Logic Semiconductors | June 2026 | Unknown | $6.9M | Designs custom ASICs and AI SoCs for data-center, edge-AI and automotive applications under a fabless model. | Asia-Pacific | Vertex Ventures Southeast Asia & India |
| InnoSeis | Sensor Semiconductors | June 2026 | Seed | $6.9M | Develops ultra-sensitive, low-power MEMS inertial sensors for precision motion and vibration measurement. | Europe | FORWARD.one |
| Rapidus | Foundry Services | June 2026 | Growth Equity | $943M | Develops and manufactures leading-edge logic semiconductors through a domestic advanced-node foundry, initially targeting 2nm production. | Asia-Pacific | Not disclosed |
| Xcena | Logic Semiconductors | May 2026 | Series B | $135M | Develops computational-memory semiconductor devices combining pooled DDR memory with near-data processors for AI infrastructure. | Asia-Pacific | Atinum Investment; IMM Investment |
| Moffett AI | Logic Semiconductors | May 2026 | Series C | ≈$240,000,000 | Designs sparse-computing AI inference accelerator chips for data-center workloads. | Asia-Pacific | Not disclosed |
| C2i Semiconductors | Power Semiconductors | May 2026 | Series A | $1.7M | Develops integrated voltage-regulator and power-delivery semiconductor devices for AI data-center processors. | Asia-Pacific | Not disclosed |
| PhotonicX AI | Analog Semiconductors | May 2026 | Unknown | Not Disclosed | Develops optical-I/O chiplets, silicon-photonic chips and associated high-speed driver and TIA ICs for AI interconnects. | Asia-Pacific | Not disclosed |
| Cyient Semiconductors | Power Semiconductors | May 2026 | Growth Equity | $10M | Designs custom semiconductor products and application-specific standard products, with a focus including power and mixed-signal ICs. | Asia-Pacific | Not disclosed |
| Vifan Intelligence | Logic Semiconductors | May 2026 | Seed | Not Disclosed | Develops AI fusion processor chips intended to serve as the central compute “brain” for embodied robots. | Asia-Pacific | Zhongguancun Capital (中关村资本); Qihang Investment (启航投资) |
| Sicoya | Analog Semiconductors | May 2026 | Series B | Not Disclosed | Develops silicon-photonic and analog electrical ICs for high-speed optical interconnects. | Asia-Pacific | Not disclosed |
| KD Technologies | Analog Semiconductors | May 2026 | Growth Equity | ≈$2,200,000 | Designs automotive optical-networking transceiver and PHY ASICs for high-speed plastic optical-fiber communications. | Europe | Not disclosed |
| Fractile | Logic Semiconductors | May 2026 | Series B | $220M | Designs inference accelerator chips using in-memory and near-memory compute architectures for AI workloads. | Europe | Accel; Factorial Funds; Founders Fund |
| PhotonCore | Logic Semiconductors | May 2026 | Seed | Not Disclosed | Develops heterogeneous photonic-electronic AI compute chips combining metasurface photonic computing with electronic chiplets. | Asia-Pacific | 苏州芯阳基金; 驰星创投; 盛景嘉成 |
| SemiDrive | Logic Semiconductors | May 2026 | Series C | ≈$200,000,000 | Designs automotive-grade SoCs and microcontrollers for vehicle compute, cockpit, gateway and control applications. | Asia-Pacific | Suzhou Industrial Investment (苏产投) |
| Casimir | Power Semiconductors | May 2026 | Seed | $12M | Develops semiconductor chips intended to harvest ambient quantum-vacuum energy for electronic power applications. | North America | Scout Ventures |
| HRDWYR | Logic Semiconductors | May 2026 | Series A | $13M | Designs domain-specific and AI-native system-on-chip processors for high-performance computing applications. | Asia-Pacific | Ideaspring Capital |
| eyeo | Sensor Semiconductors | May 2026 | Series A | ≈$27,100,000 | Develops nanophotonic color-splitting image sensors intended to capture substantially more incoming light than conventional filtered sensors. | Europe | Innovation Industries |
| Legend Semiconductor | Analog Semiconductors | May 2026 | Series B | ≈$24,000,000 | Designs high-precision analog and mixed-signal signal-chain ICs including AFE, ADC and DAC products. | Asia-Pacific | Not disclosed |
| EVAS Intelligence | Logic Semiconductors | May 2026 | Growth Equity | Not Disclosed | Designs RISC-V-based AI accelerator chips for cloud and data-center computing. | Asia-Pacific | Not disclosed |
| Picocom | Logic Semiconductors | May 2026 | Series C | Not Disclosed | Designs programmable baseband SoCs for 5G, 5.5G, non-terrestrial and future wireless-network infrastructure. | Asia-Pacific | Not disclosed |
| FlexiIC | Logic Semiconductors | May 2026 | Seed | ≈$2,400,000 | Develops flexible thin-film integrated circuits for sensing, logic and communications applications. | Europe | Bullnet Capital |
| BigEndian Semiconductors | Logic Semiconductors | May 2026 | Unknown | $6M | Designs application-specific SoCs for surveillance, imaging, security and related embedded-compute markets. | Asia-Pacific | IAN Alpha Fund |
| Oritek | Logic Semiconductors | May 2026 | Series C | Not Disclosed | Designs system-level AI SoCs for automotive, industrial, robotics and AIoT applications. | Asia-Pacific | Not disclosed |
| Tsavorite SI | Logic Semiconductors | May 2026 | Unknown | $5M | Develops an integrated AI-processing semiconductor architecture combining CPU, GPU, memory and connectivity functions. | North America | Not disclosed |
| Reexen | Logic Semiconductors | May 2026 | Series C | Not Disclosed | Designs SRAM-based compute-in-memory AI processor chips and related mixed-signal semiconductor technology. | Asia-Pacific | Not disclosed |
| Mosaic SoC | Logic Semiconductors | April 2026 | Seed | $3.8M | Designs ultra-low-power perception processor chips for real-time spatial intelligence in wearables and mobile devices. | Europe | Founderful |
| OpenLight | Logic Semiconductors | April 2026 | Series A | $50M | Designs and manufactures heterogeneous silicon-photonic application-specific integrated circuits with integrated lasers, modulators, amplifiers and detectors. | North America | Matter Venture Partners |
| Point2 Technology | Analog Semiconductors | April 2026 | Series B | $31.4M | Develops RF and mixed-signal interconnect SoCs for multi-terabit AI data-center cable connectivity. | North America | Maverick Silicon |
| Hyfix | Logic Semiconductors | April 2026 | Seed | $15M | Designs integrated SoCs combining flight control, positioning, communications and onboard compute for drones and autonomous robots. | North America | Craft Ventures |
| Neye | Logic Semiconductors | April 2026 | Series C | $80M | Develops single-chip optical circuit switches integrating silicon photonics, MEMS and CMOS for AI data-center interconnects. | North America | Sutter Hill Ventures |
| CIX Technology | Logic Semiconductors | March 2026 | Series B | ≈$245,000,000 | Designs Arm-based general-purpose and AI-capable CPU chips for PCs, edge systems and intelligent terminals. | Asia-Pacific | Shanghai IC Fund; Pudong Venture Capital |
| Rebellions | Logic Semiconductors | March 2026 | Growth Equity | $400M | Designs AI inference accelerator semiconductors and related chip platforms. | Asia-Pacific | Mirae Asset Financial Group; Korea National Growth Fund |
| Anabatic Semiconductor | Analog Semiconductors | March 2026 | Unknown | ≈$20,000,000 | Develops analog-front-end and related battery-management semiconductor ICs for EV and energy-storage batteries. | Asia-Pacific | Not disclosed |
| Anabatic Semiconductor | Analog Semiconductors | March 2026 | Series B | ≈$20,300,000 | Develops analog-front-end and related battery-management semiconductor ICs for EV and energy-storage batteries. | Asia-Pacific | Not disclosed |
| Epic Microelectronics | Power Semiconductors | March 2026 | Series A | $21M | Develops semiconductor-based vertical power-delivery technology for high-power AI processors. | North America | Seligman Ventures |
| Kandou | Logic Semiconductors | March 2026 | Series A | $225M | Designs and sells high-speed semiconductor retimers, switches and chip-to-chip interconnect products for AI and other computing systems. | Europe | Maverick Silicon |
| SPARK Microsystems | Analog Semiconductors | March 2026 | Series B | ≈$22,400,000 | Designs fabless ultra-low-power UWB wireless transceiver chips for real-time device connectivity. | North America | Idealist Capital; Real Ventures |
| RongSemi | Foundry Services | March 2026 | Series A | ≈$252,000,000 | Manufactures 12-inch semiconductor wafers using mature and specialty process technologies. | Asia-Pacific | Not disclosed |
| AlpsenTek | Sensor Semiconductors | March 2026 | Series B | Not Disclosed | Develops hybrid-vision image sensor chips combining conventional imaging with event-based sensing. | Asia-Pacific | Not disclosed |
| Agnit Semiconductors | Analog Semiconductors | March 2026 | Seed | $2.6M | Develops and manufactures GaN semiconductor devices, initially focused on RF chips and expanding into power devices. | Asia-Pacific | Shastra VC |
| GreatSky AI | Logic Semiconductors | March 2026 | Seed | $14M | Develops superconducting optoelectronic computing chips designed for highly energy-efficient AI processing. | North America | Bison Ventures |
| Lenzo | Logic Semiconductors | March 2026 | Seed | ≈$2,200,000 | Develops compute chips based on its Coarse-Grained Linear Array architecture for energy-efficient AI and blockchain workloads. | Asia-Pacific | Not disclosed |
| Xscape Photonics | Logic Semiconductors | March 2026 | Series A | $37M | Develops silicon-photonics chips and optical connectivity technology for AI data-center interconnects. | North America | Addition |
| Amber Semiconductor | Power Semiconductors | March 2026 | Series C | $30M | Develops fabless power-management semiconductors for vertical power delivery to high-performance AI processors. | North America | Not disclosed |
| Eridu AI | Logic Semiconductors | March 2026 | Series A | $200M | Develops high-radix AI data-center networking switch silicon and associated networking systems. | North America | Socratic Partners; John Doerr; Hudson River Trading; Capricorn Investment Group; Matter Venture Partners |
| Vertical Compute | Memory Semiconductors | March 2026 | Seed | ≈$22,900,000 | Develops vertically integrated high-density memory chips intended to reduce AI memory-bandwidth bottlenecks. | Europe | Quantonation |
| Ayar Labs | Logic Semiconductors | March 2026 | Series D+ | $500M | Develops silicon-photonics optical I/O chiplets for high-bandwidth, low-power AI accelerator interconnects. | North America | Neuberger Berman |
| Fangqing Technology | Logic Semiconductors | March 2026 | Unknown | ≈$245,100,000 | Develops AI computing chips for decoupled and distributed AI-compute architectures. | Asia-Pacific | Not disclosed |
| Leapers Semiconductor | Power Semiconductors | March 2026 | Unknown | ≈$24,500,000 | Develops and sells automotive and industrial SiC and IGBT power semiconductor modules. | Asia-Pacific | Not disclosed |
| Rapidus | Foundry Services | February 2026 | Growth Equity | $1.7B | Develops and plans to manufacture leading-edge logic semiconductors as a 2nm wafer-foundry provider. | Asia-Pacific | Not disclosed |
| Axelera AI | Logic Semiconductors | February 2026 | Series C | >$250,000,000 | Designs energy-efficient AI inference accelerator chips using digital in-memory computing for edge and data-center applications. | Europe | Innovation Industries |
| MatX | Logic Semiconductors | February 2026 | Series B | $500M | Designs custom AI accelerator processors optimized for large-language-model training and inference. | North America | Jane Street; Situational Awareness |
| OptoML | Logic Semiconductors | February 2026 | Seed | $1.8M | Designs fabless AI accelerator SoCs combining analog in-memory computing with high-bandwidth optical interconnects. | Asia-Pacific | Bluehill.VC; a99 |
| BOS Semiconductors | Logic Semiconductors | February 2026 | Series A | $60.2M | Designs fabless automotive SoCs and AI accelerator chiplets for ADAS, in-vehicle computing and gateway applications. | Asia-Pacific | Not disclosed |
| Taalas | Logic Semiconductors | February 2026 | Unknown | $169M | Develops model-specific AI inference chips that hard-wire neural-network parameters into silicon. | North America | Not disclosed |
| Efficient Computer | Logic Semiconductors | February 2026 | Series A | $60M | Develops ultra-low-power general-purpose processors based on a reconfigurable spatial-dataflow architecture. | North America | Triatomic Capital |
| Verve Semiconductor | Analog Semiconductors | February 2026 | Series A | $10M | Designs fabless analog and mixed-signal ICs including data converters, analog front ends and sensing/control chips. | Asia-Pacific | Ashish Kacholia; Unicorn India Ventures |
| C2i Semiconductors | Power Semiconductors | February 2026 | Series A | $15M | Develops power-management ICs, multiphase controllers and smart power stages for AI and high-performance computing systems. | Asia-Pacific | Peak XV Partners |
| OLIX | Logic Semiconductors | February 2026 | Series A | $220M | Develops optical-digital AI accelerator processors for high-performance inference. | Europe | Hummingbird Ventures |
| Positron AI | Logic Semiconductors | February 2026 | Series B | $230M | Develops memory-optimized AI inference accelerators and custom ASICs for large-transformer workloads. | North America | ARENA Private Wealth; Jump Trading; Unless |
| PrimeMas | Logic Semiconductors | January 2026 | Series B | $72M | Develops hub chiplets and SoCs that connect compute, memory and I/O for AI and data-center systems. | North America | Not disclosed |
| Neurophos | Logic Semiconductors | January 2026 | Series A | $110M | Develops integrated photonic optical processing chips for energy-efficient AI inference acceleration. | North America | Gates Frontier |
| Optalysys | Logic Semiconductors | January 2026 | Series A | ≈$21,100,000 | Develops silicon-photonic computing chips that combine data movement and processing for AI and secure-computing workloads. | Europe | Northern Gritstone |
| Sense Semiconductor | Analog Semiconductors | January 2026 | Seed | ≈$2,750,000 | Develops ultra-low-power mixed-signal and edge-AI SoCs combining analog processing, embedded AI and wireless connectivity. | Asia-Pacific | Piper Serica |
| Ethernovia | Logic Semiconductors | January 2026 | Series B | >$20,000,000 | Develops Ethernet packet-processor semiconductor chips for high-bandwidth networking in vehicles, robots and autonomous machines. | North America | Maverick Silicon |
| SpacemiT | Logic Semiconductors | January 2026 | Series B | >$26,000,000 | Develops and sells RISC-V-based CPU and AI processor chips for edge, robotics and computing systems. | Asia-Pacific | Not disclosed |
| Etched | Logic Semiconductors | January 2026 | Series B | ≈$200,000,000 | Develops Sohu, a transformer-specific ASIC designed for high-throughput AI inference. | North America | Stripes |
| Qualinx | Analog Semiconductors | January 2026 | Unknown | ≈$23,300,000 | Develops ultra-low-power digitally implemented GNSS and radio receiver chips for positioning and connectivity devices. | Europe | Invest-NL Deep Tech Fund; FORWARD.ONE; InnovationQuarter; Waterman Ventures |
| Netforward Technology | Logic Semiconductors | December 2025 | Series C | >$242,900,000 | Designs network-interconnect chips including Ethernet switch, PHY, NIC-controller and PCIe-switch devices. | Asia-Pacific | Not disclosed |
| TinyChip | Analog Semiconductors | December 2025 | Growth Equity | ≈$24,300,000 | Designs automotive mixed-signal MCU and SoC chips integrating signal-chain, sensing, power-management and control functions. | Asia-Pacific | Not disclosed |
| 芯微泰克 | Foundry Services | December 2025 | Unknown | >$2,400,000 | Provides specialty wafer-foundry and ultra-thin backside-processing services for advanced power semiconductor devices. | Asia-Pacific | Not disclosed |
| Mythic | Logic Semiconductors | December 2025 | Series D+ | $125M | Designs analog compute-in-memory AI accelerator chips and chiplets for edge and data-center inference. | North America | DCVC |
| NanoXplore | Logic Semiconductors | December 2025 | Growth Equity | ≈$23,500,000 | Designs radiation-hardened FPGA and SoC FPGA semiconductor devices for space, defense and avionics. | Europe | Not disclosed |
| 原集微 | Foundry Services | December 2025 | Seed | ≈$24,200,000 | Develops 2D-semiconductor IC processes and is building an engineering-validation wafer line for external chip fabrication and its own 2D ICs. | Asia-Pacific | 中赢创投; 浦东创投 |
| Innochips | Logic Semiconductors | December 2025 | Series D+ | >≈$14,100,000 | Designs baseband, RF and communications SoCs for mobile, satellite, IoT and base-station applications. | Asia-Pacific | Sichuan Development Xinyun Fund |
| Winner Micro | Logic Semiconductors | December 2025 | Growth Equity | >$1,400,000 | Develops Wi-Fi, Bluetooth, MCU and secure wireless communication semiconductor chips for IoT applications. | Asia-Pacific | Loongson Capital |
| LM Semiconductor | Logic Semiconductors | December 2025 | Seed | >$1,170,000 | Develops fabless connectivity SoCs using its NR+ non-cellular 5G technology for IoT and edge devices. | Europe | Not disclosed |
| Random Power | Logic Semiconductors | December 2025 | Seed | >≈$3,000,000 | Develops quantum random-number-generator ASICs based on semiconductor quantum effects for hardware security. | Europe | Emerald Development Managers; Deep Blue Ventures |
| VisIC Technologies | Power Semiconductors | December 2025 | Series B | $26M | Develops fabless GaN power semiconductor devices for EV traction and other high-power conversion applications. | Middle East | Not disclosed |
| Newsonic | Analog Semiconductors | December 2025 | Series C | ≈$38,000,000 | Designs RF acoustic filter chips and RF front-end semiconductor devices including BAW, SAW and TC-SAW products. | Asia-Pacific | Not disclosed |
| Unconventional AI | Logic Semiconductors | December 2025 | Seed | $475M | Develops physics-based analog AI computing silicon co-designed with its compute architecture and software stack. | North America | Lightspeed Venture Partners; Andreessen Horowitz |
| Starshine Semiconductor | Analog Semiconductors | December 2025 | Series C | >≈$14,100,000 | Develops and manufactures RF acoustic filter chips using SAW, TC-SAW, BAW and related technologies. | Asia-Pacific | Not disclosed |
| Niobium Microsystems | Logic Semiconductors | December 2025 | Seed | >$23,000,000 | Develops custom silicon accelerators for fully homomorphic encrypted computing. | North America | Not disclosed |
| Axiado | Logic Semiconductors | December 2025 | Series C | >$100,000,000 | Develops security and system-management processor silicon for AI servers and data centers. | North America | Maverick Silicon |
| TsingMicro | Logic Semiconductors | December 2025 | Series C | >≈$283,000,000 | Develops reconfigurable AI accelerator and computing chips based on proprietary processor architecture. | Asia-Pacific | Beijing Energy Investment Holding |
| ETL Chip | Logic Semiconductors | December 2025 | Series A | >$1,400,000 | Develops automotive and industrial Ethernet PHY and switch semiconductor chips. | Asia-Pacific | Bojiang Capital |
| Mastiska | Logic Semiconductors | November 2025 | Seed | $10M | Develops fabless GPU-class AI accelerator silicon for data-center training and inference workloads. | Middle East | Not disclosed |
| Sophrosyne Technologies | Sensor Semiconductors | November 2025 | Seed | $2M | Develops ultra-low-power biosensing system-on-chip devices for measuring physiological signals in wearables and digital-health equipment. | Asia-Pacific | Bluehill.VC |
| PowerLattice | Power Semiconductors | November 2025 | Series A | $25M | Develops an integrated power-delivery semiconductor chiplet for GPUs, CPUs and AI accelerators. | North America | Playground Global; Celesta Capital |
| Ferroelectric Memory Company | Memory Semiconductors | November 2025 | Series C | $89M | Designs ferroelectric DRAM+ and 3D CACHE+ memory semiconductor devices based on hafnium-oxide technology. | Europe | HV Capital; DeepTech & Climate Fonds (DTCF) |
| Skycore Semiconductor | Power Semiconductors | November 2025 | Seed | $5.8M | Designs fabless high-voltage power-conversion ICs based on switched-capacitor architectures. | Europe | Amadeus APEX Technology Fund |
| d-Matrix | Logic Semiconductors | November 2025 | Series C | $275M | Develops digital in-memory-compute semiconductor accelerators and chiplets purpose-built for generative-AI inference. | North America | Bullhound Capital; Triatomic Capital; Temasek |
| RAAM Technologies | Memory Semiconductors | November 2025 | Series A | $17.5M | Develops GCRAM embedded-memory semiconductor devices designed as denser, lower-power alternatives to conventional on-chip SRAM. | Middle East | NXP Semiconductors |
| NanoCore | Logic Semiconductors | October 2025 | Series B | >$14,000,000 | Develops 3D compute-in-memory AI processor chips combining CIM, 3D near-memory architecture and RISC-V compute. | Asia-Pacific | 蓝驰创投 |
| LeadingSpeed | Analog Semiconductors | October 2025 | Series B | ≈$14,000,000 | Designs high-speed optical-communications ICs including TIA, driver, CDR and PLL chips for telecom and data-center links. | Asia-Pacific | Not disclosed |
| Eagles Microelectronics | Sensor Semiconductors | October 2025 | Series B | >$98,000,000 | Designs and manufactures VCSEL semiconductor chips for optical interconnect, LiDAR and 3D sensing. | Asia-Pacific | 中信金石; 国新基金 |
| R-Semi | Analog Semiconductors | October 2025 | Series A | >$14,000,000 | Develops and sells automotive high-speed SerDes semiconductor chips for in-vehicle video and sensor data links. | Asia-Pacific | Not disclosed |
| Hefei Wanxin Integrated Circuit | Foundry Services | October 2025 | Growth Equity | ≈$421,000,000 | Builds and operates a 12-inch wafer fabrication line providing foundry manufacturing across logic, display-driver, CIS, power-management and MCU processes. | Asia-Pacific | Not disclosed |
| Vertical Semiconductor | Power Semiconductors | October 2025 | Seed | $11M | Develops vertical gallium-nitride power transistors for high-efficiency power conversion in AI infrastructure and other high-power applications. | North America | Playground Global |
| CVSens | Sensor Semiconductors | October 2025 | Series B | >≈$28,000,000 | Designs high-value CMOS image-sensor chips for automotive vision, security, machine vision, IoT and medical imaging. | Asia-Pacific | Not disclosed |
| Tachyum | Logic Semiconductors | October 2025 | Series C | $220M | Develops the Prodigy universal processor, a compute semiconductor combining CPU, HPC and AI-accelerator workloads. | North America | Not disclosed |
| CIMO Micro | Analog Semiconductors | October 2025 | Series B | >$14,000,000 | Designs high-performance analog signal-chain ICs including ADCs, DACs, amplifiers, voltage references and LDOs. | Asia-Pacific | 北京京国瑞投资管理有限公司 |
| CXMT | Memory Semiconductors | October 2025 | Growth Equity | ≈$63,200,000 | Designs and manufactures DRAM memory semiconductors as an integrated device manufacturer. | Asia-Pacific | Not disclosed |
| MAGICS Technologies | Analog Semiconductors | October 2025 | Unknown | ≈$4,650,000 | Designs and supplies radiation-tolerant CMOS integrated circuits including timing, clocking, imaging and control chips. | Europe | SC One; PMV |
| Falcomm | Analog Semiconductors | October 2025 | Seed | $5.8M | Develops fabless RF power-amplifier and front-end semiconductor devices for satellite, telecom and defense systems. | North America | Not disclosed |
| Cerebras | Logic Semiconductors | September 2025 | Series D+ | $1.1B | Designs wafer-scale AI processors and computing systems centered on its Wafer Scale Engine semiconductor. | North America | Fidelity Management & Research Company; Atreides Management |
| InGaGe MEMS | Sensor Semiconductors | September 2025 | Seed | $7M | Develops fabless multi-axis MEMS inertial sensor chips for high-accuracy navigation. | Europe | Supernova Invest; 360 Capital |
| Rebellions | Logic Semiconductors | September 2025 | Series C | $250M | Designs fabless AI inference accelerator chips for data-center deployments. | Asia-Pacific | Not disclosed |
| Morse Micro | Logic Semiconductors | September 2025 | Series C | ≈$29,000,000 | Designs fabless Wi-Fi HaLow system-on-chip semiconductors for long-range, low-power IoT connectivity. | Asia-Pacific | MegaChips |
| Empower Semiconductor | Power Semiconductors | September 2025 | Series D+ | >$240,000,000 | Develops integrated voltage-regulator and silicon-capacitor semiconductor products for AI and high-performance processors. | North America | Fidelity Management & Research Company |
| Sphere Semiconductor | Analog Semiconductors | September 2025 | Unknown | $12.5M | Develops and fabricates AI-designed custom analog, RF and mixed-signal semiconductor chips. | North America | ACME Capital; Future Ventures |
| Groq | Logic Semiconductors | September 2025 | Unknown | $750M | Designs proprietary LPU inference processors and deploys them in hardware and cloud infrastructure for AI inference. | North America | Disruptive |
| OptiCore | Logic Semiconductors | September 2025 | Seed | $7.5M | Develops photonic optical processing units for compute-intensive and memory-intensive AI workloads. | North America | Origin Ventures; Jetha Global |
| Agate Sensors | Sensor Semiconductors | September 2025 | Seed | ≈$2,700,000 | Develops chip-scale hyperspectral semiconductor sensors for material identification and imaging. | Europe | Voima Ventures; LIFTT |
| SCINTIL Photonics | Logic Semiconductors | September 2025 | Series B | $58M | Develops silicon-photonic integrated circuits with integrated lasers for high-bandwidth AI-data-center interconnects. | Europe | Yotta Capital Partners; NGP Capital |
| NanoPower Semiconductor | Power Semiconductors | September 2025 | Unknown | ≈$2,400,000 | Develops ultra-low-power power-management ICs that minimize standby energy consumption in battery-powered electronics. | Europe | Not disclosed |
| Lightelligence | Logic Semiconductors | September 2025 | Series C | >$210,000,000 | Develops photonic computing and optical-interconnect hardware centered on proprietary silicon-photonic chips for AI computing and data centers. | Asia-Pacific | Not disclosed |
| Lanxin Computing | Logic Semiconductors | August 2025 | Unknown | Not Disclosed | Develops RISC-V server CPU chips for data-center, cloud and AI computing. | Asia-Pacific | Not disclosed |
| TAKR MEMS | Sensor Semiconductors | August 2025 | Series A | Not Disclosed | Develops and manufactures MEMS gas-sensing and temperature-sensing semiconductor devices. | Asia-Pacific | Wuchuang Huagong Fund |
| Minghong Microelectronics | Sensor Semiconductors | August 2025 | Seed | Not Disclosed | Designs silicon-CMOS millimeter-wave radar and sensing chips for communications, security and low-altitude sensing. | Asia-Pacific | Falcon Capital |
| Aowei Lingxin | Logic Semiconductors | August 2025 | Seed | Not Disclosed | Designs high-performance RISC-V processors and programmable acceleration chips for industrial and edge computing. | Asia-Pacific | Chuangdongfang Investment |
| Chengke Microelectronics | Logic Semiconductors | August 2025 | Unknown | >$13,900,000 | Designs high-speed optical-module DSP and SerDes semiconductor chips for data-center and telecom links. | Asia-Pacific | Not disclosed |
| Paragraf | Sensor Semiconductors | August 2025 | Series C | $55M | Manufactures graphene-based semiconductor sensors including Hall-effect and molecular sensing devices. | Europe | Mubadala Capital |
| AzurEngine | Logic Semiconductors | August 2025 | Series B | ≈$14,000,000 | Develops reconfigurable parallel-processing chips for edge AI and embedded computing. | Asia-Pacific | Flyfot Ventures |
| JSCJ Electronics | Power Semiconductors | August 2025 | Growth Equity | Not Disclosed | Produces power discrete semiconductors and power-management ICs including MOSFETs, IGBTs and diodes. | Asia-Pacific | Not disclosed |
| ETL Chip | Logic Semiconductors | August 2025 | Series A | ≈$14,000,000 | Designs automotive and industrial Ethernet communication chips including switching and PHY devices. | Asia-Pacific | Not disclosed |
| PHOVIR | Sensor Semiconductors | August 2025 | Seed | ≈$5,400,000 | Develops chip-scale MEMS near-infrared sensors for compact spectroscopy. | Europe | Northern Gritstone; SCVC |
| SiEngine | Logic Semiconductors | August 2025 | Series B | >$139,000,000 | Designs high-performance automotive SoCs for digital cockpits, intelligent driving and vehicle computing. | Asia-Pacific | China State-owned Enterprise Structural Adjustment Fund II |
| NeoLogic | Logic Semiconductors | August 2025 | Series A | $10M | Develops server CPU chips using its proprietary logic architecture to reduce power and transistor count. | Middle East | KOMPAS VC |
| Newsonic | Analog Semiconductors | August 2025 | Series B | ≈$40,100,000 | Designs and sells BAW, SAW and related RF filter chips and front-end modules. | Asia-Pacific | Hongtai Fund |
| GaNext | Power Semiconductors | August 2025 | Series B | Not Disclosed | Designs and commercializes high-voltage GaN-on-silicon power semiconductor devices. | Asia-Pacific | Not disclosed |
| Celera Semiconductor | Analog Semiconductors | August 2025 | Series A | $20M | Develops custom analog integrated circuits using an automated analog-chip design platform. | North America | Not disclosed |
| YXME | Memory Semiconductors | August 2025 | Seed | ≈$14,000,000 | Develops ReRAM memory devices and compute-in-memory chips. | Asia-Pacific | Linghang Xinjie; Yanyuan Venture Capital |
| Flagchip | Logic Semiconductors | August 2025 | Series C | Not Disclosed | Designs automotive-grade MCU and high-performance controller chips for vehicle control systems. | Asia-Pacific | Not disclosed |
| SiMa.ai | Logic Semiconductors | August 2025 | Unknown | $85M | Develops machine-learning system-on-chip processors for edge and physical-AI inference. | North America | Maverick Capital |
| FuriosaAI | Logic Semiconductors | July 2025 | Series C | $125M | Designs AI inference accelerator chips based on its proprietary Tensor Contraction Processor architecture. | Asia-Pacific | Not disclosed |
| YXME | Memory Semiconductors | July 2025 | Seed | ≈$23,900,000 | Develops ReRAM memory devices, embedded non-volatile memory and compute-in-memory semiconductor chips. | Asia-Pacific | 领航新界; 燕缘创投 |
| Netrasemi | Logic Semiconductors | July 2025 | Series A | ≈$22,500,000 | Designs fabless edge-AI SoCs integrating proprietary compute, vision and image-processing capabilities. | Asia-Pacific | Zoho Corporation; Unicorn India Ventures |
| Lumotive | Sensor Semiconductors | July 2025 | Series B | $14M | Develops programmable optical semiconductor chips that electronically steer light for lidar, sensing and optical applications. | North America | Not disclosed |
| Sunrise | Logic Semiconductors | July 2025 | Unknown | ≈$239,500,000 | Develops and commercializes high-performance GPUs and AI inference accelerator chips. | Asia-Pacific | Not disclosed |
| Yanshan Technology | Analog Semiconductors | July 2025 | Series A | ≈$23,900,000 | Develops and manufactures vertically stacked full-color GaN MicroLED semiconductor chips for microdisplay and direct-display applications. | Asia-Pacific | Not disclosed |
| Kunlunxin | Logic Semiconductors | July 2025 | Unknown | >$23,900,000 | Designs and sells AI accelerator chips for data-center and large-scale inference and training workloads. | Asia-Pacific | Not disclosed |
| Arago | Logic Semiconductors | July 2025 | Seed | $26M | Develops photonic AI processors designed to perform high-efficiency inference and compute workloads. | Europe | Earlybird Venture Capital; Protagonist; Visionaries Tomorrow |
| SiPearl | Logic Semiconductors | July 2025 | Series A | ≈$27,600,000 | Designs Arm-based high-performance processors for European supercomputing and AI systems. | Europe | Not disclosed |
| Gejian Semiconductor | Logic Semiconductors | July 2025 | Series A | ≈$23,900,000 | Designs high-performance real-time DSP semiconductor chips for industrial control, power electronics, automotive and robotics applications. | Asia-Pacific | 微禾投资 |
| SiCRED | Power Semiconductors | July 2025 | Growth Equity | ≈$23,900,000 | Designs and sells SiC MOSFET chips and other silicon-carbide power semiconductor devices. | Asia-Pacific | Not disclosed |
| Hurricane Chip | Analog Semiconductors | July 2025 | Series B | ≈$21,800,000 | Develops and manufactures GaN semiconductor laser-diode chips spanning ultraviolet, blue and green wavelengths. | Asia-Pacific | 深创投制造业转型升级新材料基金; 国风投新智基金 |
| Sunrise | Logic Semiconductors | June 2025 | Unknown | ≈$239,000,000 | Develops high-performance AI GPUs for computer-vision and large-model inference workloads. | Asia-Pacific | Not disclosed |
| Seekwave Tech | Logic Semiconductors | June 2025 | Series B | Not Disclosed | Designs highly integrated Wi-Fi and Bluetooth connectivity SoCs for consumer and IoT equipment. | Asia-Pacific | Fuhan Microelectronics |
| BASiC Semiconductor | Power Semiconductors | June 2025 | Series D+ | ≈$20,900,000 | Develops and manufactures SiC MOSFETs, diodes, power modules and related power-semiconductor devices. | Asia-Pacific | Not disclosed |
| Vertilite | Sensor Semiconductors | June 2025 | Growth Equity | Not Disclosed | Designs and manufactures VCSEL laser chips and high-speed optical semiconductor devices for sensing and optical communications. | Asia-Pacific | Guangdong HEC Technology Holding Co., Ltd. |
| Swave Photonics | Analog Semiconductors | June 2025 | Series A | $6.9M | Develops CMOS-based holographic semiconductor chipsets that directly modulate light for spatial displays. | Europe | IAG Capital Partners |
| ONiO | Logic Semiconductors | June 2025 | Series A | ≈$2,800,000 | Develops ultra-low-power general-purpose microcontrollers capable of operating from harvested ambient energy. | Europe | node.vc; Maki.vc |
| Oritek | Logic Semiconductors | June 2025 | Series B | ≈$23,900,000 | Designs automotive SoCs for zonal controllers, edge intelligent components and centralized driving/parking compute platforms. | Asia-Pacific | Sunny Industrial Fund |
| Haawking | Logic Semiconductors | June 2025 | Unknown | Not Disclosed | Designs RISC-V DSP and processor chips for industrial control, power electronics, machine vision and related embedded applications. | Asia-Pacific | Not disclosed |
| SPARC Foundry | Foundry Services | June 2025 | Unknown | ≈$29,800,000 | Is building an open-access pure-play III-V semiconductor foundry for photonic integrated circuits and discrete GaAs, InP and GaN devices. | Europe | Not disclosed |
| Volantis Semiconductor | Logic Semiconductors | June 2025 | Seed | $9M | Develops wafer-scale photonic semiconductor architectures integrating optical interconnects and compute for AI systems. | North America | Not disclosed |
| MLink Tech | Logic Semiconductors | June 2025 | Series D+ | Not Disclosed | Designs cellular-IoT and satellite-communications baseband/SoC chips including NB-IoT, Cat.1 bis, RedCap and NTN devices. | Asia-Pacific | Beijing Commercial Aerospace and Low-Altitude Economy Industry Investment Fund |
| Phoenix Semiconductor | Logic Semiconductors | June 2025 | Seed | $5.5M | Recreates discontinued and obsolete semiconductor chips as drop-in replacements for long-life critical systems. | North America | J2 Ventures; RTX Ventures |
| LECArc | Logic Semiconductors | June 2025 | Unknown | Not Disclosed | Designs Arm-based server CPU chips for cloud, edge and AI-inference computing. | Asia-Pacific | Yida Capital; Nanjing Innovation Investment |
| JL Semiconductor | Analog Semiconductors | June 2025 | Series D+ | Not Disclosed | Designs Ethernet PHY, switch and other high-speed wired-networking semiconductor chips, particularly for automotive networks. | Asia-Pacific | Not disclosed |
| Semi Zabala | Power Semiconductors | June 2025 | Unknown | ≈$2,500,000 | Develops and manufactures GaN HEMT power-semiconductor devices for high-reliability and aerospace power electronics. | Europe | Not disclosed |
| VisiNextek | Logic Semiconductors | June 2025 | Series A | ≈$23,900,000 | Designs edge-AI SoCs integrating image processing and AI acceleration for vision, automotive and robotics applications. | Asia-Pacific | Junxin Capital |
| Speedata | Logic Semiconductors | June 2025 | Series B | $44M | Develops Analytics Processing Unit chips purpose-built to accelerate large-scale data analytics workloads. | Middle East | Walden Catalyst Ventures; 83North; Koch Disruptive Technologies; Pitango First; Viola Ventures |
| YHGX Technology | Analog Semiconductors | May 2025 | Series B | >≈$13,800,000 | Designs high-reliability power-management ICs including regulators, motor drivers and radiation-hardened power chips. | Asia-Pacific | Chizhou Industrial Investment; Plum Ventures |
| SciSemi | Logic Semiconductors | May 2025 | Seed | ≈$3,350,000 | Develops CHERI-secured microcontroller chips with hardware memory-safety features. | Europe | Mercia Ventures |
| ICY Tech | Logic Semiconductors | May 2025 | Seed | Not Disclosed | Develops spintronic magnetic-computing chips for AI inference and specialized high-performance computing. | Asia-Pacific | Not disclosed |
| Lanxin Computing | Logic Semiconductors | May 2025 | Unknown | ≈$1,390,000 | Designs high-performance RISC-V server CPU chips for data-center, enterprise and AI-compute workloads. | Asia-Pacific | Not disclosed |
| Light Chip | Analog Semiconductors | May 2025 | Series A | Not Disclosed | Designs silicon-based CMOS microdisplay driver chips for MicroLED and other digital-light-field displays. | Asia-Pacific | Guangdong Hengqin Guangdong-Macao In-Depth Cooperation Zone Industrial Investment |
| Pixelcore AI | Sensor Semiconductors | May 2025 | Unknown | Not Disclosed | Develops intelligent image-sensor chips integrating pixel-level sensing, storage and edge computation. | Asia-Pacific | Beijing Infotech Ventures |
| Finwave Semiconductor | Analog Semiconductors | May 2025 | Unknown | $8.2M | Develops GaN-on-silicon RF semiconductor devices including switches and power-amplifier products for wireless networks. | North America | Fine Structure Ventures; Engine Ventures; Safar Partners |
| Starshine Semiconductor | Analog Semiconductors | May 2025 | Series B | >≈$13,800,000 | Develops and manufactures SAW, TF-SAW and BAW RF filter chips and RF front-end semiconductor modules. | Asia-Pacific | Not disclosed |
| HYBRD Chip | Logic Semiconductors | May 2025 | Unknown | Not Disclosed | Designs and sells high-performance FPGA and programmable heterogeneous computing chips. | Asia-Pacific | 初芯基金 |
| eyeo | Sensor Semiconductors | May 2025 | Seed | ≈$17,000,000 | Develops image-sensor technology using nanophotonic color splitting to increase CMOS sensor light sensitivity and resolution. | Europe | imec.xpand; Invest-NL |
| VSORA | Logic Semiconductors | April 2025 | Unknown | $46M | Develops high-performance AI inference accelerator chips for datacenter and edge workloads. | Europe | Otium; French family office (name not disclosed) |
| HFKON Semiconductor | Memory Semiconductors | April 2025 | Series B | Not Disclosed | Designs flash-memory controller ICs and embedded eMMC storage products. | Asia-Pacific | Not disclosed |
| YMTC Holding | Memory Semiconductors | April 2025 | Growth Equity | Not Disclosed | Controls semiconductor manufacturing businesses led by YMTC's 3D NAND memory operations. | Asia-Pacific | Not disclosed |
| R-Semi | Analog Semiconductors | April 2025 | Series A | Not Disclosed | Designs automotive SerDes and high-speed mixed-signal connectivity chipsets for in-vehicle data transmission. | Asia-Pacific | Not disclosed |
| Lansus | Analog Semiconductors | April 2025 | Growth Equity | ≈$21,800,000 | Designs and sells RF front-end semiconductors including power amplifiers, RF switches and integrated RF modules. | Asia-Pacific | Not disclosed |
| Element Labs | Logic Semiconductors | April 2025 | Series A | $50M | Develops AI inference processors aimed primarily at local and smaller datacenter deployments. | Middle East | Fidelity |
| Tauren Technology | Analog Semiconductors | April 2025 | Series D+ | Not Disclosed | Designs high-speed analog and mixed-signal ICs including ADC/DAC, SerDes, optical DSP and RF transceiver chips. | Asia-Pacific | Not disclosed |
| Neye | Logic Semiconductors | April 2025 | Series B | $58M | Develops chip-scale silicon-photonic optical circuit switches for AI and high-performance datacenter networks. | North America | CapitalG |
| Axera | Logic Semiconductors | April 2025 | Series C | >≈$236,000,000 | Designs AI perception and edge-computing SoCs for vision, intelligent vehicles and other edge devices. | Asia-Pacific | Not disclosed |
| Neuranics | Sensor Semiconductors | April 2025 | Seed | $8M | Develops ultra-low-power tunnelling-magnetoresistance semiconductor sensors for magnetic signal detection. | Europe | Blackfinch Ventures |
| Ratel Semiconductor | Power Semiconductors | April 2025 | Unknown | ≈$220,000 | Designs fabless power-management ICs for displays, on-device AI computers and automotive electronics. | Asia-Pacific | Not disclosed |
| Blumind | Analog Semiconductors | April 2025 | Series A | ≈$24,026,000 | Develops ultra-low-power all-analog AI inference chips for always-on edge computing. | North America | Cycle Capital; BDC Capital |
| CalligoTech | Logic Semiconductors | April 2025 | Unknown | $1.1M | Designs RISC-V SoCs with Posit arithmetic acceleration for HPC and AI workloads. | Asia-Pacific | Seafund; Artha Venture Fund |
| FaradaIC | Sensor Semiconductors | April 2025 | Seed | ≈$2,910,000 | Develops wafer-manufactured chip-scale electrochemical gas sensors using solid-state ion conductors. | Europe | JOIN Capital |
| Icemos | Power Semiconductors | April 2025 | Series D+ | $22M | Develops and manufactures silicon power MOSFETs using MEMS-enabled super-junction structures. | North America | Not disclosed |
| CSCX Semiconductor | Logic Semiconductors | March 2025 | Series A | ≈$27,400,000 | Develops UWB SoCs combining precise ranging, positioning, communications and radar functions. | Asia-Pacific | Xingxiang Capital |
| Biren Technology | Logic Semiconductors | March 2025 | Series D+ | Not Disclosed | Develops high-performance general-purpose GPU and AI accelerator semiconductor chips. | Asia-Pacific | 上海国投先导人工智能产业母基金 |
| Celestial AI | Analog Semiconductors | March 2025 | Series C | $250M | Develops silicon-photonic optical-interconnect chiplets and its Photonic Fabric platform for AI compute and memory connectivity. | North America | Fidelity Management & Research Company |
| Sencure | Sensor Semiconductors | March 2025 | Series B | ≈$2,200,000 | Develops low-power biosensing front-end ICs for EEG, ECG and EMG medical wearables and devices. | Europe | Not disclosed |
| Pebble Square | Logic Semiconductors | March 2025 | Seed | ≈$2,380,000 | Develops analog processing-in-memory and neuromorphic AI semiconductor chips for edge inference. | Asia-Pacific | Not disclosed |
| VMEMS | Sensor Semiconductors | March 2025 | Seed | Not Disclosed | Develops CMOS-MEMS monolithically integrated infrared-array and other MEMS sensor chips. | Asia-Pacific | Xiamen High-tech Investment |
| Huachen Optoelectronics | Analog Semiconductors | March 2025 | Series A | ≈$27,400,000 | Designs and manufactures EEL and VCSEL semiconductor laser chips for optical communications, high-power lasers and 3D sensing. | Asia-Pacific | Not disclosed |
| Mingxin Qirui | Memory Semiconductors | March 2025 | Seed | ≈$23,700,000 | Develops RRAM memory and compute-in-memory chips, embedded RRAM technology and AI-oriented memory products. | Asia-Pacific | Jinqiu Fund |
| Atmosic | Logic Semiconductors | March 2025 | Series D+ | $40M | Develops ultra-low-power wireless connectivity and compute SoCs for IoT and edge devices. | North America | Sutter Hill Ventures |
| Giant Semiconductor | Analog Semiconductors | February 2025 | Series B | ≈$24,000,000 | Designs UWB and other short-range wireless communication and sensing SoCs. | Asia-Pacific | Not disclosed |
| Eagles Microelectronics | Sensor Semiconductors | February 2025 | Series B | >$21,000,000 | Develops and manufactures VCSEL optical-semiconductor chips for data communications, LiDAR and 3D sensing. | Asia-Pacific | Not disclosed |
| EMTAR Technology | Analog Semiconductors | February 2025 | Seed | ≈$22,900,000 | Designs wireless SoCs combining high-speed interfaces, wireless connectivity and edge computing. | North America | Not disclosed |
| Hyseim | Logic Semiconductors | February 2025 | Series A | ≈$24,000,000 | Designs RISC-V processor and SoC chips for automotive, industrial and edge-computing applications. | Asia-Pacific | Not disclosed |
| PNJ Semiconductor | Power Semiconductors | February 2025 | Series A | ≈$28,000,000 | Designs SiC MOSFETs, SiC Schottky diodes and GaN HEMT power semiconductor devices. | Asia-Pacific | Not disclosed |
| Lumotive | Sensor Semiconductors | February 2025 | Series B | $45M | Develops programmable optical-semiconductor beam-steering chips for 3D sensing and optical communications. | North America | Gates Frontier; MetaVC Partners |
| Cambridge GaN Devices | Power Semiconductors | February 2025 | Series C | $32M | Develops GaN-on-silicon power transistors and integrated power ICs. | Europe | Not disclosed |
| Danxi Technology | Power Semiconductors | February 2025 | Unknown | >$2,300,000 | Designs and sells GaN power transistors, gate-driver ICs and integrated GaN power devices. | Asia-Pacific | Unknown |
| XDXCT | Logic Semiconductors | February 2025 | Unknown | >$27,000,000 | Designs general-purpose GPU semiconductor chips for graphics and AI computing. | Asia-Pacific | Not disclosed |
| EnCharge AI | Analog Semiconductors | February 2025 | Series B | >$200,000,000 | Designs analog in-memory computing chips for energy-efficient AI inference and acceleration. | North America | Tiger Global |
| MIS Technology | Sensor Semiconductors | February 2025 | Series A | >$2,300,000 | Designs MEMS pressure and flow sensor chips for automotive, consumer, industrial and medical applications. | Asia-Pacific | Not disclosed |
| OSO Semiconductor | Analog Semiconductors | February 2025 | Seed | $5.2M | Designs RF beamforming chipsets for phased-array satellite, 5G and radar systems. | North America | Engine Ventures |
| TinyChip | Analog Semiconductors | February 2025 | Unknown | >$2,200,000 | Designs automotive analog and mixed-signal SoCs integrating control, sensing, actuation and power-management functions. | Asia-Pacific | Not disclosed |
| Salience Labs | Logic Semiconductors | February 2025 | Series A | $30M | Develops silicon-photonics optical-switch chips for high-bandwidth AI data-center interconnects. | Europe | ICM HPQC Fund; Applied Ventures |
| Pakal Technologies | Power Semiconductors | January 2025 | Series B | $25M | Develops high-voltage silicon power semiconductor switches for electrification and power-conversion systems. | North America | New Science Ventures |
| PseudolithIC | Analog Semiconductors | January 2025 | Seed | $6M | Develops RF semiconductor chipsets integrating compound-semiconductor chiplets with silicon manufacturing. | North America | Entrada Ventures |
| Zhixin Semiconductor | Logic Semiconductors | January 2025 | Unknown | Not Disclosed | Designs automotive semiconductor chips including MCUs, mixed-signal ICs and motor-control devices. | Asia-Pacific | 合肥产投资本 |
| InventChip | Power Semiconductors | January 2025 | Series C | Not Disclosed | Develops and manufactures SiC power semiconductor devices and associated power ICs using an IDM model. | Asia-Pacific | 国开制造业转型升级基金 |
| EVAS Intelligence | Logic Semiconductors | January 2025 | Series A | Not Disclosed | Designs RISC-V based compute and automotive edge-processing chips. | Asia-Pacific | National SME Development Fund (managed by Oriental Fortune Capital) |
| MT Silicon | Sensor Semiconductors | January 2025 | Series A | Not Disclosed | Designs high-performance CMOS image sensor chips for automotive, robotics and machine-vision applications. | Asia-Pacific | 开源证券; 西投控股 |
| PowerDiamond Systems | Power Semiconductors | January 2025 | Series A | ≈$640,000 | Develops diamond semiconductor devices for high-power and high-frequency electronics. | Asia-Pacific | Not disclosed |
| VisiNextek | Logic Semiconductors | January 2025 | Unknown | Not Disclosed | Designs edge-AI SoCs for intelligent vision, automotive, robotics and other embedded applications. | Asia-Pacific | Not disclosed |
| Vertical Compute | Memory Semiconductors | January 2025 | Seed | ≈$20,500,000 | Develops vertically integrated memory-compute semiconductor technology intended to reduce the memory bottleneck in AI computing. | Europe | imec.xpand |
| UNIM Innovation | Memory Semiconductors | January 2025 | Series A | Not Disclosed | Designs and supplies NAND flash memory chips, including SLC NAND devices for embedded and industrial applications. | Asia-Pacific | Not disclosed |
| Meritech | Analog Semiconductors | January 2025 | Series B | Not Disclosed | Designs automotive-grade high-speed analog and mixed-signal interface chips including SerDes devices. | Asia-Pacific | Not disclosed |
| YW MEMS | Sensor Semiconductors | January 2025 | Series A | Not Disclosed | Develops and manufactures MEMS semiconductor chips and related microdevices including flow sensors and micropumps. | Asia-Pacific | Not disclosed |
| Grecon Semiconductor | Power Semiconductors | January 2025 | Series B | Not Disclosed | Develops IGBT and SiC power semiconductor devices, wafers and power-device products. | Asia-Pacific | 国科长三角资本 |
| ETERN Laser | Logic Semiconductors | December 2024 | Unknown | ≈$2,200,000 | Develops semiconductor laser chips including VCSEL and DFB devices for optical communications and sensing. | Asia-Pacific | Not disclosed |
| Moore Threads | Logic Semiconductors | December 2024 | Growth Equity | ≈$216,000,000 | Designs fabless full-function GPU semiconductor processors for graphics and general-purpose accelerated computing. | Asia-Pacific | Not disclosed |
| HyperAccel | Logic Semiconductors | December 2024 | Series A | ≈$20,000,000 | Designs LLM Processing Unit semiconductor accelerators optimized for generative-AI inference and computation. | Asia-Pacific | Korea Investment Partners |
| SpacemiT | Logic Semiconductors | December 2024 | Series A | Not Disclosed | Designs high-performance RISC-V CPU and AI-computing semiconductor chips. | Asia-Pacific | Brizan III Fund |
| Mindgrove Technologies | Logic Semiconductors | December 2024 | Series A | $8M | Designs fabless RISC-V SoCs and microcontrollers for embedded, industrial, edge and vision applications. | Asia-Pacific | Rocketship.vc; Speciale Invest |
| OptiCore | Logic Semiconductors | December 2024 | Seed | $5M | Develops photonic optical-processing semiconductor chips intended to perform AI computation with optical rather than conventional electronic processing. | North America | Not disclosed |
| Beijixiongxin | Logic Semiconductors | December 2024 | Unknown | Not Disclosed | Develops high-performance computing semiconductor chips and chiplet-based processors. | Asia-Pacific | Not disclosed |
| EPIC | Logic Semiconductors | December 2024 | Unknown | Not Disclosed | Develops silicon-photonics semiconductor chips for high-speed optical communications and data-center interconnects. | Asia-Pacific | Hongrida Technology Co., Ltd. |
| Ayar Labs | Logic Semiconductors | December 2024 | Series D+ | $155M | Develops in-package silicon-photonics optical-I/O chiplets for high-bandwidth semiconductor interconnects. | North America | Advent Global Opportunities; Light Street Capital |
| Merchip Micro | Power Semiconductors | December 2024 | Series A | Not Disclosed | Develops digital power-management and power-control ICs including DSP power, motor-control and voltage-regulation chips. | Asia-Pacific | Not disclosed |
| Netrasemi | Logic Semiconductors | December 2024 | Unknown | ≈$2,180,000 | Develops edge-AI semiconductor SoCs for vision, signal-processing and intelligent embedded applications. | Asia-Pacific | Not disclosed |
| Axiado | Logic Semiconductors | December 2024 | Series C | $60M | Develops secure control and compute SoCs for platform management and hardware-rooted security in AI infrastructure. | North America | Maverick Silicon |
| Azimuth AI | Logic Semiconductors | December 2024 | Unknown | $11.5M | Designs purpose-built semiconductor SoCs for edge-computing and embedded applications. | North America | Unknown |
| PossumIC | Sensor Semiconductors | December 2024 | Series A | ≈$23,800,000 | Develops fabless millimeter-wave intelligent-sensing SoCs for automotive, industrial and consumer sensing applications. | Asia-Pacific | Not disclosed |
| Tenstorrent | Logic Semiconductors | December 2024 | Series D+ | >$293,000,000 | Designs high-performance AI accelerator processors and RISC-V-based compute chips. | North America | Samsung Securities; AFW Partners |
| Akhetonics | Logic Semiconductors | November 2024 | Seed | ≈$2,330,000 | Develops all-optical general-purpose processor chips using photonic integrated circuits for digital computing. | Europe | Matterwave Ventures |
| PowerDiamond Systems | Power Semiconductors | November 2024 | Unknown | ≈$2,600,000 | Develops diamond semiconductor power devices intended for extremely high-power and high-temperature applications. | Asia-Pacific | Not disclosed |
| UNISOC | Logic Semiconductors | November 2024 | Growth Equity | Not Disclosed | Designs mobile, communications, IoT and embedded system-on-chips and baseband semiconductor platforms. | Asia-Pacific | Not disclosed |
| Gejian Semiconductor | Logic Semiconductors | November 2024 | Series A | ≈$23,800,000 | Designs high-performance programmable DSP semiconductor chips for communications and signal-processing applications. | Asia-Pacific | Weiho Investment |
| Giant Semiconductor | Sensor Semiconductors | November 2024 | Unknown | Not Disclosed | Designs UWB semiconductor chips for precision ranging, positioning and short-range wireless connectivity. | Asia-Pacific | Yida Capital |
| MatX | Logic Semiconductors | November 2024 | Series A | ≈$20,000,000 | Designs purpose-built semiconductor accelerators for large-scale AI training and inference. | North America | Spark Capital |
| Ubitium | Logic Semiconductors | November 2024 | Seed | $3.7M | Develops a general-purpose RISC-V processor intended to consolidate multiple computing functions onto a single semiconductor architecture. | Europe | Runa Capital; Inflection; KBC Focus Fund |
| Xinlian Power | Power Semiconductors | November 2024 | Unknown | ≈$24,600,000 | Develops and manufactures automotive-grade silicon-carbide power semiconductor devices and related SiC manufacturing technology. | Asia-Pacific | Not disclosed |
| Oritek | Logic Semiconductors | November 2024 | Series B | Not Disclosed | Designs automotive system-on-chips for next-generation centralized vehicle electrical/electronic architectures. | Asia-Pacific | 国投招商 |
| Enfabrica | Logic Semiconductors | November 2024 | Series C | $115M | Designs high-bandwidth networking and memory-fabric silicon for connecting GPUs, accelerators and AI compute clusters. | North America | Spark Capital |
| GEMESYS | Logic Semiconductors | November 2024 | Seed | ≈$2,100,000 | Develops memristor-based analog AI accelerator chips for highly energy-efficient neural-network inference. | Europe | Amadeus APEX Technology Fund; Atlantic Labs |
| BOE Integrated | Foundry Services | November 2024 | Unknown | ≈$2,764,000,000 | Manufactures semiconductor wafers across 6-, 8- and planned 12-inch production lines for display, mixed-signal, MCU, automotive and communications chips. | Asia-Pacific | Not disclosed |
| MintNeuro | Sensor Semiconductors | November 2024 | Seed | ≈$2,290,000 | Develops application-specific semiconductor chips for neural recording, stimulation and implantable brain interfaces. | Europe | Empirical Ventures |
| C2i Semiconductors | Power Semiconductors | November 2024 | Seed | $4M | Designs analog and mixed-signal semiconductor products including power-management ICs for automotive and industrial applications. | Asia-Pacific | Yali Capital |
| Forefront RF | Analog Semiconductors | November 2024 | Series A | ≈$20,700,000 | Designs adaptive RF semiconductor technology that replaces multiple switched RF components in mobile and connected devices. | Europe | Cambridge Innovation Capital; Octopus Ventures |
| Xavveo | Sensor Semiconductors | November 2024 | Seed | $8.6M | Develops silicon-photonics-based distributed radar sensor chips and sensor networks for high-resolution ranging. | Europe | Vsquared Ventures; imec.xpand |
| Geener | Power Semiconductors | October 2024 | Series B | ≈$20,200,000 | Develops and manufactures silicon and SiC MOSFET, IGBT and FRD power-semiconductor chips and modules. | Asia-Pacific | Not disclosed |
| Zhixin Semiconductor | Logic Semiconductors | October 2024 | Series B | Not Disclosed | Designs and sells automotive processors, MCUs and mixed-signal automotive integrated circuits. | Asia-Pacific | Hefei Industrial Investment |
| Lightmatter | Logic Semiconductors | October 2024 | Series D+ | $400M | Develops silicon-photonic interconnect semiconductor engines for linking processors in large AI computing systems. | North America | T. Rowe Price Associates, Inc. |
| Yuntong Technology | Power Semiconductors | October 2024 | Series B | Not Disclosed | Develops automotive-grade IGBT, MOSFET and other power-semiconductor chips and modules for electric-vehicle power electronics. | Asia-Pacific | Not disclosed |
| Xscape Photonics | Logic Semiconductors | October 2024 | Series A | $44M | Develops programmable multi-wavelength silicon-photonic semiconductor platforms for high-bandwidth AI data-center interconnects. | North America | IAG Capital Partners |
| Immorta | Analog Semiconductors | October 2024 | Series A | Not Disclosed | Designs automotive-grade mixed-signal ICs including system-basis, power, driver and compute-control chips. | Asia-Pacific | Xinwei Capital |
| iStarChip | Logic Semiconductors | October 2024 | Seed | Not Disclosed | Designs CPU-DSP-NPU integrated control processors and related chips for embedded AI and intelligent endpoint control. | Asia-Pacific | Not disclosed |
| CVSens | Sensor Semiconductors | October 2024 | Series A | Not Disclosed | Designs high-value CMOS image-sensor chips for automotive, security, machine-vision, IoT and medical imaging. | Asia-Pacific | Hanlian Semiconductor Industry Fund |
| Meridian Innovation | Sensor Semiconductors | October 2024 | Series C | $12.5M | Develops mass-producible CMOS thermal-imaging sensor chips for consumer, automotive, industrial and monitoring applications. | Asia-Pacific | Not disclosed |
| TinyChip | Analog Semiconductors | October 2024 | Growth Equity | Not Disclosed | Designs high-performance automotive mixed-signal SoCs and specialized MCUs integrating sensing, signal-chain, power and control functions. | Asia-Pacific | Not disclosed |
| Fermionic Design | Analog Semiconductors | September 2024 | Unknown | $6M | Designs mixed-signal MCUs, RF beamformers, GaN RF front ends and power-management ICs. | Asia-Pacific | Not disclosed |
| Innobase | Logic Semiconductors | September 2024 | Series A | ≈$42,300,000 | Designs cellular baseband SoCs integrating baseband, RF, power-management and application-processing functions for connected devices. | Asia-Pacific | Chengdu Ceyuan Capital |
| AscenPower | Power Semiconductors | September 2024 | Series A | ≈$141,000,000 | Manufactures automotive- and industrial-grade SiC SBD/JBS diodes and SiC MOSFETs. | Asia-Pacific | Guangdong Integrated Circuit Fund II; SDIC Venture Capital |
| Hefei Wanxin Integrated Circuit | Foundry Services | September 2024 | Growth Equity | ≈$1,345,000,000 | Builds and operates a 12-inch semiconductor wafer manufacturing line as a foundry subsidiary of Nexchip. | Asia-Pacific | Not disclosed |
| Xinpletek | Analog Semiconductors | September 2024 | Series A | ≈$14,000,000 | Develops RF front-end power-amplifier chips and modules for cellular devices and IoT equipment. | Asia-Pacific | Not disclosed |
| JT Microelectronics | Power Semiconductors | September 2024 | Unknown | ≈$8,450,000 | Develops and sells GaN power switches, GaN Schottky diodes and associated driver ICs. | Asia-Pacific | Not disclosed |
| Hefei Fangjing Technology | Power Semiconductors | September 2024 | Growth Equity | ≈$40,800,000 | Develops and commercializes power semiconductor devices. | Asia-Pacific | Not disclosed |
| MEMSonics | Analog Semiconductors | September 2024 | Growth Equity | >≈$28,000,000 | Designs and manufactures RF acoustic filters plus piezoelectric microphone and ultrasonic sensor chips. | Asia-Pacific | Not disclosed |
| PNJ Semiconductor | Power Semiconductors | September 2024 | Series A | >≈$28,000,000 | Designs and sells SiC MOSFETs, SiC diodes and GaN power transistors. | Asia-Pacific | Not disclosed |
| ZHCL Tech | Logic Semiconductors | September 2024 | Series B | ≈$84,000,000 | Develops high-performance AI accelerator chips and associated large-scale compute systems. | Asia-Pacific | Xingluo Zhonghao |
| Longsailing Semiconductor | Logic Semiconductors | September 2024 | Series A | ≈$14,000,000–$28,000,000 | Fabless developer of Wi-Fi and other short-range wireless communications chips. | Asia-Pacific | Not disclosed |
| Zhihe Computing | Logic Semiconductors | September 2024 | Series A | >≈$28,000,000 | Develops high-performance RISC-V processors for AI-compute workloads. | Asia-Pacific | Source Code Capital |
| CXMT | Memory Semiconductors | September 2024 | Growth Equity | ≈$1,158,000,000 | Develops and manufactures 12-inch DRAM memory wafers. | Asia-Pacific | Not disclosed |
| BigEndian Semiconductors | Logic Semiconductors | September 2024 | Seed | $3M | Fabless developer of system-on-chip semiconductors, initially targeting surveillance-camera applications. | Asia-Pacific | Vertex Ventures SEA & India |
| Senscomm Semiconductor | Logic Semiconductors | August 2024 | Unknown | Not Disclosed | Designs and sells Wi-Fi 6/6E/7 wireless-connectivity and AIoT SoCs. | Asia-Pacific | Not disclosed |
| Osemi Technology | Logic Semiconductors | August 2024 | Seed | Not Disclosed | Designs UWB and automotive millimeter-wave radar SoCs for positioning, connectivity and sensing applications. | Asia-Pacific | 金鼎康希产业基金 |
| Fabric Cryptography | Logic Semiconductors | August 2024 | Series A | $33M | Designs custom Verifiable Processing Unit chips that accelerate advanced cryptographic workloads. | North America | Blockchain Capital; 1kx |
| Lisuan Technology | Logic Semiconductors | August 2024 | Unknown | ≈$26,000,000 | Designs and sells proprietary graphics-rendering GPU chips. | Asia-Pacific | Not disclosed |
| CNSilicon | Analog Semiconductors | August 2024 | Seed | Not Disclosed | Designs and sells high-performance mixed-signal LED matrix driver ICs for display backlights and automotive lighting. | Asia-Pacific | 金鼎力芯微产业基金 |
| CX Semi | Power Semiconductors | August 2024 | Series C | Not Disclosed | Designs and sells power-management and battery-management ICs, including fast-charging and charge-pump devices. | Asia-Pacific | Not disclosed |
| BEAM Technologies | Sensor Semiconductors | August 2024 | Seed | ≈$211,000 | Develops Far-UVC AlGaN LED semiconductor devices. | Asia-Pacific | Tokyo University of Science Innovation Capital Co., Ltd. |
| Hexin Hulian | Analog Semiconductors | August 2024 | Series C | >$21,800,000 | Designs and sells mixed-signal signal-chain and high-speed interconnect ICs including ADC/DAC, voltage-reference, clock and SerDes-related chips. | Asia-Pacific | CICC Capital |
| Feidu Micro | Analog Semiconductors | August 2024 | Seed | Not Disclosed | Designs and sells mixed-signal sensor-conditioning ASICs and signal-chain ICs including ADCs, DACs and AFEs. | Asia-Pacific | Cowin Capital |
| Fractile | Logic Semiconductors | July 2024 | Seed | $15M | Develops compute-in-memory semiconductor processors optimized for high-performance AI inference. | Europe | Kindred Capital; NATO Innovation Fund; Oxford Science Enterprises |
| Rebellions | Logic Semiconductors | July 2024 | Series B | $15M | Designs fabless AI inference accelerator chips for data-center and specialized computing workloads. | Asia-Pacific | Not disclosed |
| DreamBig Semiconductor | Logic Semiconductors | July 2024 | Series B | $75M | Develops semiconductor chiplets and chiplet-hub devices for AI acceleration, networking, memory connectivity and data-center systems. | North America | Samsung Catalyst Fund; Sutardja Family |
| Gwanak Analog | Analog Semiconductors | July 2024 | Series B | $15.9M | Develops and supplies analog, power-management, sensor-conditioning and mixed-signal semiconductor ICs and SoCs. | Asia-Pacific | Not disclosed |
| IVP Semiconductor | Power Semiconductors | July 2024 | Unknown | $5M | Designs fabless power semiconductor chips and related intelligent power devices for automotive, industrial, renewable-energy and consumer applications. | Asia-Pacific | Not disclosed |
| Millibeam | Analog Semiconductors | July 2024 | Series A | $2M | Develops fabless millimeter-wave radio chipsets for 5G and 6G communications networks. | Asia-Pacific | Not disclosed |
| Vaire Computing | Logic Semiconductors | July 2024 | Seed | $4M | Develops silicon processors based on reversible computing architectures designed to dramatically reduce computation energy loss and heat. | Europe | 7percent Ventures; Jude Gomila |
| Axelera AI | Logic Semiconductors | June 2024 | Series B | $68M | Designs fabless AI-processing-unit chips for energy-efficient edge and inference workloads. | Europe | Not disclosed |
| Innatera | Logic Semiconductors | June 2024 | Series A | $5M | Designs ultra-low-power neuromorphic processor chips for sensor-edge AI applications. | Europe | Innavest; Invest-NL |
| Starshine Semiconductor | Analog Semiconductors | June 2024 | Series B | $137.5M | Develops and sells SAW, TC-SAW and BAW RF filter chips and RF front-end modules. | Asia-Pacific | China Mobile Industry Chain Development Fund |
| Etched | Logic Semiconductors | June 2024 | Series A | $120M | Designs Sohu, a purpose-built ASIC accelerator optimized specifically for transformer-model inference. | North America | Primary Venture Partners; Positive Sum |
| HPMicro | Logic Semiconductors | June 2024 | Series B | Not Disclosed | Designs high-performance RISC-V microcontrollers, microprocessors and related embedded semiconductor devices. | Asia-Pacific | Paradise Silicon Valley Capital |
| EagleChip | Logic Semiconductors | June 2024 | Unknown | Not Disclosed | Designs high-end FPGA logic chips for communications, data-center, automotive and computing applications. | Asia-Pacific | Not disclosed |
| TOF 3D | Sensor Semiconductors | June 2024 | Series C | Not Disclosed | Designs and sells i-ToF and d-ToF depth-sensing chips and miniature ToF sensor devices. | Asia-Pacific | Jinghuijuxin Fund, managed by Gaoxin Capital |
| Black Semiconductor | Analog Semiconductors | June 2024 | Series A | $27.6M | Develops graphene-based electro-optical semiconductor technology for high-bandwidth chip-to-chip interconnects. | Europe | Porsche Ventures; Project A Ventures |
| Vector Photonics | Analog Semiconductors | June 2024 | Seed | $2.1M | Develops fabless photonic-crystal surface-emitting semiconductor laser devices for datacom and other optical applications. | Europe | Not disclosed |
| Aris Micro | Analog Semiconductors | June 2024 | Series A | Not Disclosed | Designs USB-PD power-management, USB4 retimer and other high-speed mixed-signal interface chips. | Asia-Pacific | Weihao Chuangxin |
| Ixana | Analog Semiconductors | June 2024 | Series A | $10M | Develops ultra-low-power mixed-signal Wi-R communication chips for wearable and body-area networks. | North America | 10x Founders |
| UNISOC | Logic Semiconductors | June 2024 | Growth Equity | $552M | Designs and sells mobile, communications, IoT and automotive SoCs and connectivity chipsets. | Asia-Pacific | Not disclosed |
| EyeQ Lab | Power Semiconductors | May 2024 | Series B | $18M | Designs and manufactures silicon-carbide power semiconductor devices for high-voltage power applications. | Asia-Pacific | Not disclosed |
| MetisX | Memory Semiconductors | May 2024 | Series A | $44M | Develops CXL-based intelligent-memory semiconductor devices for memory-centric data processing. | Asia-Pacific | Not disclosed |
| DEEPX | Logic Semiconductors | May 2024 | Series C | $80.5M | Develops low-power neural-processing-unit semiconductors for on-device AI inference. | Asia-Pacific | SkyLake Equity Partners |
| Niobium Microsystems | Logic Semiconductors | May 2024 | Seed | $5.5M | Develops custom silicon accelerators for fully homomorphic encryption and secure computing. | North America | Fusion Fund |
| Blaize | Logic Semiconductors | April 2024 | Series D+ | $106M | Develops proprietary graph-streaming AI processors and associated software for edge and data-center inference. | North America | Not disclosed |
| Rivos | Logic Semiconductors | April 2024 | Series A | >$250,000,000 | Develops RISC-V server-class CPUs and data-parallel accelerator silicon for AI and data-analytics workloads. | North America | Matrix Capital Management |
| Falcomm | Analog Semiconductors | April 2024 | Seed | $4M | Develops fabless silicon RF power-amplifier semiconductors for wireless communications. | North America | Squadra Ventures |
| SiMa.ai | Logic Semiconductors | April 2024 | Series B | $70M | Develops machine-learning systems-on-chip for power-efficient AI inference at the embedded edge. | North America | Maverick Capital |
| Hailo | Logic Semiconductors | April 2024 | Series C | $120M | Designs and sells dedicated edge-AI processors and vision accelerators for running neural-network workloads locally on devices. | Middle East | Zisapel family; Gil Agmon; Delek Motors; Alfred Akirov; DCLBA; Vasuki; OurCrowd; Talcar; Comasco; Automotive Equipment (AEV); Poalim Equity |
| CXMT | Memory Semiconductors | March 2024 | Growth Equity | ≈$1,496,000,000 | Develops and manufactures DRAM memory semiconductors through its ChangXin Memory Technologies operating business. | Asia-Pacific | Not disclosed |
| Celestial AI | Analog Semiconductors | March 2024 | Series C | $175M | Develops silicon-photonic and mixed-signal semiconductor technology for optical compute-to-compute and compute-to-memory interconnects. | North America | U.S. Innovative Technology Fund |
| e-peas | Power Semiconductors | March 2024 | Unknown | ≈$19,000,000 | Designs ultra-low-power energy-harvesting power-management ICs, microcontrollers and imaging chips. | Europe | Otium Capital |
| Innatera | Logic Semiconductors | March 2024 | Series A | ≈$16,300,000 | Develops ultra-low-power analog-mixed-signal neuromorphic processor chips for sensor-edge inference. | Europe | Not disclosed |
| NeuReality | Logic Semiconductors | March 2024 | Unknown | $20M | Develops the NR1 Network Addressable Processing Unit SoC and associated hardware for AI-inference data paths. | Middle East | Not disclosed |
| MUCSE | Logic Semiconductors | March 2024 | Series A | >$27,800,000 | Designs reconfigurable security chips and intelligent network-controller semiconductor chips. | Asia-Pacific | Ant Group |
| Quintessent | Analog Semiconductors | March 2024 | Seed | $11.5M | Develops heterogeneous silicon-photonic integrated devices and quantum-dot laser technology for high-speed optical interconnects. | North America | Osage University Partners |
| Efficient Computer | Logic Semiconductors | March 2024 | Seed | $16M | Develops highly energy-efficient programmable general-purpose processor chips based on its Fabric dataflow architecture. | North America | Eclipse |
| TopoLogic | Memory Semiconductors | February 2024 | Series A | $4.7M | Develops topological-material semiconductor devices, led by its TL-RAM nonvolatile memory technology. | Asia-Pacific | Not disclosed |
| Wise-integration | Power Semiconductors | February 2024 | Series B | $16.2M | Develops GaN power ICs and digital-control technology for high-density power conversion. | Europe | imec.xpand |
| Zenosic | Logic Semiconductors | February 2024 | Series A | Not Disclosed | Designs high-performance programmable Ethernet/network switching chips for data centers and communications equipment. | Asia-Pacific | Not disclosed |
| Core Vision Microelectronics | Sensor Semiconductors | February 2024 | Series C | Not Disclosed | Develops SPAD-based 1D and 3D direct time-of-flight optical sensor chips. | Asia-Pacific | Chengxin Venture Capital |
| XDLTEK | Logic Semiconductors | February 2024 | Series A | Not Disclosed | Develops reconfigurable parallel-processing and general-purpose GPU-class compute chips. | Asia-Pacific | Not disclosed |
| sensiBel | Sensor Semiconductors | February 2024 | Unknown | $7.6M | Develops and sells optical-readout MEMS microphone sensor devices. | Europe | Sennheiser |
| Uhnder | Sensor Semiconductors | February 2024 | Series D+ | $50M | Designs software-defined digital imaging radar-on-chip devices for automotive, industrial and defense sensing. | North America | ACME Capital |
| Recogni | Logic Semiconductors | February 2024 | Series C | $102M | Develops dedicated AI inference accelerator processors for generative AI and intelligent autonomous systems. | North America | Celesta Capital; GreatPoint Ventures |
| Meipusen | Power Semiconductors | February 2024 | Series A | Not Disclosed | Designs and sells silicon and SiC MOSFETs, IGBTs, diodes and other discrete power devices. | Asia-Pacific | Not disclosed |
| Point2 Technology | Analog Semiconductors | February 2024 | Series B | $22.6M | Designs ultra-low-power mixed-signal SerDes SoCs for high-speed data-center and automotive interconnects. | North America | Bosch Ventures; Molex |
| Chengling Microelectronics | Power Semiconductors | February 2024 | Seed | Not Disclosed | Develops high-performance power-management ICs including DC-DC, isolated-power and wireless-charging chips. | Asia-Pacific | Cowin Capital |
| Guibu Microelectronics | Sensor Semiconductors | February 2024 | Growth Equity | Not Disclosed | Designs 77GHz/4D millimeter-wave radar chips and integrated radar SoCs for automotive sensing. | Asia-Pacific | Bosch Ventures; Jinxin Capital |
| Acela Micro | Analog Semiconductors | February 2024 | Series C | Not Disclosed | Develops high-speed ADCs, DACs, clock-conditioning and RF signal-chain ICs. | Asia-Pacific | Beijing China Mobile Digital New Economy Industry Fund |
| YT Micro | Logic Semiconductors | February 2024 | Series B | Not Disclosed | Designs and sells automotive-grade 32-bit MCUs and high-performance control processors for vehicle electronics. | Asia-Pacific | China Structural Reform Fund |
| Rebellions | Logic Semiconductors | January 2024 | Series B | $124M | Designs fabless AI inference accelerator processors for data-center and high-performance computing workloads. | Asia-Pacific | KT Corporation |
| SEMRON | Logic Semiconductors | January 2024 | Seed | ≈$7,900,000 | Develops analog in-memory AI semiconductor chips using its memcapacitor-based CapRAM architecture. | Europe | JOIN Capital |
| VoxelSensors | Sensor Semiconductors | January 2024 | Seed | ≈$3,250,000 | Develops single-photon active-event semiconductor sensors for low-power 3D perception. | Europe | SFPIM Relaunch |
| SCALINX | Analog Semiconductors | January 2024 | Unknown | ≈$18,500,000 | Designs fabless mixed-signal SoCs centered on ultra-high-speed ADC and DAC technology. | Europe | Not disclosed |
| Osemi Technology | Analog Semiconductors | January 2024 | Seed | ≈$13,900,000 | Designs automotive millimeter-wave radar and UWB wireless SoCs. | Asia-Pacific | Lihe Capital |
| YunSilicon | Logic Semiconductors | January 2024 | Seed | >≈$13,900,000 | Designs network-interconnect ASICs for cloud data centers and large-scale computing infrastructure. | Asia-Pacific | Not disclosed |
| EpicMEMS | Analog Semiconductors | January 2024 | Series B | >$27,800,000 | Designs RF front-end semiconductor devices including acoustic filters and integrated RF front-end chips. | Asia-Pacific | Xienuo Investment |
| SiChain Semiconductor | Power Semiconductors | January 2024 | Series B | >$27,800,000 | Develops and commercializes SiC MOSFETs, diodes, bare dies and related power-semiconductor devices. | Asia-Pacific | Meituan DragonBall |
| Velinktech | Analog Semiconductors | January 2024 | Series B | >$13,900,000 | Designs fabless high-speed automotive A-PHY SerDes and in-vehicle networking communication chips. | Asia-Pacific | Wuyuefeng Capital |
| Mobilint | Logic Semiconductors | January 2024 | Series B | ≈$15,300,000 | Designs fabless NPUs and AI accelerator chips for edge inference. | Asia-Pacific | Not disclosed |
As this chart shows, and as featured in our semiconductor industry deck, search interest in semiconductors has been rising steadily
Is semiconductor funding really a $34 billion market right now?
Semiconductor funding is worth at least $34.2 billion across the period we studied, but a typical company lives in a much smaller funding market than that headline suggests.
We tracked 374 financings across 309 semiconductor companies. Capital could be quantified for 303 of those deals, representing at least $34.22 billion. The typical disclosed round was roughly $24 million, while the average was close to $113 million.
That huge gap comes from the top of the market. If we remove financings above $100 million, only about $5.0 billion remains. Remove rounds above $50 million and the figure falls to roughly $3.5 billion.
The latest large rounds make the split even clearer. Positron has now raised more than $1.1 billion across the window, Cerebras raised $1.1 billion and then another $1 billion, and Rapidus raised more than $2.6 billion across two financings. These deals are real, but they describe a very different part of the market from a startup raising $15 million or $30 million.
| Market measure | Result |
|---|---|
| Financings | 374 |
| Unique companies | 309 |
| Companies with multiple financings | 55 |
| Deals with quantifiable amounts | 303 |
| Quantifiable capital | ≥$34.22B |
| Capital excluding >$50M rounds | ~$3.51B |
| Capital excluding >$100M rounds | ~$4.98B |
| Typical disclosed round | ~$24M |
How many semiconductor companies are actually getting funded?
The semiconductor funding market currently contains just over 300 companies, and most of them only appear once.
We found 309 unique companies across 374 financings. Of those, 254 had one financing during the period, 47 had two and only eight appeared three times or more.
Repeat fundraising is fairly rare: around 18% of companies came back for another observable financing during the window.
The money is much less evenly divided. Companies that appeared only once raised about $14.0 billion in total, while the 55 repeat fundraisers accumulated roughly $20.2 billion.
A fairly small group of companies therefore keeps returning to the market and collecting increasingly large cheques. That becomes much clearer once we stop treating every financing as if it belonged to a different startup.
This chart, featured in our semiconductor industry deck, looks at TSMC’s strategy in semiconductors
Are a few semiconductor companies swallowing most of the funding?
Yes. Semiconductor funding is heavily concentrated today, with ten companies accounting for roughly 52% of the capital we could quantify.
BOE Integrated leads at about $2.76 billion, followed closely by CXMT at $2.72 billion and Rapidus at $2.64 billion. Cerebras moves into the top group once its latest $1 billion financing is included, bringing its total across the period to roughly $2.1 billion.
Several companies also raised repeatedly. Etched appeared four times, Rebellions four times, Ayar Labs three times and CXMT three times. Positron moved from a $50 million-plus Series A to a $230 million Series B and then to an $875 million Series C.
So the concentration comes from more than isolated blockbuster deals. Capital keeps accumulating around companies that have already persuaded investors to fund them before.
| Company | Financings | Quantifiable capital |
|---|---|---|
| BOE Integrated | 1 | $2.764B |
| CXMT | 3 | $2.717B |
| Rapidus | 2 | $2.643B |
| Cerebras | 2 | $2.100B |
| Hefei Wanxin Integrated Circuit | 2 | $1.766B |
| Etched | 4 | $1.620B |
| Tenstorrent | 2 | $1.580B |
| Positron AI | 2 | $1.105B |
| Ayar Labs | 3 | $805M |
| Rebellions | 4 | $789M |
What can a normal semiconductor startup actually expect to raise?
A normal semiconductor startup raising money these days should think in tens of millions of dollars.
Among the 303 financings where we could establish a usable amount, 48 were below $5 million, 74 were between $5 million and $20 million and 86 landed between $20 million and $50 million.
That $20 million-to-$50 million range was the busiest part of the market. Put the first three brackets together and roughly 69% of disclosed rounds came in below $50 million.
The giant rounds tell a completely different story. Only about a quarter of disclosed financings were $100 million or larger, yet they produced around 86% of all quantifiable capital.
For founders, the practical benchmark is therefore much closer to $10 million, $25 million or $40 million than to the nine-figure rounds that dominate semiconductor news.
In our semiconductor industry deck, we ensure you have the latest information
Why do some semiconductor companies suddenly need hundreds of millions of dollars?
The biggest semiconductor rounds usually appear when a company has to turn a working technology into something that can be manufactured and deployed at serious scale.
Rapidus is the clearest example. The Japanese company secured ¥267.6 billion from the government and private-sector investors as it worked toward 2 nm mass production. A further ¥150 billion government investment followed. Rapidus has explicitly tied that funding to moving from R&D toward full-scale manufacturing.
Ayar Labs raised $500 million in its latest Series E and said the money would help expand high-volume production and test capacity for its co-packaged optics technology. Investors included AMD, Alchip, MediaTek and NVIDIA alongside financial backers.
Etched had raised $800 million by the time it came out of stealth with a working AI chip and more than $1 billion of signed customer contracts. Its latest disclosed $500 million financing arrived as the company moved deeper into commercial hardware production.
Cerebras gives us another useful example. Its recent financings are supporting AI processors, packaging, systems, manufacturing capacity and data-center expansion rather than a small engineering team designing an early prototype.
Once a semiconductor company reaches that point, tape-outs, advanced packaging, wafers, testing, inventory, manufacturing capacity and customer deployment can consume capital extremely quickly.
Which semiconductor sectors are attracting the most money now?
Logic semiconductors are currently the center of the funding market, while foundries and memory require far more capital per deal.
Logic produced 191 financings and about $20.48 billion of quantifiable capital. That is roughly half of all transactions and close to 60% of the money.
AI infrastructure is one reason the category has become so important. Etched, Cerebras, Tenstorrent, Positron and Rebellions are all competing somewhere around AI compute or inference, while Ayar Labs is attacking the interconnect bottleneck that appears when huge numbers of accelerators have to communicate efficiently.
Foundry services looks completely different. We found only ten financings, but they absorbed roughly $7.51 billion. Rapidus alone explains a large part of that figure, although the category remains extremely capital-intensive even without its biggest deal.
Memory shows a similar pattern with 16 transactions and about $3.01 billion. Sensors sit at the opposite end: 39 deals produced only about $455 million, with a median financing below $8 million.
So when someone says "semiconductor funding," they may be grouping together businesses with completely different capital requirements. A sensor startup raising $6 million and a new advanced-node manufacturing project raising $1 billion belong to the same industry, but financially they barely resemble each other.
| Category | Deals | Capital | Median round | Capital intensity |
|---|---|---|---|---|
| Logic | 191 | $20.48B | ~$40M | ~1.17× |
| Analog | 71 | $1.70B | ~$17M | ~0.26× |
| Power | 47 | $1.06B | ~$20M | ~0.25× |
| Sensor | 39 | $455M | ~$8M | ~0.13× |
| Memory | 16 | $3.01B | ~$24M | ~2.06× |
| Foundry services | 10 | $7.51B | ~$337M | ~8.22× |
This chart, featured in our semiconductor industry deck, shows annual funding in semiconductor startups
Are semiconductor investors mostly backing new startups?
Semiconductor investors are currently putting far more money into companies that have already raised before.
We classified 313 of the 374 financings as follow-ons. Only 61 were first financings.
The size difference is large as well. A first financing had a median of about $7.9 million, compared with roughly $27 million for a follow-on.
That fits what we see among many of the companies attracting serious capital now. Positron, Rebellions, Etched and Ayar Labs have all moved through repeated rounds rather than jumping directly into one giant financing.
The semiconductor funding market these days is therefore heavily shaped by companies returning for more money after investors have already seen some technical progress, manufacturing progress or customer validation.
How old are semiconductor startups when investors fund them?
Semiconductor companies usually spend several years building before they reach meaningful funding milestones.
Across the companies where we could establish a founding year, the median age at financing was around four years. Seed companies were typically about two years old, Series A companies four, Series B companies five and Series C companies seven.
By Series D and later, the typical company was around a decade old.
The founding cohorts make the same point from another angle. Companies founded in 2020, 2021 and 2022 generated far more funding observations than companies founded in 2025 or 2026.
That makes sense once we look at what has to happen before a semiconductor product becomes investable at scale. Architecture, tape-outs, silicon validation, software support, manufacturing relationships and customer qualification can take years.
Much of the money flowing into the sector today is financing technology that has already been under development for a long time.
This chart, featured in our semiconductor industry deck, compares the main business model options for fabless semiconductor companies
Where does semiconductor fundraising get really hard?
Semiconductor fundraising gets much tougher after Series B, and Series C is where the financial jump becomes brutal.
We counted 74 Seed financings, 82 Series A rounds and 67 Series B rounds. The market then falls to 43 Series C deals and 22 Series D-or-later financings.
Round size changes much faster than deal count. The median financing moves from about $24 million at Series A to $27.8 million at Series B, then jumps to roughly $135 million at Series C.
That is a different fundraising problem. A company asking investors for $25 million can still be financing product development and market entry. A company asking for $135 million generally needs a much stronger case around manufacturing, customers, deployment and the path to scale.
Alternative labels make the later-stage picture slightly messy. We also identified 28 Growth Equity deals and 58 transactions where the stage could not be established reliably. Semiconductor companies often raise through structures that do not fit the neat Seed-to-Series-E ladder used by software startups.
Even with that caveat, the narrowing is clear. Plenty of semiconductor companies reach A and B rounds; far fewer make the leap into repeated nine-figure financing.
| Stage | Deals | Quantifiable capital | Median round |
|---|---|---|---|
| Seed | 74 | $1.04B | $5.8M |
| Series A | 82 | $3.18B | $24.0M |
| Series B | 67 | $4.14B | $27.8M |
| Series C | 43 | $5.78B | $135M |
| Series D+ | 22 | ~$5.80B | ~$150M |
| Growth Equity | 28 | $8.63B | $63.2M |
| Unknown | 58 | $5.66B | $12.5M |
Do corporate investors really matter in semiconductor funding?
Corporate and strategic investors matter a lot in semiconductor funding, appearing in roughly 38% of the financings we tracked.
Rounds involving an identifiable strategic investor had a median size of roughly $43.5 million, compared with $16.7 million when no strategic investor was identified.
Part of that gap comes from selection. Corporates naturally show up more often around businesses that are already large enough to matter to their supply chains, customers or technology roadmaps.
The names make the relationship easier to understand. Samsung Catalyst Fund, NVIDIA and Bosch Ventures repeatedly appeared in the market, alongside Intel Capital, Microsoft's M12 and Cisco Investments.
Recent deals are particularly revealing. Ayar Labs brought AMD, Alchip, MediaTek and NVIDIA into its $500 million Series E. Rebellions' $250 million Series C included Arm and Samsung Ventures. Positron's Series B brought in Arm and other strategic investors.
For semiconductor startups, that kind of investor can bring much more than money: manufacturing relationships, technical validation, ecosystem access and potential customers can all sit behind the cheque.
This chart, featured in our semiconductor industry deck, shows the revenue mix across customer segments in the semiconductor industry
Which semiconductor investors keep coming back?
The semiconductor investor base is surprisingly fragmented, with only a small number of lead investors appearing repeatedly.
Maverick Silicon was the most recurrent lead in our research, appearing across seven financings. Fidelity Management & Research and imec.xpand each appeared four times, while Innovation Industries, Atreides Management, Seligman Ventures and Matter Venture Partners each appeared three times.
That leaves a very long tail of investors who only led or participated prominently once.
Large semiconductor financings also tend to pull together unusual combinations of capital. Tenstorrent's $693 million-plus Series D, for example, combined financial investors with groups linked to Samsung, LG and Hyundai. Rebellions brought together institutional capital with Arm, Samsung Ventures and Pegatron VC. Rapidus combines private companies with direct Japanese state investment.
The funding ecosystem still depends on venture firms, but later-stage capital increasingly overlaps with industrial strategy, sovereign investment and the semiconductor supply chain itself.
Is China actually dominating semiconductor funding?
China dominates semiconductor deal count, while the United States currently raises slightly more visible capital with barely half as many transactions.
We found 161 Chinese financings worth at least $12.81 billion. The United States produced 86 deals worth roughly $13.90 billion after including Cerebras's latest financing.
That difference is striking. China generated almost twice as many deals, yet the two countries ended up in roughly the same funding range.
The regional picture tells the same story. Asia-Pacific produced well over half of all financings and roughly half of quantifiable capital. North America accounted for about a quarter of transactions but more than 40% of the money.
Japan is the extreme case. Only a handful of Japanese financings appear in the dataset, yet Rapidus alone pushes the country's total into the billions.
Looking only at deal count therefore makes Asia appear much more dominant than it looks when we follow the dollars.
This chart, featured in our semiconductor industry deck, shows how advanced foundry node manufacturing technology has evolved over time
Does Europe have a semiconductor startup problem?
Europe has plenty of semiconductor funding activity. The weak point is the size of the rounds European companies raise.
We counted 66 European financings, around 18% of all transactions, but they generated only about $2.53 billion. That is roughly 7% of the quantifiable capital in the market.
The median European round was about $12 million. North America's median was several times larger.
That gap becomes especially uncomfortable once companies reach the expensive part of semiconductor development. Europe can produce chip-design startups, sensor companies, power-semiconductor businesses and deep-tech research spinouts. Scaling them through manufacturing and large commercial deployment requires much larger pools of capital.
European policymakers clearly see the same problem. The European Chips Act created funding mechanisms aimed specifically at semiconductor startups and scale-ups, and the European Commission's newer Chips Act 2.0 work again emphasizes advanced manufacturing, scale-up financing and stronger links between chip companies and industrial demand.
Europe's current weakness looks much more like a scale-up financing gap than a shortage of semiconductor ideas.
How much should we trust semiconductor funding totals?
Semiconductor funding totals should be treated as documented minimums because disclosure is still patchy and the financing structures are often messy.
We could quantify 303 of 374 financings, or about 81%. The remaining deals included undisclosed amounts, vague descriptions such as "tens of millions," or figures that could only be treated as lower bounds.
Stage information was also unavailable for 58 transactions, while an identifiable lead investor could only be established for roughly 60% of deals.
Semiconductor financing creates extra headaches because many announcements mix equity with government support, loans, grants, capital increases, tranches or other instruments. We only use amounts when the relevant financing component can be established with enough confidence.
We also run cross-market consistency checks before closing the dataset. That final pass caught a $1 billion Cerebras Series H that had been correctly recorded in our adjacent AI-chip research but had not been carried into the semiconductor cohort. We added it before producing the figures in this article.
There will still be financings where public information simply does not support an exact number. Leaving those amounts undisclosed produces a less tidy dataset, but it gives us a more defensible picture of the market.
In our semiconductor industry deck, we identify pain points entrepreneurs should prioritize
What should we actually take away from semiconductor funding?
Semiconductor funding currently looks like a broad startup market sitting underneath a much narrower industrial-scale capital market.
More than 300 companies raised money, so this is clearly bigger than a handful of famous AI-chip startups. At the same time, ten companies captured roughly half of the capital we could quantify.
A normal financing remains in the tens of millions. The spectacular headline totals come from foundries, memory projects and a relatively small group of advanced logic companies raising hundreds of millions or billions.
The market also becomes much harder around Series C. That is where median round size suddenly moves into nine figures and where far fewer companies continue up the ladder.
Logic is currently where breadth and money overlap most strongly, helped by the huge investment cycle around AI compute, inference, networking and optical interconnects. Foundries and memory consume even more capital per deal, while sensors remain a much smaller funding market despite producing plenty of startups.
Strategic investors are woven into the market as well. Semiconductor companies often need manufacturing partners, customers and ecosystem support alongside capital, which helps explain why chipmakers, cloud companies, automotive groups and electronics manufacturers keep appearing in funding rounds.
Geography adds another layer. China produces far more deals than the United States, yet U.S. companies attract roughly comparable or slightly greater disclosed capital. Europe participates meaningfully at the startup level but struggles to match North American scale-up cheques.
And the $34 billion-plus headline needs context. Most companies will never raise anything close to the rounds that create that number.
OUR METHODOLOGY
This analysis tracks semiconductor fundraising activity from January 1, 2024 through September 21, 2026. We researched company and investor announcements, government and regulatory records, reputable financial and industry reporting, and established funding databases, while requiring semiconductors to be central to the company's business at the time of financing.
Each genuinely distinct financing was treated as a separate deal and duplicate reports of the same round were consolidated. Extensions, additional closes and tranches were reviewed individually. When an announced package mixed equity with debt, grants, loans, government support or other instruments, we only used an amount when the relevant financing component could be isolated with reasonable confidence.
Dates, stages, investors, company age, previous financings and use-of-funds information were recorded only when supported by public evidence. We did not infer stages from round size, assign a lead investor simply because one participant looked prominent, estimate completely undisclosed financings or turn descriptions such as "tens of millions" into artificial precision.
We also performed a separate completeness and quality-control pass covering missed financings, date boundaries, duplicate announcements, market eligibility, financing structures and inconsistent tagging across adjacent research. That check added Cerebras's $1 billion Series H after we found that it had already been captured in our AI-chip research but was missing from the semiconductor cohort.
The resulting dataset contains 374 qualifying financings across 309 companies. We could quantify 303 deal amounts, or about 81% of the cohort, so the $34.22 billion capital figure should be read as a documented minimum rather than an estimate of every dollar invested in the market.
Key sources include Rapidus on its ¥267.6 billion financing, Japan's METI on Rapidus investment, Ayar Labs on its $500 million Series E, Etched on its funding and customer contracts, Tenstorrent on its $693 million-plus Series D, Cerebras on its Series G and Series H, Rebellions on its $250 million Series C, Positron AI's financing disclosures, and the European Commission's material on the European Chips Act and Chips Act 2.0.
This chart, featured in our semiconductor industry deck, shows the revenue mix across Europe, Asia, North America, Africa, and South America in the semiconductor industry